mcu-0.3 mcu.kicad_mod

This commit is contained in:
Andrei 2021-06-23 21:20:09 +03:00
parent 28e0fae3a0
commit 158211cf98
1 changed files with 377 additions and 0 deletions

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(footprint "module-mcu-0.3" locked (layer "F.Cu")
(tedit 0) (tstamp 41980900-49c4-4aa0-8b48-085767968244)
(at 125.2636 123.6786)
(zone_connect 2)
(fp_text reference "M" (at 0.254 -38.1254 unlocked) (layer "F.SilkS") hide
(effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
(tstamp 4259e041-dea3-4e3a-9cc7-d2d5550e7c49)
)
(fp_text value "Module-mcu-0.3" (at -37.350619 2.2987 unlocked) (layer "F.SilkS") hide
(effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
(tstamp 6ecff74c-45f8-4cef-81b0-f782eda7c9f6)
)
(fp_line (start 0.099997 -36.762362) (end 0.587634 -37.25) (layer "B.SilkS") (width 0.2) (tstamp 0a84e191-ec04-4ee1-bb14-a4eb859f2b19))
(fp_line (start 0.669089 -0.100988) (end 46.081775 -0.100993) (layer "B.SilkS") (width 0.2) (tstamp 42f8d975-7cb6-4de4-962f-d50cd650a703))
(fp_line (start 0.587634 -37.25) (end 43.975002 -37.25) (layer "B.SilkS") (width 0.2) (tstamp 45f32d8e-43d7-4baa-8b04-7eff99038c5a))
(fp_line (start 43.975002 -37.25) (end 44.675 -36.55) (layer "B.SilkS") (width 0.2) (tstamp 5014ec5f-032d-420c-aabe-8a5b8bde3412))
(fp_line (start 0.099997 -36.762362) (end 0.1 -0.670077) (layer "B.SilkS") (width 0.2) (tstamp 69080dd4-23d8-44a1-9def-b0ca1d77c068))
(fp_line (start 46.081775 -0.100993) (end 46.42421 -0.443428) (layer "B.SilkS") (width 0.2) (tstamp 6f1dbc9e-ec34-4169-bb84-84a8e5abee5f))
(fp_line (start 44.675 -36.55) (end 46.200002 -36.55) (layer "B.SilkS") (width 0.2) (tstamp 90a20f52-6e50-489c-806b-911cb10d825e))
(fp_line (start 46.200002 -36.55) (end 46.424202 -36.3258) (layer "B.SilkS") (width 0.2) (tstamp c32006ee-864b-403b-98a7-35193db52fe0))
(fp_line (start 46.424202 -36.3258) (end 46.42421 -0.443428) (layer "B.SilkS") (width 0.2) (tstamp d91ef38f-7d51-483c-b63e-792ba4c8ae91))
(fp_line (start 0.1 -0.670077) (end 0.669089 -0.100988) (layer "B.SilkS") (width 0.2) (tstamp eddc3d08-f549-4929-9ecb-fa335ec084db))
(fp_line (start 46.212496 -36.55) (end 46.425 -36.337497) (layer "F.SilkS") (width 0.2) (tstamp 1a2314cc-e78a-41c1-9973-5c369c8548e0))
(fp_line (start 0.096388 -36.743229) (end 0.610405 -37.257246) (layer "F.SilkS") (width 0.2) (tstamp 23bda861-2441-4c6a-8529-7e3ccb9115d6))
(fp_line (start 46.083314 -0.100988) (end 46.425002 -0.442676) (layer "F.SilkS") (width 0.2) (tstamp 4390303c-5a0f-4e59-860b-46683cd348b1))
(fp_line (start 0.672259 -0.100988) (end 46.083314 -0.100988) (layer "F.SilkS") (width 0.2) (tstamp 62967411-a682-4cfe-a744-f7cbbd2c61fc))
(fp_line (start 44.674998 -36.55) (end 46.212496 -36.55) (layer "F.SilkS") (width 0.2) (tstamp 7ff8bdfb-3f56-4583-a8f9-4b86de6932ba))
(fp_line (start 0.096388 -36.743229) (end 0.09639 -0.676857) (layer "F.SilkS") (width 0.2) (tstamp 83a2b098-b047-466e-a7c4-aee3405a799b))
(fp_line (start 0.09639 -0.676857) (end 0.672259 -0.100988) (layer "F.SilkS") (width 0.2) (tstamp 973cf353-5dd5-4c48-b9e2-b85fc18ac683))
(fp_line (start 43.967753 -37.257246) (end 44.674998 -36.55) (layer "F.SilkS") (width 0.2) (tstamp ae87de7e-f2c2-42fa-8f23-9fdbd7ea1e2c))
(fp_line (start 46.425 -36.337497) (end 46.425002 -0.442676) (layer "F.SilkS") (width 0.2) (tstamp b5b9a2c6-adc2-4b2e-8056-e93ef5020a93))
(fp_line (start 0.610405 -37.257246) (end 43.967753 -37.257246) (layer "F.SilkS") (width 0.2) (tstamp c833c1f1-67fd-4809-94e3-7f88e8e7c570))
(pad "E1" smd roundrect locked (at 46.001998 -32.324998 90) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp e345c752-0ccb-474b-a673-480c20440fcd))
(pad "E2" smd roundrect locked (at 46.001998 -31.665 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp d7202625-c805-4895-85dc-75db75caff87))
(pad "E3" smd roundrect locked (at 46.001998 -31.004995 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 2e0477c3-6540-4e4d-96a8-cac7320f0e37))
(pad "E4" smd roundrect locked (at 46.001998 -30.345 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 0db5db3c-3687-47a0-b41c-51349d406d0a))
(pad "E5" smd roundrect locked (at 46.001998 -29.684998 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 6b2d57a7-0ae1-4509-9b8a-8431f0842c0c))
(pad "E6" smd roundrect locked (at 46.001998 -26.384997 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 16798e74-73ea-47c4-afe8-47572f4a46d4))
(pad "E7" smd roundrect locked (at 46.001998 -25.724996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 15b58114-02a8-4fb5-b38a-a63539818684))
(pad "E8" smd roundrect locked (at 46.001998 -25.064994 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp e6e8e45c-4db3-4c74-85e0-b0745ce33ee3))
(pad "E9" smd roundrect locked (at 46.001998 -24.404996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 621470c2-08bf-4ecc-ba7e-ad7ff5446de8))
(pad "E10" smd roundrect locked (at 46.001998 -23.744994 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 62868718-5fae-4204-a8f7-ff5404a875d6))
(pad "E11" smd roundrect locked (at 46.001998 -23.084996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 895a2ba1-4c35-460c-aa68-be5dc8ee451c))
(pad "E12" smd roundrect locked (at 46.001998 -22.424995 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp c0c7f84a-a0ae-4a48-abd6-44934ce41378))
(pad "E13" smd roundrect locked (at 46.001998 -21.764996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp a3dd1123-5bdc-4598-b131-5daf1c609927))
(pad "E14" smd roundrect locked (at 46.001998 -21.104995 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 9b3407c1-8f99-4c3f-860f-db57fe193020))
(pad "E15" smd roundrect locked (at 46.001998 -20.444996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 3e18f0ca-0de0-4508-aace-7afa338c25c6))
(pad "E16" smd roundrect locked (at 46.001998 -19.784995 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 0f31857b-ecca-49ce-8b03-14a41d9629a9))
(pad "E17" smd roundrect locked (at 46.001998 -19.124996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 5d31c418-ac1a-4f47-9c92-d7b8fe316e89))
(pad "E18" smd roundrect locked (at 46.001998 -18.464995 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp f97bcfb7-8ad8-432c-9e71-5699a2f2a836))
(pad "E19" smd roundrect locked (at 46.001998 -17.804996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 8350a55b-5610-4ccf-a45e-8eb6f7ac614a))
(pad "E20" smd roundrect locked (at 46.001998 -17.144995 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 18b113c9-77a5-48de-890a-4f9f1352f32a))
(pad "E21" smd roundrect locked (at 46.001998 -16.484996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 7f3f9af4-7c28-4601-8828-9f541520ce00))
(pad "E22" smd roundrect locked (at 46.001998 -15.824995 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 66d05549-2ef2-450b-9a7b-ff5732fa5306))
(pad "E23" smd roundrect locked (at 46.001998 -15.164996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp ac7cd5a3-228e-4cc3-ac1c-497bd10ebe6c))
(pad "E24" smd roundrect locked (at 46.001998 -14.504995 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp bb92fb52-0c1b-400a-b75f-ee9ac62a5b8c))
(pad "E25" smd roundrect locked (at 46.001998 -13.844996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp cfe6626a-6704-4ab0-9a7c-6cc139aee92c))
(pad "E26" smd roundrect locked (at 46.001998 -13.184995 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 01addb9e-d5e5-46cb-a289-c264faf66396))
(pad "E27" smd roundrect locked (at 46.001998 -12.524997 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp bdabf21f-5790-4da2-9cdc-cf3690ebcbb1))
(pad "E28" smd roundrect locked (at 46.001998 -11.864995 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp f65b5f60-3ba7-4887-baa7-7bb2d6a4bd41))
(pad "E29" smd roundrect locked (at 46.001998 -11.204997 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 346cc7ee-342e-4fb6-93ac-ff992ffcc78c))
(pad "E30" smd roundrect locked (at 46.001998 -10.544995 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp ba030c7a-456d-4eae-bb90-cc7157b21b3e))
(pad "E31" smd roundrect locked (at 46.001998 -9.884997 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 8fd2879b-2f13-49aa-9e3d-1d7c80503ca5))
(pad "E32" smd roundrect locked (at 46.001998 -9.224996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 085d8221-8646-4df0-a049-6b4967671669))
(pad "E33" smd roundrect locked (at 46.001998 -8.564997 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 75aba33f-4502-4696-b89f-47bdfa432013))
(pad "E34" smd roundrect locked (at 46.001998 -7.904996 270) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 064ce758-84f2-4cb7-8c3b-f1d1da84d22a))
(pad "N1" smd roundrect locked (at 12.055 -36.452 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 3ba42882-422b-4f94-a170-a707e9eba5b4))
(pad "N2" smd roundrect locked (at 13.375002 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 7601d27f-1f03-4c31-b847-8fa9e4f64732))
(pad "N3" smd roundrect locked (at 14.695005 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp a922c078-6adf-4980-92e3-5af52113567c))
(pad "N4" smd roundrect locked (at 15.455003 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp e8806f6a-9cfe-4a4a-8b1e-3452291a9f20))
(pad "N5" smd roundrect locked (at 16.120006 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 0d103185-f892-4276-862a-b86658fb3a50))
(pad "N6" smd roundrect locked (at 16.785008 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 05e67220-154c-4c1f-9524-5c56525e398d))
(pad "N7" smd roundrect locked (at 17.449998 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp c7b87b46-ade1-4f04-b15c-20e0ef412ebc))
(pad "N8" smd roundrect locked (at 18.224998 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 8847326d-922a-4e00-8c89-9ee70e7bfccf))
(pad "N9" smd roundrect locked (at 19.324996 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 01dca64b-bf55-471c-8e58-b90e53be4a8b))
(pad "N10" smd roundrect locked (at 20.424993 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 1250a567-6302-42a0-82fa-f8703410be4c))
(pad "N11" smd roundrect locked (at 21.524991 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 8f766e86-81be-4f8c-8f81-6910fb897fac))
(pad "N12" smd roundrect locked (at 22.624989 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp f41ca0d5-db35-47c3-81b8-1f50c47bee0e))
(pad "N13" smd roundrect locked (at 23.724987 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 7ca7f7a4-a486-4a36-8219-92cd453a7b71))
(pad "N14" smd roundrect locked (at 24.824985 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 5aeffd42-c677-4391-b67c-810197a09fd8))
(pad "N15" smd roundrect locked (at 25.924982 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp ce3f147e-0af4-4780-88d2-0400fc07c1d7))
(pad "N16" smd roundrect locked (at 27.02498 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp c0de45d3-cd54-462e-9eea-bcbdb79ffa35))
(pad "N17" smd roundrect locked (at 28.124978 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp e85827ae-1849-40ef-8e01-6fe6f9bde4ae))
(pad "N18" smd roundrect locked (at 29.224976 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 2f17fd42-6d2a-4115-97f4-a10ee81620b7))
(pad "N19" smd roundrect locked (at 30.324974 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 651f63d8-6d3e-4518-a210-23dae85ed09c))
(pad "N20" smd roundrect locked (at 31.424971 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp cdea5167-aa73-49f9-951f-cf687e52c942))
(pad "N21" smd roundrect locked (at 32.524969 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp c3a6d207-0d27-400c-bd73-e3fc6b73a5f3))
(pad "N22" smd roundrect locked (at 33.624967 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 4ca81e8b-1006-4e65-b7d4-2d552466cc7f))
(pad "N23" smd roundrect locked (at 34.724965 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 787706e4-3693-4b8d-9e6c-68202e959bec))
(pad "N24" smd roundrect locked (at 35.824963 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 79230ddd-aca5-4739-bde6-04404f89fd18))
(pad "N25" smd roundrect locked (at 36.92496 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 2bae6fa9-ca89-47e6-a44d-7a1b053e3a1c))
(pad "N26" smd roundrect locked (at 38.024958 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp d4097376-4b88-4e4b-852a-f5c7f0645874))
(pad "N27" smd roundrect locked (at 39.124956 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 55423710-f537-45af-93d1-79aa28ce3619))
(pad "N28" smd roundrect locked (at 40.224954 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 18e9ba85-b599-446e-b7f0-19211a862b17))
(pad "N29" smd roundrect locked (at 41.324952 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 9ec068e3-d6dc-4be3-8fad-9351351b3555))
(pad "N30" smd roundrect locked (at 42.424949 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 46d77f18-6fb2-4648-9d3b-a7dfb749b76a))
(pad "N31" smd roundrect locked (at 43.524947 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp c53d2a32-c297-4f8a-a917-7e29ed99caac))
(pad "N32" smd roundrect locked (at 44.624945 -36.452) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp c55fa377-1a89-4b68-88c9-2998a1cceee8))
(pad "S1" smd roundrect locked (at 37.625002 -0.523) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 478e1268-543c-4e36-9c98-d90edacd7d4c))
(pad "S2" smd roundrect locked (at 0.175003 -18.722091 180) (size 0.2 36.19) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 013fb460-bd1e-467d-8872-678e45d72caf))
(pad "S2" smd roundrect locked (at 46.212498 -0.3375 135) (size 0.2 0.58) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 09817bb0-6db2-46c3-8c55-a732abeeb03b))
(pad "S2" smd roundrect locked (at 36.305 -0.45 180) (size 0.25 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 0abea145-4628-4ded-a288-4109a4f33e0c))
(pad "S2" smd roundrect locked (at 46.225003 -36.3 45) (size 0.2 0.55) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 2668f9fa-2750-4819-9ce3-36151621a00c))
(pad "S2" smd roundrect locked (at 23.4 -0.199997 270) (size 0.2 45.6) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 4c5023c0-6725-41e8-b6d4-b732992ea60a))
(pad "S2" smd roundrect locked (at 0.34 -15.24 180) (size 0.2 29) (layers "B.Cu" "B.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 99fd0bef-ffc9-4b7d-8cdc-391bdb1b79e2))
(pad "S2" smd roundrect locked (at 36.305 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 9ac023c1-39b6-4472-b961-f245ee4433c9))
(pad "S2" smd roundrect locked (at 44.287504 -36.787501 45) (size 0.2 1.2) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp a4a75a4b-e317-404f-aa7a-21c8c3aa89f2))
(pad "S2" smd roundrect locked (at 45.375002 -36.425 270) (size 0.2 1.6) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp d3b1bc48-6bbb-444c-9e2a-ad540c7553cf))
(pad "S2" smd roundrect locked (at 0.437502 -0.462496 225) (size 0.2 0.94) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp d557ada0-2257-4b1e-9a5b-4b683c7e33ff))
(pad "S2" smd roundrect locked (at 46.35 -18.325003 180) (size 0.2 35.9) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp ee480710-60f4-4028-98d5-9e9743af7566))
(pad "S2" smd roundrect locked (at 22.265409 -37.15 270) (size 0.2 43.5) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp f6ed59a9-c6a4-4d4b-8fe0-c550cb65df5c))
(pad "S2" smd roundrect locked (at 0.390411 -36.934595 315) (size 0.2 0.8) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp fe449600-a0de-4f42-b96e-0d4e99634d89))
(pad "S3" smd roundrect locked (at 34.984997 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 0ec632dc-b049-4e2a-8b22-7bef0192c819))
(pad "S4" smd roundrect locked (at 33.885 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 1956d0be-fc04-4539-8d58-a0da5efa9f28))
(pad "S5" smd roundrect locked (at 32.785002 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 1294348b-8fdc-4671-bfca-ed8e981bb2a0))
(pad "S6" smd roundrect locked (at 31.685004 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 135fa81a-e928-4812-86cb-527d81cce515))
(pad "S7" smd roundrect locked (at 30.585006 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 751cc75d-065f-44df-b75f-a61cd7d94bb3))
(pad "S8" smd roundrect locked (at 29.485008 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 8dd126b2-7a45-418b-89bb-337b73e6001f))
(pad "S9" smd roundrect locked (at 28.385011 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 78d39c4f-e783-4ac6-b021-ff63987f62ce))
(pad "S10" smd roundrect locked (at 27.285013 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 1a69265d-a5fa-42b7-ad03-77b3976f6d7a))
(pad "S11" smd roundrect locked (at 26.185015 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 1aa1b891-2af4-44e5-b0eb-7100c3529e55))
(pad "S12" smd roundrect locked (at 25.085017 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp a94e0330-ac2b-41d8-b957-b6539e8f8c15))
(pad "S13" smd roundrect locked (at 23.985019 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 25024420-f8ac-4ac1-9cb2-87c2a1233b96))
(pad "S14" smd roundrect locked (at 22.885022 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp b6a67239-19d5-4d2a-8e09-6a4c70e934db))
(pad "S15" smd roundrect locked (at 21.785024 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 6db796ef-b2e8-40f6-a984-0aacefb0f5c1))
(pad "S16" smd roundrect locked (at 20.685026 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 9e12ecde-f81c-4638-be63-36b379042167))
(pad "S17" smd roundrect locked (at 19.585028 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 6b1c8ea0-071a-401a-9b46-600a154ce966))
(pad "S18" smd roundrect locked (at 18.48503 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 68fcef59-d580-4174-b2fa-73c0980ddca9))
(pad "S19" smd roundrect locked (at 17.385033 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 09b478a9-1a2d-407b-be01-8d6487694d49))
(pad "S20" smd roundrect locked (at 16.285035 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 768412e3-cf03-4c8b-bdf5-0de5a72fff2f))
(pad "S21" smd roundrect locked (at 15.185037 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp fae3a4fb-d168-4534-a881-e6ff82d278fc))
(pad "S22" smd roundrect locked (at 14.085039 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp ab237db9-add9-4a01-adf4-2a00aa118a1b))
(pad "S23" smd roundrect locked (at 12.985041 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 33da31fd-c2d2-433a-9fbb-b9c4915a383c))
(pad "S24" smd roundrect locked (at 11.885044 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 1aed5721-69da-4360-95a8-71a6168f86d6))
(pad "S25" smd roundrect locked (at 10.785046 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 5179954a-fe6a-405d-ae64-11331a937cd9))
(pad "S26" smd roundrect locked (at 9.685048 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp e860f00e-18dd-4732-86dc-313d13291e11))
(pad "S27" smd roundrect locked (at 8.58505 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp a61502ed-3cba-4dca-985c-88e80407e669))
(pad "S28" smd roundrect locked (at 7.485052 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 9da51de1-2b33-42b4-91b1-a06e02ca8c9a))
(pad "S29" smd roundrect locked (at 6.385055 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 6f220ef4-1c20-4f0a-b646-b2d6d3cc8755))
(pad "S30" smd roundrect locked (at 5.285057 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 74bc4cfa-1138-4173-b05e-d8049b301c85))
(pad "S31" smd roundrect locked (at 4.185059 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 67c518bf-1fc0-42b9-ac9a-38f1e3a09ea9))
(pad "S32" smd roundrect locked (at 3.085061 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 42d8f623-35c5-41a7-816d-c9d697d025cf))
(pad "S33" smd roundrect locked (at 1.985063 -0.523 180) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp dc4867f5-7250-4aa3-af8e-87c81a01acaf))
(pad "W1" smd roundrect locked (at 0.475 -30.58 90) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 012b3f2b-f408-4e21-8fc6-3a3b73e199ae))
(pad "W2" smd roundrect locked (at 0.475 -31.24 90) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 9222b3e2-9c66-4a67-b244-982cb196c838))
(pad "W3" smd roundrect locked (at 0.475 -31.900002 90) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp efa4b763-74fa-4ce2-bbbb-b0ba81391d2e))
(pad "W4" smd roundrect locked (at 0.475 -32.560003 90) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 9f9b856d-31d4-48e4-a8ea-513ea3d15d97))
(pad "W5" smd roundrect locked (at 0.475 -33.220005 90) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 08f3dd6f-068d-4cf5-9145-861572ab4a99))
(pad "W6" smd roundrect locked (at 0.475 -33.880006 90) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 6e37c984-f854-48e9-aa8d-34d979560b84))
(pad "W7" smd roundrect locked (at 0.475 -34.540007 90) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 3c80b1aa-ccd0-4f1b-8e5a-2952e9894364))
(pad "W8" smd roundrect locked (at 0.475 -35.200008 90) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 92ee0952-83c6-4507-b2cf-20b40c695a94))
(pad "W9" smd roundrect locked (at 0.475 -35.86001 90) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 7afeb15e-9053-4c4f-abb2-924e63cfe068))
(pad "W10" smd roundrect locked (at 0.475 -36.520011 90) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -50) (zone_connect 2) (tstamp 3c3d0b84-d241-4306-b912-131e39284ee3))
(zone (net 0) (net_name "") (layers "F.Cu" "In1.Cu" "In2.Cu") (tstamp e4f0ae88-895a-4e35-96eb-d2938f63a7fa) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254) (filled_areas_thickness no)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
(polygon
(pts
(xy 125.361159 122.966166)
(xy 125.361159 86.958681)
(xy 125.791265 86.528575)
(xy 169.188574 86.528575)
(xy 169.888576 87.228576)
(xy 171.338575 87.228576)
(xy 171.6136 87.5036)
(xy 171.613604 87.5036)
(xy 171.613604 123.304872)
(xy 171.349208 123.569268)
(xy 125.945585 123.569268)
)
)
)
(zone (net 0) (net_name "") (layer "B.Cu") (tstamp 627da2f4-b910-42a3-a9f6-08c8c345b4a7) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254) (filled_areas_thickness no)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
(polygon
(pts
(xy 125.5636 123.143308)
(xy 125.5636 93.9536)
(xy 125.414537 93.9536)
(xy 125.414537 86.905303)
(xy 125.799548 86.528575)
(xy 169.188582 86.528578)
(xy 169.888583 87.228579)
(xy 171.338583 87.228579)
(xy 171.613604 87.5036)
(xy 171.6136 123.304877)
(xy 171.338529 123.579946)
(xy 171.327851 123.569268)
(xy 125.945585 123.569268)
)
)
)
(zone (net 0) (net_name "") (layer "B.Cu") (tstamp c4078ddb-c0a8-4cb9-b0c8-58a7e53e262a) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254) (filled_areas_thickness no)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
(polygon
(pts
(xy 135.3886 86.603602)
(xy 170.2636 86.603602)
(xy 170.2636 87.4036)
(xy 170.2386 87.4286)
(xy 135.3886 87.4286)
)
)
)
(zone (net 0) (net_name "") (layer "B.Cu") (tstamp c7e4535c-3e20-43e0-a4b3-ca8e88f6f45b) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254) (filled_areas_thickness no)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
(polygon
(pts
(xy 126.94252 122.878802)
(xy 163.613401 122.878802)
(xy 163.613602 122.878602)
(xy 163.613602 123.4286)
(xy 126.929439 123.4286)
)
)
)
(zone (net 0) (net_name "") (layer "B.Cu") (tstamp dcfea36b-0d65-4a0f-9d19-1d2a665a094f) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254) (filled_areas_thickness no)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
(polygon
(pts
(xy 171.0386 90.8786)
(xy 171.5386 90.8786)
(xy 171.5386 94.3536)
(xy 171.0386 94.3536)
)
)
)
(zone (net 0) (net_name "") (layer "B.Cu") (tstamp f932ec80-4310-4d6d-93e7-b52ad3e223a0) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254) (filled_areas_thickness no)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
(polygon
(pts
(xy 170.9386 96.7536)
(xy 171.5386 96.7536)
(xy 171.5386 116.1036)
(xy 170.9136 116.1036)
)
)
)
)