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https://github.com/andreika-git/hellen-one/issues/64

This commit is contained in:
Andrei 2021-05-29 10:42:32 +03:00
parent 0e14a49af2
commit 06d1f56808
6 changed files with 6 additions and 6 deletions
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2
modules/input/0.1/input.kicad_mod
View File

@ -193,7 +193,7 @@
(solder_paste_margin -50) (tstamp 75b6dcca-25d2-4dd9-80d5-cd6f42348044))
(pad "S26" smd roundrect (at 6.575 -0.364998) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (tstamp 3ca70dca-c51f-410d-ac95-554cbe8e4f8c))
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 5ce533b5-890a-4e02-a1c3-cb49ad478d88) (hatch edge 0.2)
(zone (net 0) (net_name "") (layers "F.Cu" "In1.Cu" "In2.Cu") (tstamp 5ce533b5-890a-4e02-a1c3-cb49ad478d88) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254) (filled_areas_thickness no)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))

2
modules/mcu/0.1/mcu.kicad_mod
View File

@ -269,7 +269,7 @@
(solder_paste_margin -50) (tstamp 6491048b-71b0-4763-9b06-9f8cb6714336))
(pad "W10" smd roundrect (at 0.475 -36.520011 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (tstamp f45c7dbb-21ac-4f2c-8169-d997adade114))
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp c2191bb6-badc-45f5-b187-deeb836409c0) (hatch edge 0.2)
(zone (net 0) (net_name "") (layers "F.Cu" "In1.Cu" "In2.Cu") (tstamp c2191bb6-badc-45f5-b187-deeb836409c0) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254) (filled_areas_thickness no)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))

2
modules/mcu/0.2/mcu.kicad_mod
View File

@ -269,7 +269,7 @@
(solder_paste_margin -50) (tstamp 6491048b-71b0-4763-9b06-9f8cb6714336))
(pad "W10" smd roundrect (at 0.475 -36.520011 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (tstamp f45c7dbb-21ac-4f2c-8169-d997adade114))
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp c2191bb6-badc-45f5-b187-deeb836409c0) (hatch edge 0.2)
(zone (net 0) (net_name "") (layers "F.Cu" "In1.Cu" "In2.Cu") (tstamp c2191bb6-badc-45f5-b187-deeb836409c0) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254) (filled_areas_thickness no)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))

2
modules/output/0.1/output.kicad_mod
View File

@ -177,7 +177,7 @@
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp cc1058b1-b958-4fdb-a3d9-e7ddfccfad80))
(pad "W40" smd oval (at 0.271544 -40.938714 90) (locked) (size 0.2 0.399999) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 56d17e5f-96aa-40a6-bc9f-ff7a964681a1))
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 4c047976-992b-4d73-8292-bdc372d89038) (hatch edge 0.2)
(zone (net 0) (net_name "") (layers "F.Cu" "In1.Cu" "In2.Cu") (tstamp 4c047976-992b-4d73-8292-bdc372d89038) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))

2
modules/output/0.2/output.kicad_mod
View File

@ -177,7 +177,7 @@
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp cc1058b1-b958-4fdb-a3d9-e7ddfccfad80))
(pad "W40" smd oval (at 0.271544 -40.938714 90) (locked) (size 0.2 0.399999) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 56d17e5f-96aa-40a6-bc9f-ff7a964681a1))
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 4c047976-992b-4d73-8292-bdc372d89038) (hatch edge 0.2)
(zone (net 0) (net_name "") (layers "F.Cu" "In1.Cu" "In2.Cu") (tstamp 4c047976-992b-4d73-8292-bdc372d89038) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))

2
modules/stlink/0.1/stlink.kicad_mod
View File

@ -60,7 +60,7 @@
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 8e6f209f-07a3-409d-877a-0bf500570c27))
(pad "N6" smd roundrect (at 6.225002 -0.399994 180) (locked) (size 0.25 0.499999) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 33da308b-a387-41a8-8e5a-48353b3b170e))
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp fe8e47a3-c22f-483a-b9c9-ad70102515af) (hatch edge 0.2)
(zone (net 0) (net_name "") (layers "F.Cu" "In1.Cu" "In2.Cu") (tstamp fe8e47a3-c22f-483a-b9c9-ad70102515af) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))