MM 10k partnumber fix
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(module C0402HD (layer F.Cu) (tedit 643F25B9)
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(module C0402HD (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -0.49999899999999997 -0.0 90.0) (size 0.7 0.6) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at 0.49999899999999997 -0.0 90.0) (size 0.7 0.6) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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)
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(module C0603 (layer F.Cu) (tedit 643F25B9)
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(module C0603 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -0.7899908 -0.0) (size 0.85 0.85) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at 0.7899908 -0.0) (size 0.85 0.85) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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)
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(module HDR1X1 (layer F.Cu) (tedit 643F25B9)
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(module HDR1X1 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 thru_hole oval (at 0.0 -0.0) (size 1.1 1.1) (drill 0.8) (layers F.Cu F.Mask))
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)
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(module HLGA-10L (layer F.Cu) (tedit 643F25B9)
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(module HLGA-10L (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd rect (at -0.762508 -0.2499868) (size 0.375 0.35) (layers F.Cu F.Mask))
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(pad 2 smd rect (at -0.762508 0.25001219999999996) (size 0.375 0.35) (layers F.Cu F.Mask))
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(pad 3 smd rect (at -0.49999899999999997 0.762508) (size 0.35 0.375) (layers F.Cu F.Mask))
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(module JTAG-TC2030-IDC-NL (layer F.Cu) (tedit 643F25B9)
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(module JTAG-TC2030-IDC-NL (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd oval (at -1.2700254 0.6350254) (size 0.7874 0.7874) (layers F.Cu F.Mask))
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(pad 2 smd oval (at -1.2700254 -0.6349746) (size 0.7874 0.7874) (layers F.Cu F.Mask))
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(pad 3 smd oval (at -2.54e-05 0.6350254) (size 0.7874 0.7874) (layers F.Cu F.Mask))
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(module L0603 (layer F.Cu) (tedit 643F25B9)
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(module L0603 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd rect (at -0.8500110000000001 -0.0) (size 1.0 1.1) (layers F.Cu F.Mask))
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(pad 2 smd rect (at 0.8500110000000001 -0.0) (size 1.0 1.1) (layers F.Cu F.Mask))
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)
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(module LED-0603 (layer F.Cu) (tedit 643F25B9)
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(module LED-0603 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at 0.7999983999999999 0.0500126 180.0) (size 1.0 1.1) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at -0.8999982 0.049987199999999996 180.0) (size 1.0 1.1) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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)
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(module LGA12 (layer F.Cu) (tedit 643F25B9)
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(module LGA12 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd rect (at -0.7999983999999999 -0.7500112) (size 0.35 0.25) (layers F.Cu F.Mask))
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(pad 2 smd rect (at -0.7999983999999999 -0.2499868) (size 0.35 0.25) (layers F.Cu F.Mask))
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(pad 3 smd rect (at -0.7999983999999999 0.2499868) (size 0.35 0.25) (layers F.Cu F.Mask))
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(module LQFP144 (layer F.Cu) (tedit 643F25B9)
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(module LQFP144 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd oval (at -10.6249978 -8.749995199999999 90.0) (size 0.22 1.3) (layers F.Cu F.Mask))
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(pad 2 smd oval (at -10.6249978 -8.2499962 90.0) (size 0.22 1.3) (layers F.Cu F.Mask))
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(pad 3 smd oval (at -10.6249978 -7.749997199999999 90.0) (size 0.22 1.3) (layers F.Cu F.Mask))
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(module MOD_Hellen_MEGA_MCU144_0.2 (layer F.Cu) (tedit 643F25B9)
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(module MOD_Hellen_MEGA_MCU144_0.2 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 thru_hole oval (at 41.999992199999994 -37.200001799999995) (size 0.6 0.6) (drill 0.3) (layers F.Cu F.Mask))
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(pad 2 thru_hole oval (at 41.999992199999994 -36.400003399999996) (size 0.6 0.6) (drill 0.3) (layers F.Cu F.Mask))
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(pad 3 thru_hole oval (at 41.999992199999994 -35.600005) (size 0.6 0.6) (drill 0.3) (layers F.Cu F.Mask))
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(module NET-TIE (layer F.Cu) (tedit 643F25B9)
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(module NET-TIE (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd rect (at -0.19999959999999997 -2.54e-05) (size 0.5 0.5) (layers F.Cu F.Mask))
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(pad 2 smd rect (at 0.19999959999999997 -2.54e-05) (size 0.5 0.5) (layers F.Cu F.Mask))
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)
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(module PAD-SMD-0.8 (layer F.Cu) (tedit 643F25B9)
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(module PAD-SMD-0.8 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd oval (at 0.0 -0.0) (size 0.8 0.8) (layers F.Cu F.Mask))
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)
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(module R0402 (layer F.Cu) (tedit 643F25B9)
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(module R0402 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -0.49999899999999997 -0.0 90.0) (size 0.7 0.6) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at 0.49999899999999997 -0.0 90.0) (size 0.7 0.6) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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)
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(module R0603_x4 (layer F.Cu) (tedit 643F25B9)
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(module R0603_x4 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -0.8999982 -1.2750038 270.0) (size 0.65 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at -0.8999982 -0.39999919999999994 270.0) (size 0.45 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 3 smd roundrect (at -0.8999982 0.39999919999999994 270.0) (size 0.45 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(module R0603 (layer F.Cu) (tedit 643F25B9)
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(module R0603 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -0.7999983999999999 -0.0) (size 0.7 0.92) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at 0.7999983999999999 -0.0) (size 0.7 0.92) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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)
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(module R0603_X4 (layer F.Cu) (tedit 643F25B9)
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(module R0603_X4 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -0.8999982 -1.2750291999999999 270.0) (size 0.65 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at -0.8999982 -0.39999919999999994 270.0) (size 0.45 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 3 smd roundrect (at -0.8999982 0.39999919999999994 270.0) (size 0.45 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(module CONN-MICROSD-472192001 (layer F.Cu) (tedit 643F25B9)
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(module CONN-MICROSD-472192001 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at 3.2049974 1.7999964 90.0) (size 1.5 0.65) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at 2.1049995999999997 1.7999964 90.0) (size 1.5 0.65) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 3 smd roundrect (at 1.0050018 1.7999964 90.0) (size 1.5 0.65) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(module SMB (layer F.Cu) (tedit 643F25B9)
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(module SMB (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -2.2500082 -0.0) (size 2.2 2.3) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at 2.2500082 -0.0) (size 2.2 2.3) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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)
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(module BUTTON-SKRK (layer F.Cu) (tedit 643F25B9)
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(module BUTTON-SKRK (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -2.0999958000000003 -0.0) (size 0.8 2.0) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at 2.0999958000000003 -0.0) (size 0.8 2.0) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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)
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(module PTC-SMD1206 (layer F.Cu) (tedit 643F25B9)
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(module PTC-SMD1206 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -1.4500098000000001 -0.0 90.0) (size 1.8 1.15) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at 1.4500098000000001 -0.0 90.0) (size 1.8 1.15) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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)
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(module QUARTZ-SMD2012 (layer F.Cu) (tedit 643F25B9)
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(module QUARTZ-SMD2012 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -0.7500112 -0.0) (size 0.7 1.4) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at 0.7500112 -0.0) (size 0.7 1.4) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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)
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(module QUARTZ-SMD5032 (layer F.Cu) (tedit 643F25B9)
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(module QUARTZ-SMD5032 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd rect (at -1.8499836 -2.54e-05) (size 1.7 2.4) (layers F.Cu F.Mask))
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(pad 2 smd rect (at 1.8499836 -2.54e-05) (size 1.7 2.4) (layers F.Cu F.Mask))
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)
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(module SO8 (layer F.Cu) (tedit 643F25B9)
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(module SO8 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd oval (at -2.3999951999999998 -1.905 90.0) (size 0.6 2.2) (layers F.Cu F.Mask))
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(pad 2 smd oval (at -2.3999951999999998 -0.635 90.0) (size 0.6 2.2) (layers F.Cu F.Mask))
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(pad 3 smd oval (at -2.3999951999999998 0.635 90.0) (size 0.6 2.2) (layers F.Cu F.Mask))
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(module SOD-123 (layer F.Cu) (tedit 643F25B9)
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(module SOD-123 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -1.6500093999999998 -0.0 180.0) (size 0.91 0.85) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at 1.6500093999999998 -0.0 180.0) (size 0.91 0.85) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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)
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(module SOT-223 (layer F.Cu) (tedit 643F25B9)
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(module SOT-223 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -3.0999937999999996 -2.2999954 270.0) (size 1.1 2.15) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at -3.0999937999999996 -0.0 270.0) (size 1.1 2.15001) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 3 smd roundrect (at 3.0999937999999996 -0.0 270.0) (size 3.5 2.15) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(module SOT-23 (layer F.Cu) (tedit 643F25B9)
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(module SOT-23 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -1.1800078 -0.9499854000000001 270.0) (size 0.9 0.95) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at -1.1800078 0.9500107999999999 270.0) (size 0.9 0.95001) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 3 smd roundrect (at 1.1700002 -0.0 270.0) (size 0.9 0.95) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(module SOT-353 (layer F.Cu) (tedit 643F25B9)
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(module SOT-353 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -0.9500107999999999 -0.6500114 90.0) (size 0.32 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at -0.9500107999999999 -0.0 90.0) (size 0.32 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 3 smd roundrect (at -0.9500107999999999 0.6500114 90.0) (size 0.32 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(module SOT-363 (layer F.Cu) (tedit 643F25B9)
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(module SOT-363 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -0.9500107999999999 -0.6500114 90.0) (size 0.32 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at -0.9500107999999999 -0.0 90.0) (size 0.32 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 3 smd roundrect (at -0.9500107999999999 0.6500114 90.0) (size 0.32 0.8) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(module SOT-26 (layer F.Cu) (tedit 643F25B9)
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(module SOT-26 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd roundrect (at -1.1999975999999999 -0.9500107999999999 270.0) (size 0.6 0.9) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 2 smd roundrect (at -1.1999975999999999 -0.0 270.0) (size 0.6 0.9) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(pad 3 smd roundrect (at -1.1999975999999999 0.9500107999999999 270.0) (size 0.6 0.9) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
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(module TSSOP14 (layer F.Cu) (tedit 643F25B9)
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(module TSSOP14 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd oval (at -2.8500069999999997 -1.9500088 90.0) (size 0.3 1.1) (layers F.Cu F.Mask))
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(pad 2 smd oval (at -2.8500069999999997 -1.2999973999999999 90.0) (size 0.3 1.1) (layers F.Cu F.Mask))
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(pad 3 smd oval (at -2.8500069999999997 -0.649986 90.0) (size 0.3 1.1) (layers F.Cu F.Mask))
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(module TSSOP24 (layer F.Cu) (tedit 643F25B9)
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(module TSSOP24 (layer F.Cu) (tedit 645CFC4F)
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(pad 1 smd oval (at -2.9200093999999996 -3.5749991999999997 90.0) (size 0.25 1.26) (layers F.Cu F.Mask))
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(pad 2 smd oval (at -2.9200093999999996 -2.9249878 90.0) (size 0.25 1.26) (layers F.Cu F.Mask))
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(pad 3 smd oval (at -2.9200093999999996 -2.2750017999999996 90.0) (size 0.25 1.26) (layers F.Cu F.Mask))
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@ -40,7 +40,7 @@ Comment,Designator,Footprint,LCSC Part #
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"18p","C132, C136","C0402","C1549"
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"12p","C115, C116","C0402","C1547"
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"10n","C202, C208, C209, C210, C211, C212, C213, C214, C215","C0402","C15195"
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"10k","R102, R103, R105, R108, R109, R121, R124, R126, R127, R128, R132, R135, R136, R137, R138, R139, R141, R142, R228, R229, R230, R231, R232, R233, R234, R235, R246, R247, R248, R249, R250, R251, R252, R253","R0402","C11616"
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"10k","R102, R103, R105, R108, R109, R121, R124, R126, R127, R128, R132, R135, R136, R137, R138, R139, R141, R142, R228, R229, R230, R231, R232, R233, R234, R235, R246, R247, R248, R249, R250, R251, R252, R253","R0402","C25744"
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"10k","R129, R130, R140","R0603-4","C29718"
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"10","R110, R111, R112, R113, R114, R115, R116, R117","R0402","C25077"
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"5.1k","R195","R0402","C25905"
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