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Final version of updated VR conditioner

This commit is contained in:
Josh Stewart 2016-05-07 22:18:49 +10:00
parent 173957a0c9
commit c0a033a3a4
6 changed files with 1944 additions and 188 deletions
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reference/hardware/VR Conditioner/VR Conditioner v2.fzz
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reference/hardware/VR Conditioner/gerbers/VR Conditioner v2_copperBottom.gbl
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@ -551,11 +551,11 @@ D02*
X769Y515D02*
X687Y433D01*
D02*
X870Y490D02*
X844Y514D01*
D02*
X870Y464D02*
X870Y490D01*
D02*
X870Y490D02*
X844Y514D01*
G54D18*
D02*
X869Y364D02*

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reference/hardware/VR Conditioner/gerbers/VR Conditioner v2_pnp.txt
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@ -4,7 +4,7 @@
*eMail=
*
*Project=VR Conditioner v2
*Date=22:53:36
*Date=23:30:08
*CreatedBy=Fritzing 0.9.2b.11.19.8d2d5970658f0bed09c661c9ea9a515b5f40f44c
*
*
@ -13,107 +13,109 @@
*Rotation in degree (0-360, math. pos.)
*
*No;Value;Package;X;Y;Rotation;Side;Name
1;10k;0805 [SMD];4.0589;-16.2511;180;Bottom;R13
2;;;2.3368;-3.6386;0;Bottom;Copper Fill48
3;;;3.66888;-6.72612;0;Bottom;Via3
4;;;22.6808;-9.35918;90;Bottom;TXT3
5;;so08;4.30388;-17.4449;0;Top;IC2
6;;;6.477;-20.0851;0;Bottom;Copper Fill61
7;;;16.3688;-18.7911;0;Bottom;Via14
8;;;3.2004;-7.6518;0;Bottom;Copper Fill16
9;;;14.2748;-8.0455;0;Bottom;Copper Fill53
10;;DIP (Dual Inline) [THT];13.1939;-11.8061;0;Bottom;IC1
11;;;6.84388;-2.91612;0;Bottom;Via12
12;;;12.5589;-2.91612;0;Bottom;Via1
13;;;3.5052;-19.92;0;Bottom;Copper Fill5
14;1nF;0805 [SMD, multilayer];3.03388;-12.8311;90;Bottom;C5
15;;;14.4145;-18.3452;0;Bottom;Copper Fill55
16;;;18.7452;-11.157;0;Bottom;Copper Fill44
17;;;11.2776;-7.22;0;Bottom;Copper Fill19
18;;;12.5349;-11.0808;0;Bottom;Copper Fill56
19;;;1.12888;-23.2361;0;Bottom;Via4
20;220;0805 [SMD];4.5489;-1.6461;180;Top;R2
21;;;8.4582;-6.1151;0;Bottom;Copper Fill34
22;;;18.4404;-15.9576;0;Bottom;Copper Fill10
23;;;6.477;-14.8527;0;Bottom;Copper Fill59
24;;;4.7244;-20.4026;0;Bottom;Copper Fill6
25;10k;0805 [SMD];3.91387;-21.9661;180;Bottom;R9
26;;;2.5654;-23.476;0;Bottom;Copper Fill1
27;0.01µF;0805 [SMD, multilayer];21.0588;-8.6311;0;Bottom;C2
28;10k;0805 [SMD];17.0038;-4.4311;-90;Bottom;R6
29;;;8.0264;-21.952;0;Bottom;Copper Fill3
30;;;22.6568;-21.6726;0;Bottom;Copper Fill2
31;;;13.1939;-21.3311;0;Bottom;Via8
32;;;7.4549;-17.0752;0;Bottom;Copper Fill35
33;;;3.8354;-22.1298;0;Bottom;Copper Fill37
34;;;7.9248;-17.5451;0;Bottom;Copper Fill65
35;;;1.76388;-18.1561;0;Bottom;Via13
36;1k;0805 [SMD];13.8289;-14.5911;-90;Bottom;R3
37;;;4.93888;-3.55112;0;Bottom;Via10
38;;;23.4433;-6.87236;90;Bottom;TXT1
39;;;13.0048;-10.5855;0;Bottom;Copper Fill57
40;;;13.2842;-8.0455;0;Bottom;Copper Fill30
41;10k;0805 [SMD];20.8138;-13.9561;90;Top;R16
42;;;21.7678;-9.9124;0;Bottom;Copper Fill15
43;;;15.9512;-6.2802;0;Bottom;Copper Fill20
44;;;21.7678;-7.3724;0;Bottom;Copper Fill17
45;;;14.6304;-16.6942;0;Bottom;Copper Fill8
46;10k;0805 [SMD];4.6939;-9.2661;180;Bottom;R11
47;;;17.0434;-21.4186;0;Bottom;Copper Fill40
48;;;2.2098;-18.2055;0;Bottom;Copper Fill29
49;;;11.684;-17.9134;0;Bottom;Copper Fill39
50;;;13.6398;-21.3551;0;Bottom;Copper Fill54
51;1µF;0805 [SMD, multilayer];21.0588;-11.1711;0;Bottom;C3
52;;;15.5194;-13.189;0;Bottom;Copper Fill13
53;;;6.1849;-15.602;0;Bottom;Copper Fill58
54;4.7k;THT;15.7339;-3.55111;180;Bottom;R12
55;;;6.3246;-13.1636;0;Bottom;Copper Fill9
56;;;6.6294;-3.791;0;Bottom;Copper Fill49
57;;;6.6802;-1.8606;0;Bottom;Copper Fill26
58;220;0805 [SMD];4.93888;-10.2911;-90;Top;R1
59;;;4.318;-2.6988;0;Bottom;Copper Fill24
60;;;1.2192;-18.2055;0;Bottom;Copper Fill28
61;;;15.4178;-3.1814;0;Bottom;Copper Fill50
62;;;2.1844;-21.4186;0;Bottom;Copper Fill36
63;;;17.018;-9.7854;0;Bottom;Copper Fill46
64;;;7.493;-6.8898;0;Bottom;Copper Fill47
65;;;14.4145;-19.3358;0;Bottom;Copper Fill33
1;;;22.0472;-14.8654;0;Bottom;Copper Fill43
2;;;15.9512;-6.2802;0;Bottom;Copper Fill20
3;10k;0805 [SMD];4.0589;-16.2511;180;Bottom;R13
4;;;18.9992;-15.602;0;Bottom;Copper Fill42
5;;;14.2748;-8.0455;0;Bottom;Copper Fill53
6;;;14.4145;-18.3452;0;Bottom;Copper Fill55
7;;;2.2098;-18.2055;0;Bottom;Copper Fill29
8;;;3.66888;-6.72612;0;Bottom;Via3
9;;;20.32;-11.8428;0;Bottom;Copper Fill12
10;;;22.6808;-9.35918;90;Bottom;TXT3
11;;;13.2842;-8.0455;0;Bottom;Copper Fill30
12;;;18.7452;-11.157;0;Bottom;Copper Fill44
13;;so08;4.30388;-17.4449;0;Top;IC2
14;;;13.1445;-20.8852;0;Bottom;Copper Fill31
15;;;8.4582;-6.1151;0;Bottom;Copper Fill34
16;;;16.3688;-18.7911;0;Bottom;Via14
17;;;12.3698;-4.3244;0;Bottom;Copper Fill23
18;;;7.493;-6.8898;0;Bottom;Copper Fill47
19;;;6.6802;-1.8606;0;Bottom;Copper Fill26
20;;;7.4549;-17.0752;0;Bottom;Copper Fill64
21;;DIP (Dual Inline) [THT];13.1939;-11.8061;0;Bottom;IC1
22;;;6.84388;-2.91612;0;Bottom;Via12
23;;;6.3246;-13.1636;0;Bottom;Copper Fill9
24;;;15.4178;-3.1814;0;Bottom;Copper Fill50
25;;;2.3368;-3.6386;0;Bottom;Copper Fill48
26;;;15.5194;-13.189;0;Bottom;Copper Fill13
27;;;12.5589;-2.91612;0;Bottom;Via1
28;;;13.0048;-10.5855;0;Bottom;Copper Fill57
29;;;14.4145;-19.3358;0;Bottom;Copper Fill33
30;1nF;0805 [SMD, multilayer];3.03388;-12.8311;90;Bottom;C5
31;;;22.1488;-3.5624;0;Bottom;Copper Fill22
32;;;6.477;-20.0851;0;Bottom;Copper Fill61
33;;;6.1849;-20.8344;0;Bottom;Copper Fill60
34;;;1.12888;-23.2361;0;Bottom;Via4
35;220;0805 [SMD];4.5489;-1.6461;180;Top;R2
36;;;20.536;-1.021;0;Bottom;TXT5
37;;;13.8049;-7.5502;0;Bottom;Copper Fill52
38;10k;0805 [SMD];3.91387;-21.9661;180;Bottom;R9
39;0.01µF;0805 [SMD, multilayer];21.0588;-8.6311;0;Bottom;C2
40;10k;0805 [SMD];17.0039;-4.43111;-90;Bottom;R6
41;;;2.5654;-23.476;0;Bottom;Copper Fill1
42;;;13.1939;-21.3311;0;Bottom;Via8
43;;;1.76388;-18.1561;0;Bottom;Via13
44;;;2.7432;-9.9632;0;Bottom;Copper Fill45
45;1k;0805 [SMD];13.8289;-14.5911;-90;Bottom;R3
46;;;4.93888;-3.55112;0;Bottom;Via10
47;;;23.4433;-6.87236;90;Bottom;TXT1
48;;;19.736;-0.964559;0;Bottom;TXT4
49;10k;0805 [SMD];20.8138;-13.9561;90;Top;R16
50;;;3.5052;-19.92;0;Bottom;Copper Fill5
51;10k;0805 [SMD];4.6939;-9.2661;180;Bottom;R11
52;;;7.4549;-17.0752;0;Bottom;Copper Fill35
53;;;18.923;-4.7816;0;Bottom;Copper Fill18
54;1µF;0805 [SMD, multilayer];21.0588;-11.1711;0;Bottom;C3
55;;;6.477;-14.8527;0;Bottom;Copper Fill59
56;4.7k;THT;15.7339;-3.55111;180;Bottom;R12
57;;;7.4549;-18.0658;0;Bottom;Copper Fill63
58;;;3.2004;-7.6518;0;Bottom;Copper Fill16
59;220;0805 [SMD];4.93888;-10.2911;-90;Top;R1
60;;;14.6304;-16.6942;0;Bottom;Copper Fill8
61;;;7.9248;-17.5451;0;Bottom;Copper Fill65
62;;;13.6398;-21.3551;0;Bottom;Copper Fill54
63;;;6.2484;-16.0084;0;Bottom;Copper Fill38
64;;;22.6568;-21.6726;0;Bottom;Copper Fill2
65;;;10.3632;-14.4082;0;Bottom;Copper Fill7
66;;;23.9888;-18.7911;0;Bottom;Via15
67;;;10.3632;-14.4082;0;Bottom;Copper Fill7
67;;;13.6398;-21.3551;0;Bottom;Copper Fill32
68;10k;0805 [SMD];15.4889;-23.2361;180;Bottom;R7
69;;;7.47888;-17.5211;0;Bottom;Via5
70;;;14.5796;-2.902;0;Bottom;Copper Fill25
71;;;12.5589;-10.5361;0;Bottom;Via6
72;;;12.3698;-4.3244;0;Bottom;Copper Fill23
70;;;6.6294;-3.791;0;Bottom;Copper Fill49
71;;;3.6449;-20.8344;0;Bottom;Copper Fill62
72;;;12.5589;-10.5361;0;Bottom;Via6
73;;;2.032;-11.4618;0;Bottom;Copper Fill14
74;1nF;0805 [SMD, multilayer];9.77387;-23.2361;180;Bottom;C4
75;;;18.923;-4.7816;0;Bottom;Copper Fill18
76;;;19.3802;-19.3358;0;Bottom;Copper Fill41
77;;;18.9992;-15.602;0;Bottom;Copper Fill42
78;;;15.6972;-20.682;0;Bottom;Copper Fill4
79;;;1.7145;-18.7008;0;Bottom;Copper Fill27
80;;;13.8049;-7.5502;0;Bottom;Copper Fill52
81;1k;0805 [SMD];21.2039;-16.2511;180;Bottom;R5
82;;;20.32;-11.8428;0;Bottom;Copper Fill12
83;;;3.6449;-20.8344;0;Bottom;Copper Fill62
84;;;2.7432;-9.9632;0;Bottom;Copper Fill45
75;;;17.018;-9.7854;0;Bottom;Copper Fill46
76;;;8.0264;-21.952;0;Bottom;Copper Fill3
77;;;18.4404;-15.9576;0;Bottom;Copper Fill10
78;;;11.684;-17.9134;0;Bottom;Copper Fill39
79;;;17.0434;-21.4186;0;Bottom;Copper Fill40
80;;;6.985;-4.6038;0;Bottom;Copper Fill21
81;;;4.7244;-20.4026;0;Bottom;Copper Fill6
82;;;21.7678;-7.3724;0;Bottom;Copper Fill17
83;1k;0805 [SMD];21.2039;-16.2511;180;Bottom;R5
84;;;3.8354;-22.1298;0;Bottom;Copper Fill37
85;;;6.20888;-6.72612;0;Bottom;Via2
86;;;6.2484;-16.0084;0;Bottom;Copper Fill38
87;;;14.4639;-18.7911;0;Bottom;Via16
88;;;13.6398;-21.3551;0;Bottom;Copper Fill32
89;;;13.1445;-20.8852;0;Bottom;Copper Fill31
90;;;21.8702;-9.95259;90;Bottom;TXT2
91;;;7.4549;-18.0658;0;Bottom;Copper Fill63
92;;;1.5494;-14.9924;0;Bottom;Copper Fill11
93;;;13.8289;-7.99612;0;Bottom;Via9
94;0.1µF;0805 [SMD, multilayer];21.0588;-6.0911;0;Bottom;C1
95;;QSOP16;5.42149;-4.17341;0;Bottom;MAX9926
96;;;22.1488;-3.5624;0;Bottom;Copper Fill22
97;10k;0805 [SMD];21.8389;-16.8861;0;Top;R15
98;;;7.4549;-17.0752;0;Bottom;Copper Fill64
99;10k;0805 [SMD];14.4639;-4.5761;90;Bottom;R4
100;;;6.1849;-20.8344;0;Bottom;Copper Fill60
86;;;14.4639;-18.7911;0;Bottom;Via16
87;;;14.5796;-2.902;0;Bottom;Copper Fill25
88;;;1.5494;-14.9924;0;Bottom;Copper Fill11
89;;;2.1844;-21.4186;0;Bottom;Copper Fill36
90;;;21.8702;-9.95258;90;Bottom;TXT2
91;;;4.318;-2.6988;0;Bottom;Copper Fill24
92;;;13.8289;-7.99612;0;Bottom;Via9
93;0.1µF;0805 [SMD, multilayer];21.0588;-6.0911;0;Bottom;C1
94;;QSOP16;5.42149;-4.17341;0;Bottom;MAX9926
95;10k;0805 [SMD];21.8389;-16.8861;0;Top;R15
96;10k;0805 [SMD];14.4639;-4.5761;90;Bottom;R4
97;;;21.7678;-9.9124;0;Bottom;Copper Fill15
98;;;15.6972;-20.682;0;Bottom;Copper Fill4
99;;;6.1849;-15.602;0;Bottom;Copper Fill58
100;;;12.5349;-11.0808;0;Bottom;Copper Fill56
101;;;16.0528;-10.5855;0;Bottom;Copper Fill51
102;;;6.985;-4.6038;0;Bottom;Copper Fill21
103;4.7k;THT;15.7339;-20.6961;180;Bottom;R10
104;;;22.0472;-14.8654;0;Bottom;Copper Fill43
102;4.7k;THT;15.7339;-20.6961;180;Bottom;R10
103;;;11.2776;-7.22;0;Bottom;Copper Fill19
104;;;19.3802;-19.3358;0;Bottom;Copper Fill41
105;;;1.7145;-18.7008;0;Bottom;Copper Fill27
106;;;1.2192;-18.2055;0;Bottom;Copper Fill28

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reference/hardware/VR Conditioner/gerbers/VR Conditioner v2_silkBottom.gbo
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reference/hardware/VR Conditioner/gerbers/VR Conditioner v2_silkTop.gto
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reference/hardware/VR Conditioner/gerbers/VR Conditioner-v0.2.zip
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