kicad6-libraries/TE_2305018-2.kicad_mod

108 lines
7.9 KiB
Plaintext

(footprint "TE_2305018-2" (version 20221018) (generator pcbnew)
(layer "F.Cu")
(attr smd)
(fp_text reference "REF**" (at -2.973105 -5.666129) (layer "F.SilkS")
(effects (font (size 0.641101 0.641101) (thickness 0.15)))
(tstamp b1f534ff-b47f-440a-8880-2a3cdf8d1a05)
)
(fp_text value "TE_2305018-2" (at -0.123382 4.850714) (layer "F.Fab")
(effects (font (size 0.640939 0.640939) (thickness 0.15)))
(tstamp d757de4b-7b4b-434f-871c-dc97f3f95f8a)
)
(fp_line (start -4.925 -4.45) (end 4.925 -4.45)
(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 9bedc2e3-3d26-4ee7-ab06-d5bbd3b89c13))
(fp_line (start -4.925 -4.30938) (end -4.925 -4.45)
(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 6115e792-8638-4061-8b89-315436f5549f))
(fp_line (start -4.925 -1.23125) (end -4.925 -2.15469)
(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 391a18c4-0322-4119-af20-66fb9bddde01))
(fp_line (start 4.925 -4.30938) (end 4.925 -4.45)
(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 28c28139-80ee-4eea-98c9-9a8bcc3eb819))
(fp_line (start 4.925 -1.23125) (end 4.925 -2.15469)
(stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp e075d75e-81e4-4018-94f3-54c101e03f30))
(fp_circle (center -3.085 -4.907) (end -2.985 -4.907)
(stroke (width 0.2) (type solid)) (fill none) (layer "F.SilkS") (tstamp ae5c836d-c1ec-445d-9e35-0019fb0fe421))
(fp_line (start 4.925 1.4) (end -4.925 1.4)
(stroke (width 0.127) (type solid)) (layer "Cmts.User") (tstamp 4ece3a81-f593-4116-8d31-72f3118c16a7))
(fp_line (start -5.175 -4.7) (end 5.175 -4.7)
(stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp f609303f-800b-4230-b0b0-77283b49d90f))
(fp_line (start -5.175 4.45) (end -5.175 -4.7)
(stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 38ccd57c-f5dc-4487-a215-966ad772cd1c))
(fp_line (start 5.175 -4.7) (end 5.175 4.45)
(stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 9815994e-e43a-47af-9cdc-e0e2432cb8f7))
(fp_line (start 5.175 4.45) (end -5.175 4.45)
(stroke (width 0.05) (type solid)) (layer "F.CrtYd") (tstamp 17db55b1-2a27-42cc-b98d-62b36ee976e6))
(fp_line (start -4.925 -4.45) (end 4.925 -4.45)
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp e6d1db30-b1a6-4c2a-a2a8-0c27958e1579))
(fp_line (start -4.925 4.2) (end -4.925 -4.45)
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp e66e7f10-cfa6-4d17-b2a8-4da60590fa86))
(fp_line (start -4.925 4.2) (end 4.925 4.2)
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 9c2b5a09-ab6c-46c1-b7ac-820170c72598))
(fp_line (start 4.925 -4.45) (end 4.925 4.2)
(stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 3527d3c1-60fc-4f7a-87df-2b44fec7241c))
(pad "A1" smd rect (at -3.05 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 7ab2b506-7f96-48bc-a6e3-0d599fb8c2c1))
(pad "A2" smd rect (at -2.25 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 9f5a8a2d-e807-4046-a295-132b71a7964a))
(pad "A3" smd rect (at -1.75 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 9e304340-3fc2-4530-adce-ff184e90d47a))
(pad "A4" smd rect (at -1.25 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 9e5a9dee-bb25-4b33-8a59-4390ab183db1))
(pad "A5" smd rect (at -0.75 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 20c064ed-13ba-412b-ab14-614d045dc562))
(pad "A6" smd rect (at -0.25 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp f205d41f-d396-4db0-be67-e3bcef1def22))
(pad "A7" smd rect (at 0.25 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 18e79a81-0465-46a6-b9eb-bfbda1d1d1eb))
(pad "A8" smd rect (at 0.75 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 62fde744-cf38-43dd-b8b5-b2c68745984d))
(pad "A9" smd rect (at 1.25 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 36aa788d-c271-4cc3-91aa-015d28c4e0dc))
(pad "A10" smd rect (at 1.75 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 2101c7ca-5824-4a84-be80-c37f8c9b89d6))
(pad "A11" smd rect (at 2.25 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp ca414c12-cd98-41dc-a5a1-4335bbc49eab))
(pad "A12" smd rect (at 3.05 -3.375) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp fe354589-2b4b-423c-939d-ae4ea535a356))
(pad "B1" smd rect (at 3 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp a6877274-ca6f-47c2-ba5b-64f3fe1a1d10))
(pad "B2" smd rect (at 2.5 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 4155e48a-f711-4a73-a81c-e8f8a28d5317))
(pad "B3" smd rect (at 2 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp bd9879d6-493f-4ba4-b49b-0b493ab2de22))
(pad "B4" smd rect (at 1.5 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 7aa4e971-c44c-443f-bc7f-0e94a5b980e9))
(pad "B5" smd rect (at 1 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp caf5828f-4db5-46db-9492-2de50a3bfebf))
(pad "B6" smd rect (at 0.5 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 1c0475a5-bae0-46cf-916e-3fa09c2595fb))
(pad "B7" smd rect (at -0.5 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp ce2b65a5-0375-4159-a034-1f754aa1a477))
(pad "B8" smd rect (at -1 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 74683585-1344-46a3-86b0-062cdd28bc58))
(pad "B9" smd rect (at -1.5 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 104e30ed-e6b5-49e0-b18b-f4039ace24b8))
(pad "B10" smd rect (at -2 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp b1f4c10e-eacb-4dab-beed-da386a929715))
(pad "B11" smd rect (at -2.5 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 4bd8ccc2-019a-421e-ad2b-d1001f75b125))
(pad "B12" smd rect (at -3 -2.125) (size 0.25 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 1316f7bf-5c05-4029-b60a-c1c74babcfeb))
(pad "G1" smd rect (at -3.55 -3.375) (size 0.3 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp 1032d9dc-b26e-4e85-b3a7-cfe93f2f5c6b))
(pad "G2" smd rect (at 3.55 -3.375) (size 0.3 0.75) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.102) (tstamp a3d985c0-e70a-469f-816e-39b70451e6a7))
(pad "S1" thru_hole oval (at -4.45 0) (size 1.025 2.05) (drill oval 0.45 1.65) (layers "*.Cu" "*.Mask")
(solder_mask_margin 0.102) (tstamp f2728089-5f94-4f33-825e-35e5a4c9cd7b))
(pad "S2" thru_hole oval (at 4.45 0) (size 1.025 2.05) (drill oval 0.45 1.65) (layers "*.Cu" "*.Mask")
(solder_mask_margin 0.102) (tstamp 602af0d1-8f26-471d-9b78-8c37a1db0397))
(pad "S3" thru_hole oval (at -4.45 -3.2) (size 0.925 1.85) (drill oval 0.45 1.45) (layers "*.Cu" "*.Mask")
(solder_mask_margin 0.102) (tstamp d703b271-0aaf-4716-a77f-07aca2bc6e4e))
(pad "S4" thru_hole oval (at 4.45 -3.2) (size 0.925 1.85) (drill oval 0.45 1.45) (layers "*.Cu" "*.Mask")
(solder_mask_margin 0.102) (tstamp c59c2d3e-8f66-4df2-8dd2-259ef22c8b32))
(model "${KIPRJMOD}/kicad6-libraries/TE_2305018-2.step"
(offset (xyz 0 -3 1.5))
(scale (xyz 1 1 1))
(rotate (xyz -90 0 0))
)
)