From 833c8b30578c90409b0b22fd13d889885e149244 Mon Sep 17 00:00:00 2001 From: Vladimir Vinogradov Date: Sun, 11 Dec 2022 22:51:59 +0300 Subject: [PATCH] Knock 0.2 direct connect --- modules/knock/0.2/knock.kicad_mod | 35 ++++++++++++++++--------------- 1 file changed, 18 insertions(+), 17 deletions(-) diff --git a/modules/knock/0.2/knock.kicad_mod b/modules/knock/0.2/knock.kicad_mod index 8d0af3d..7a88378 100644 --- a/modules/knock/0.2/knock.kicad_mod +++ b/modules/knock/0.2/knock.kicad_mod @@ -1,6 +1,7 @@ (footprint "knock" (version 20211014) (generator pcbnew) (layer "F.Cu") (tedit 0) + (zone_connect 2) (fp_text reference "Designator4" (at -0.0998 -4.0382 unlocked) (layer "F.SilkS") (effects (font (size 0.6 0.6) (thickness 0.254)) (justify left bottom)) (tstamp 57e1ebbb-bf71-4a6a-806c-5c416640b476) @@ -16,39 +17,39 @@ (fp_line (start 0.1 -0.1) (end 9.2 -0.1) (layer "F.SilkS") (width 0.2) (tstamp 1eb68874-c93a-49cb-af88-a1d860c899fc)) (fp_line (start 0.1 -3.200003) (end 9.2 -3.200003) (layer "F.SilkS") (width 0.2) (tstamp c988c67c-3319-4eca-b2ff-8f91a556790f)) (pad "E1" thru_hole circle (at 9 -2.6 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) - (solder_paste_margin -50) (tstamp f27224ff-15fe-4455-b342-08f92639682d)) + (solder_paste_margin -50) (zone_connect 2) (tstamp f27224ff-15fe-4455-b342-08f92639682d)) (pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 07da61f7-ec5e-4e06-9f8d-18bf698462d5)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 07da61f7-ec5e-4e06-9f8d-18bf698462d5)) (pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "In1.Cu") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 1a5fd7de-d643-4bce-b0e2-d9faf87c973a)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 1a5fd7de-d643-4bce-b0e2-d9faf87c973a)) (pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "In2.Cu") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 2470fcfb-973a-4fec-a7e9-690765a69cdd)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 2470fcfb-973a-4fec-a7e9-690765a69cdd)) (pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "F.Cu" "F.Paste" "F.Mask") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 41073975-5da9-485c-82ce-614d7a6f26a3)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 41073975-5da9-485c-82ce-614d7a6f26a3)) (pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "In2.Cu") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 62183a89-42dd-4da5-9394-7fc246c9f3a1)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 62183a89-42dd-4da5-9394-7fc246c9f3a1)) (pad "E2" thru_hole circle (at 9 -1.65 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) - (solder_paste_margin -50) (tstamp 852c95bd-1fd0-44d8-869f-06e5d704be25)) + (solder_paste_margin -50) (zone_connect 2) (tstamp 852c95bd-1fd0-44d8-869f-06e5d704be25)) (pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "In2.Cu") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp b10d22dc-57f4-4677-a90c-e733fd7cbe5e)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp b10d22dc-57f4-4677-a90c-e733fd7cbe5e)) (pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "B.Cu" "B.Paste" "B.Mask") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp b8b2432a-9cd1-4541-be5a-470c2e639315)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp b8b2432a-9cd1-4541-be5a-470c2e639315)) (pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "In1.Cu") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp bccd09db-6a9f-4c5f-bf15-f656bee8dcc4)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp bccd09db-6a9f-4c5f-bf15-f656bee8dcc4)) (pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "In1.Cu") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp dad00cd9-cb9d-4016-a062-e9af56e70e34)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp dad00cd9-cb9d-4016-a062-e9af56e70e34)) (pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp eee72f69-d854-4b55-9b81-df798270a654)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp eee72f69-d854-4b55-9b81-df798270a654)) (pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp fa57e211-030c-403d-b255-046971181142)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp fa57e211-030c-403d-b255-046971181142)) (pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask") - (solder_mask_margin -1) (solder_paste_margin -50) (tstamp fe332e46-f490-486d-97d9-1a646b0a6a43)) + (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp fe332e46-f490-486d-97d9-1a646b0a6a43)) (pad "E3" thru_hole circle (at 9 -0.700002 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) - (solder_paste_margin -50) (tstamp 0009356c-562a-4ac7-9a87-db0026153a20)) + (solder_paste_margin -50) (zone_connect 2) (tstamp 0009356c-562a-4ac7-9a87-db0026153a20)) (pad "W1" thru_hole circle (at 0.3 -1.7) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) - (solder_paste_margin -50) (tstamp 9a2933df-b02d-4a67-aa9b-ad4baa7b3d86)) + (solder_paste_margin -50) (zone_connect 2) (tstamp 9a2933df-b02d-4a67-aa9b-ad4baa7b3d86)) (pad "W2" thru_hole circle (at 0.3 -2.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) - (solder_paste_margin -50) (tstamp b835d54d-4930-4397-88b6-3fe867514a47)) + (solder_paste_margin -50) (zone_connect 2) (tstamp b835d54d-4930-4397-88b6-3fe867514a47)) (zone (net 0) (net_name "") (layers *.Cu) (tstamp ded0861b-4ac0-4f71-944b-0cd41db4b141) (hatch edge 0.508) (connect_pads (clearance 0)) (min_thickness 0.254)