fix wbo-0.3 footprint

This commit is contained in:
Andrei 2021-09-28 22:51:23 +03:00
parent fbb81e625d
commit 38fe7a142b
1 changed files with 43 additions and 22 deletions

View File

@ -1,5 +1,6 @@
(footprint "wbo" (version 20210824) (generator pcbnew) (layer "F.Cu")
(tedit 615361C8)
(tedit 615371CA)
(zone_connect 2)
(fp_text reference "REF**" (at 2.38 -15.86 unlocked) (layer "F.SilkS") hide
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 3bbb3196-d395-42e9-93c4-2cfa30650db5)
@ -10,12 +11,18 @@
)
(fp_rect (start 39.25 -15) (end 0.1 -0.1) (layer "B.SilkS") (width 0.2) (fill none) (tstamp c71593d3-44a3-4dc7-aaf0-1a37b8b2fab0))
(fp_rect (start 39.25 -15) (end 0.1 -0.1) (layer "F.SilkS") (width 0.2) (fill none) (tstamp b1d3ac64-b6a3-45b5-9e8e-ad509bc8209b))
(pad "E1" thru_hole circle locked (at 38.8 -1.65 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp df94ea85-a94d-42ee-a7fc-b4779b801d8b))
(pad "E2" thru_hole circle locked (at 38.8 -2.65 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp 55aa9eae-78d4-4780-8fa2-419fe07c9687))
(pad "E3" thru_hole circle locked (at 38.8 -3.65 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp 06e2a557-0245-47c5-af81-6e844a55bae3))
(pad "E4" thru_hole circle locked (at 38.8 -4.65 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp ac127143-0952-4746-8103-da8f3fe50e92))
(pad "E5" smd circle locked (at 37.55 -6.8) (size 3 3) (layers "F.Cu") (tstamp 13405baf-e4f1-4546-a51a-9e772a859ab7))
(pad "E6" smd rect locked (at 39.175 -10.3) (size 0.25 3) (layers "F.Cu") (tstamp 4cc36a13-1605-43a7-89bf-b6d66717379d))
(pad "E1" thru_hole circle locked (at 38.8 -1.65 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
(zone_connect 2) (tstamp df94ea85-a94d-42ee-a7fc-b4779b801d8b))
(pad "E2" thru_hole circle locked (at 38.8 -2.65 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
(zone_connect 2) (tstamp 55aa9eae-78d4-4780-8fa2-419fe07c9687))
(pad "E3" thru_hole circle locked (at 38.8 -3.65 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
(zone_connect 2) (tstamp 06e2a557-0245-47c5-af81-6e844a55bae3))
(pad "E4" thru_hole circle locked (at 38.8 -4.65 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
(zone_connect 2) (tstamp ac127143-0952-4746-8103-da8f3fe50e92))
(pad "E5" smd circle locked (at 37.55 -6.8) (size 3 3) (layers "F.Cu")
(zone_connect 2) (tstamp 13405baf-e4f1-4546-a51a-9e772a859ab7))
(pad "E6" smd rect locked (at 39.175 -10.3) (size 0.25 3) (layers "F.Cu")
(zone_connect 2) (tstamp 4cc36a13-1605-43a7-89bf-b6d66717379d))
(pad "G" smd rect (at 39.175 -10.175) (size 0.25 9.75) (layers "B.Cu")
(zone_connect 2) (tstamp 02dc75bd-aabb-4706-bac4-b4cab27df768))
(pad "G" smd rect (at 0.175 -2.575) (size 0.25 5.05) (layers "B.Cu")
@ -44,21 +51,35 @@
(zone_connect 2) (tstamp c86ff3cd-0649-48ad-9dd2-082e6511b4f0))
(pad "G" smd rect (at 39.175 -0.525) (size 0.25 0.95) (layers "F.Cu")
(zone_connect 2) (tstamp da1993a8-3ffb-4c80-bf92-1d10d0c3398e))
(pad "J1" smd roundrect locked (at 9.55 -12.475 180) (size 0.5 1.5) (layers "F.Cu") (roundrect_rratio 0.25) (tstamp 4bfb4207-e8ec-49c6-80ae-d3bd9c836d8f))
(pad "J2" smd roundrect locked (at 7.375 -10.3 180) (size 1.5 0.5) (layers "F.Cu") (roundrect_rratio 0.25) (tstamp 48ecd52b-ca16-4a94-915d-fbb37a16c4ef))
(pad "J_GND1" smd roundrect locked (at 8.75 -12.475 180) (size 0.5 1.5) (layers "F.Cu") (roundrect_rratio 0.25) (tstamp f838d240-69dd-4969-8355-dada7eaa620e))
(pad "J_GND2" smd roundrect locked (at 8.8 -10.3 270) (size 0.5 0.5) (layers "F.Cu") (roundrect_rratio 0.25) (tstamp b67e5648-0045-4477-900e-a35247e89dd7))
(pad "J_VCC1" smd roundrect locked (at 9.55 -11.1 180) (size 0.5 0.5) (layers "F.Cu") (roundrect_rratio 0.25) (tstamp f47de09e-97c3-45d9-a046-cddf1c493fa3))
(pad "J_VCC2" smd roundrect locked (at 7.375 -11.1 180) (size 1.5 0.5) (layers "F.Cu") (roundrect_rratio 0.25) (tstamp 0b7d30dc-94ec-492f-b35a-8641076e7c71))
(pad "W1" thru_hole circle locked (at 0.55 -11.3 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp b2d41e19-8050-4331-adf8-84107e5a7599))
(pad "W2" thru_hole circle locked (at 0.55 -10.3 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp a50d5a68-d0c1-48fb-983c-95cbe23e1236))
(pad "W3" thru_hole circle locked (at 0.55 -6.75 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp b096beef-fa9d-41b7-a576-961ce3f5cde5))
(pad "W4" thru_hole circle locked (at 0.55 -5.75 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp ca51a353-6225-4047-8a22-0cf23634991e))
(pad "W5" smd roundrect (at 0.4 -5) (size 0.5 0.25) (layers "F.Cu") (roundrect_rratio 0.5) (tstamp 7cbebee5-4862-4534-91ac-aac658577025))
(pad "W6" smd roundrect (at 0.4 -4.5) (size 0.5 0.25) (layers "F.Cu") (roundrect_rratio 0.5) (tstamp 2477433b-31ba-4fde-a7df-5b08e2a50701))
(pad "W7" smd roundrect (at 0.4 -4) (size 0.5 0.25) (layers "F.Cu") (roundrect_rratio 0.5) (tstamp fcc4df26-94d3-4cc2-a6f3-e39922b67cf2))
(pad "W8" smd roundrect (at 0.4 -1.9) (size 0.5 0.25) (layers "F.Cu") (roundrect_rratio 0.5) (tstamp 947693b4-07d5-4653-af82-a2e5c26bc7a2))
(zone (net 0) (net_name "") (layers *.Cu) (tstamp 01d412cb-7dcf-4cf7-8423-2ce7302f5330) (hatch edge 0.508)
(pad "J1" smd roundrect locked (at 9.55 -12.475 180) (size 0.5 1.5) (layers "F.Cu") (roundrect_rratio 0.25)
(zone_connect 2) (tstamp 4bfb4207-e8ec-49c6-80ae-d3bd9c836d8f))
(pad "J2" smd roundrect locked (at 7.375 -10.3 180) (size 1.5 0.5) (layers "F.Cu") (roundrect_rratio 0.25)
(zone_connect 2) (tstamp 48ecd52b-ca16-4a94-915d-fbb37a16c4ef))
(pad "J_GND1" smd roundrect locked (at 8.75 -12.475 180) (size 0.5 1.5) (layers "F.Cu") (roundrect_rratio 0.25)
(zone_connect 2) (tstamp f838d240-69dd-4969-8355-dada7eaa620e))
(pad "J_GND2" smd roundrect locked (at 8.8 -10.3 270) (size 0.5 0.5) (layers "F.Cu") (roundrect_rratio 0.25)
(zone_connect 2) (tstamp b67e5648-0045-4477-900e-a35247e89dd7))
(pad "J_VCC1" smd roundrect locked (at 9.55 -11.1 180) (size 0.5 0.5) (layers "F.Cu") (roundrect_rratio 0.25)
(zone_connect 2) (tstamp f47de09e-97c3-45d9-a046-cddf1c493fa3))
(pad "J_VCC2" smd roundrect locked (at 7.375 -11.1 180) (size 1.5 0.5) (layers "F.Cu") (roundrect_rratio 0.25)
(zone_connect 2) (tstamp 0b7d30dc-94ec-492f-b35a-8641076e7c71))
(pad "W1" thru_hole circle locked (at 0.55 -11.3 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
(zone_connect 2) (tstamp b2d41e19-8050-4331-adf8-84107e5a7599))
(pad "W2" thru_hole circle locked (at 0.55 -10.3 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
(zone_connect 2) (tstamp a50d5a68-d0c1-48fb-983c-95cbe23e1236))
(pad "W3" thru_hole circle locked (at 0.55 -6.75 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
(zone_connect 2) (tstamp b096beef-fa9d-41b7-a576-961ce3f5cde5))
(pad "W4" thru_hole circle locked (at 0.55 -5.75 90) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
(zone_connect 2) (tstamp ca51a353-6225-4047-8a22-0cf23634991e))
(pad "W5" smd roundrect (at 0.4 -5) (size 0.5 0.25) (layers "F.Cu") (roundrect_rratio 0.5)
(zone_connect 2) (tstamp 7cbebee5-4862-4534-91ac-aac658577025))
(pad "W6" smd roundrect (at 0.4 -4.5) (size 0.5 0.25) (layers "F.Cu") (roundrect_rratio 0.5)
(zone_connect 2) (tstamp 2477433b-31ba-4fde-a7df-5b08e2a50701))
(pad "W7" smd roundrect (at 0.4 -4) (size 0.5 0.25) (layers "F.Cu") (roundrect_rratio 0.5)
(zone_connect 2) (tstamp fcc4df26-94d3-4cc2-a6f3-e39922b67cf2))
(pad "W8" smd roundrect (at 0.4 -1.9) (size 0.5 0.25) (layers "F.Cu") (roundrect_rratio 0.5)
(zone_connect 2) (tstamp 947693b4-07d5-4653-af82-a2e5c26bc7a2))
(zone (net 0) (net_name "") (layers *.Cu) (tstamp 1b54a718-a710-4eb6-ab0c-519608a59517) (hatch edge 0.508)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))