rusefi/hardware/DPAK2_breakout/DPAK2_breakout.kicad_pcb

668 lines
39 KiB
Plaintext

(kicad_pcb (version 3) (host pcbnew "(2013-07-07 BZR 4022)-stable")
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(no_connects 0)
(area 200.225429 155.709477 231.089201 180.234166)
(thickness 1.6)
(drawings 13)
(tracks 188)
(zones 0)
(modules 6)
(nets 5)
)
(page A)
(title_block
(title "DDPAK breakout")
(rev R0.1)
(company rusEFI)
)
(layers
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(0 B.Cu signal)
(16 B.Adhes user)
(17 F.Adhes user)
(18 B.Paste user)
(19 F.Paste user)
(20 B.SilkS user)
(21 F.SilkS user)
(22 B.Mask user)
(23 F.Mask user)
(24 Dwgs.User user)
(25 Cmts.User user)
(26 Eco1.User user)
(27 Eco2.User user)
(28 Edge.Cuts user)
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(net 4 /SIG2)
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(trace_width 0.3048)
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(uvia_drill 0.127)
)
(module SM0805_jumper (layer F.Cu) (tedit 53B680BA) (tstamp 544A797B)
(at 221.742 176.784 180)
(path /54499D02)
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(module DPAK2 (layer F.Cu) (tedit 5449A3A9) (tstamp 5449C06D)
(at 212.09 168.91)
(descr "MOS boitier DPACK G-D-S")
(tags "CMD DPACK")
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)
(module AK300-2 (layer F.Cu) (tedit 544A157D) (tstamp 544A2601)
(at 222.25 166.878 270)
(descr CONNECTOR)
(tags CONNECTOR)
(path /5449A1BA)
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)
(pad 2 thru_hole oval (at 2.4892 0 270) (size 1.9812 3.9624) (drill 1.3208)
(layers *.Cu F.Paste F.SilkS F.Mask)
(net 1 /GND)
)
)
(module SM2010 (layer F.Cu) (tedit 544A1B10) (tstamp 5449C04A)
(at 212.09 172.212)
(tags "CMS SM")
(path /54499C42)
(attr smd)
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)
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)
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(layers F.Cu F.Paste F.Mask)
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)
(model smd\chip_smd_pol_wide.wrl
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(rotate (xyz 0 0 0))
)
)
(module SIL-1 (layer F.Cu) (tedit 544A1D71) (tstamp 544A798F)
(at 216.916 172.72)
(descr "Connecteurs 1 pin")
(tags "CONN DEV")
(path /544A1CD8)
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)
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(pad 1 thru_hole rect (at 0 0) (size 1.397 1.397) (drill 0.8128)
(layers *.Cu *.Mask F.SilkS)
(net 1 /GND)
)
)
(module SIL-1 (layer F.Cu) (tedit 544A1F68) (tstamp 544A7985)
(at 223.266 173.736 180)
(descr "Connecteurs 1 pin")
(tags "CONN DEV")
(path /544A1CBF)
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(net 3 /SIG)
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