Fix knock 0.2 footprint
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1a973e15fa
commit
2ae98cba79
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@ -21,7 +21,5 @@
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"^BatteryHolder_Keystone_1060_1x2032",180
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"^BATTERY-2032",180
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"^SOP8",270
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"^TSSOP24",180
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"^SDAMB-012",180
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"^DPAK",180
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"^SOT-363",180
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"^DPAK",180
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@ -21,15 +21,15 @@
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(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 07da61f7-ec5e-4e06-9f8d-18bf698462d5))
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(pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "In1.Cu")
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(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 1a5fd7de-d643-4bce-b0e2-d9faf87c973a))
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(pad "E2" smd oval (at 4.55 -3.1 90) (size 0.2 9.3) (layers "In2.Cu")
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(pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "In2.Cu")
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(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 2470fcfb-973a-4fec-a7e9-690765a69cdd))
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(pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 41073975-5da9-485c-82ce-614d7a6f26a3))
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(pad "E2" smd oval (at 0 -0.525 180) (size 0.2 1.225) (layers "In2.Cu")
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(pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "In2.Cu")
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(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 62183a89-42dd-4da5-9394-7fc246c9f3a1))
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(pad "E2" thru_hole circle (at 9 -1.65 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
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(solder_paste_margin -50) (tstamp 852c95bd-1fd0-44d8-869f-06e5d704be25))
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(pad "E2" smd oval (at 4.55 0 270) (size 0.2 9.3) (layers "In2.Cu")
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(pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "In2.Cu")
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(solder_mask_margin -1) (solder_paste_margin -50) (tstamp b10d22dc-57f4-4677-a90c-e733fd7cbe5e))
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(pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "B.Cu" "B.Paste" "B.Mask")
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(solder_mask_margin -1) (solder_paste_margin -50) (tstamp b8b2432a-9cd1-4541-be5a-470c2e639315))
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