diff --git a/modules/knock/0.2/knock.kicad_mod b/modules/knock/0.2/knock.kicad_mod
index a101375..dee90f5 100644
--- a/modules/knock/0.2/knock.kicad_mod
+++ b/modules/knock/0.2/knock.kicad_mod
@@ -1,53 +1,53 @@
 (footprint "knock" (version 20211014) (generator pcbnew)
   (layer "F.Cu")
   (tedit 0)
-  (fp_text reference "Designator4" (at -0.1998 -3.9382 unlocked) (layer "F.SilkS")
+  (fp_text reference "Designator4" (at -0.0998 -4.0382 unlocked) (layer "F.SilkS")
     (effects (font (size 0.6 0.6) (thickness 0.254)) (justify left bottom))
     (tstamp 57e1ebbb-bf71-4a6a-806c-5c416640b476)
   )
-  (fp_text value "Comment" (at 0.82 0.86 unlocked) (layer "F.SilkS") hide
+  (fp_text value "Comment" (at 0.92 0.76 unlocked) (layer "F.SilkS") hide
     (effects (font (size 0.6 0.6) (thickness 0.254)) (justify left bottom))
     (tstamp bcc0c495-50f6-49ac-8a1d-d9d476c22024)
   )
-  (fp_line (start 0 0) (end 9.1 0) (layer "B.SilkS") (width 0.2) (tstamp 10b70e57-76b6-4415-b6af-30b3c6b5e53e))
-  (fp_line (start 0 -3.100003) (end 9.1 -3.100003) (layer "B.SilkS") (width 0.2) (tstamp 233b9670-7877-4ac2-a2d1-7e133e2b2745))
-  (fp_line (start 0 0) (end 0 -1.000002) (layer "B.SilkS") (width 0.2) (tstamp 71c6ed0d-b5d5-4ff9-a781-c23fd3b11dcb))
-  (fp_line (start 0 0) (end 0 -1.000002) (layer "F.SilkS") (width 0.2) (tstamp 1a2ce619-0aa1-483e-bed0-469be2c15323))
-  (fp_line (start 0 0) (end 9.1 0) (layer "F.SilkS") (width 0.2) (tstamp 1eb68874-c93a-49cb-af88-a1d860c899fc))
-  (fp_line (start 0 -3.100003) (end 9.1 -3.100003) (layer "F.SilkS") (width 0.2) (tstamp c988c67c-3319-4eca-b2ff-8f91a556790f))
-  (pad "E1" thru_hole circle (at 8.9 -2.5 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
+  (fp_line (start 0.1 -0.1) (end 9.2 -0.1) (layer "B.SilkS") (width 0.2) (tstamp 10b70e57-76b6-4415-b6af-30b3c6b5e53e))
+  (fp_line (start 0.1 -3.200003) (end 9.2 -3.200003) (layer "B.SilkS") (width 0.2) (tstamp 233b9670-7877-4ac2-a2d1-7e133e2b2745))
+  (fp_line (start 0.1 -0.1) (end 0.1 -1.100002) (layer "B.SilkS") (width 0.2) (tstamp 71c6ed0d-b5d5-4ff9-a781-c23fd3b11dcb))
+  (fp_line (start 0.1 -0.1) (end 0.1 -1.100002) (layer "F.SilkS") (width 0.2) (tstamp 1a2ce619-0aa1-483e-bed0-469be2c15323))
+  (fp_line (start 0.1 -0.1) (end 9.2 -0.1) (layer "F.SilkS") (width 0.2) (tstamp 1eb68874-c93a-49cb-af88-a1d860c899fc))
+  (fp_line (start 0.1 -3.200003) (end 9.2 -3.200003) (layer "F.SilkS") (width 0.2) (tstamp c988c67c-3319-4eca-b2ff-8f91a556790f))
+  (pad "E1" thru_hole circle (at 9 -2.6 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
     (solder_paste_margin -50) (tstamp f27224ff-15fe-4455-b342-08f92639682d))
-  (pad "E2" smd oval (at 4.55 0 270) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask")
+  (pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 07da61f7-ec5e-4e06-9f8d-18bf698462d5))
-  (pad "E2" smd oval (at 0 -0.525 180) (size 0.2 1.225) (layers "In1.Cu")
+  (pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "In1.Cu")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 1a5fd7de-d643-4bce-b0e2-d9faf87c973a))
   (pad "E2" smd oval (at 4.55 -3.1 90) (size 0.2 9.3) (layers "In2.Cu")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 2470fcfb-973a-4fec-a7e9-690765a69cdd))
-  (pad "E2" smd oval (at 0 -0.525 180) (size 0.2 1.225) (layers "F.Cu" "F.Paste" "F.Mask")
+  (pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "F.Cu" "F.Paste" "F.Mask")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 41073975-5da9-485c-82ce-614d7a6f26a3))
   (pad "E2" smd oval (at 0 -0.525 180) (size 0.2 1.225) (layers "In2.Cu")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 62183a89-42dd-4da5-9394-7fc246c9f3a1))
-  (pad "E2" thru_hole circle (at 8.9 -1.55 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
+  (pad "E2" thru_hole circle (at 9 -1.65 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
     (solder_paste_margin -50) (tstamp 852c95bd-1fd0-44d8-869f-06e5d704be25))
   (pad "E2" smd oval (at 4.55 0 270) (size 0.2 9.3) (layers "In2.Cu")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp b10d22dc-57f4-4677-a90c-e733fd7cbe5e))
-  (pad "E2" smd oval (at 0 -0.525 180) (size 0.2 1.225) (layers "B.Cu" "B.Paste" "B.Mask")
+  (pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "B.Cu" "B.Paste" "B.Mask")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp b8b2432a-9cd1-4541-be5a-470c2e639315))
-  (pad "E2" smd oval (at 4.55 0 270) (size 0.2 9.3) (layers "In1.Cu")
+  (pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "In1.Cu")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp bccd09db-6a9f-4c5f-bf15-f656bee8dcc4))
-  (pad "E2" smd oval (at 4.55 -3.1 90) (size 0.2 9.3) (layers "In1.Cu")
+  (pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "In1.Cu")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp dad00cd9-cb9d-4016-a062-e9af56e70e34))
-  (pad "E2" smd oval (at 4.55 -3.1 90) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask")
+  (pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp eee72f69-d854-4b55-9b81-df798270a654))
-  (pad "E2" smd oval (at 4.55 -3.1 90) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask")
+  (pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp fa57e211-030c-403d-b255-046971181142))
-  (pad "E2" smd oval (at 4.55 0 270) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask")
+  (pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask")
     (solder_mask_margin -1) (solder_paste_margin -50) (tstamp fe332e46-f490-486d-97d9-1a646b0a6a43))
-  (pad "E3" thru_hole circle (at 8.9 -0.600002 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
+  (pad "E3" thru_hole circle (at 9 -0.700002 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
     (solder_paste_margin -50) (tstamp 0009356c-562a-4ac7-9a87-db0026153a20))
-  (pad "W1" thru_hole circle (at 0.2 -1.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
+  (pad "W1" thru_hole circle (at 0.3 -1.7) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
     (solder_paste_margin -50) (tstamp 9a2933df-b02d-4a67-aa9b-ad4baa7b3d86))
-  (pad "W2" thru_hole circle (at 0.2 -2.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
+  (pad "W2" thru_hole circle (at 0.3 -2.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
     (solder_paste_margin -50) (tstamp b835d54d-4930-4397-88b6-3fe867514a47))
   (zone (net 0) (net_name "") (layers *.Cu) (tstamp ded0861b-4ac0-4f71-944b-0cd41db4b141) (hatch edge 0.508)
     (connect_pads (clearance 0))
@@ -56,10 +56,10 @@
     (fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
     (polygon
       (pts
-        (xy 9.1 0)
-        (xy 0 0)
-        (xy 0 -3.100003)
-        (xy 9.1 -3.100003)
+        (xy 9.2 -0.1)
+        (xy 0.1 -0.1)
+        (xy 0.1 -3.200003)
+        (xy 9.2 -3.200003)
       )
     )
   )