(footprint "vr-discrete" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 60B36794)
  (property "Sheetfile" "Файл: hellen1-vr-discrete.kicad_sch")
  (property "Sheetname" "")
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 88a83db3-3da2-451b-a804-145f455a30d3)
  )
  (fp_text value "Module-vr-discrete-0.1" (at 9.02 -16 unlocked) (layer "F.Fab") hide
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 6d9dadfd-2e24-498e-be2c-182fb8276bde)
  )
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  (fp_line (start 14.5 -9.7) (end 0.1 -9.7) (layer "B.SilkS") (width 0.2) (tstamp 5e14f335-d96f-43a4-ac88-c54e7ce5a60c))
  (fp_line (start 0.1 -9.7) (end 0.1 -3.3) (layer "B.SilkS") (width 0.2) (tstamp 6302a0fa-b877-42ee-b052-68fdf380c493))
  (fp_line (start 0.1 -0.1) (end 0.1 -1.4) (layer "B.SilkS") (width 0.2) (tstamp cb397060-92ad-4caa-964d-9f7baf4c23de))
  (fp_line (start 14.5 -9.7) (end 0.1 -9.7) (layer "F.SilkS") (width 0.2) (tstamp 19d9bc73-0ecb-43d6-884a-2ea074391c25))
  (fp_line (start 0.1 -0.1) (end 0.1 -1.4) (layer "F.SilkS") (width 0.2) (tstamp 8f18f20b-76ee-4ff5-ba0c-c279514b6807))
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  (fp_line (start 15.1 -0.1) (end 15.1 -5.2) (layer "F.SilkS") (width 0.2) (tstamp dc635c56-2a0f-4ac5-8d5d-dfcbe8622bea))
  (pad "E1" thru_hole circle (at 14.8 -6.9 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -49.999999) (zone_connect 2) (tstamp c3410476-cbc1-4ec7-8e8f-e53a79efda9f))
  (pad "E2" thru_hole circle (at 14.8 -5.7 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -49.999999) (zone_connect 2) (tstamp b675fd2b-fce9-4d01-9795-f6f629ca46f6))
  (pad "E3" thru_hole circle (at 14.8 -8.1 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -49.999999) (zone_connect 2) (tstamp 6fce55f9-bc4c-44bb-ab11-34c284dcdc8f))
  (pad "E4" thru_hole circle (at 14.8 -9.3 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -49.999999) (zone_connect 2) (tstamp f1ca6507-9d53-4739-8dd6-f1dc95b37e19))
  (pad "G" smd rect (at 7.575 -0.15 90) (size 0.25 15.1) (layers "B.Cu")
    (zone_connect 2) (tstamp 137b4c20-cddd-4222-9418-71cf2cdaa56e))
  (pad "G" smd rect (at 7.575 -0.15 90) (size 0.25 15.1) (layers "In2.Cu")
    (zone_connect 2) (tstamp 137b4c20-cddd-4222-9418-71cf2cdaa56e))
  (pad "G" smd rect (at 7.575 -0.15 90) (size 0.25 15.1) (layers "In1.Cu")
    (zone_connect 2) (tstamp 137b4c20-cddd-4222-9418-71cf2cdaa56e))
  (pad "G" smd rect (at 7.575 -0.15 90) (size 0.25 15.1) (layers "F.Cu")
    (zone_connect 2) (tstamp 137b4c20-cddd-4222-9418-71cf2cdaa56e))
  (pad "G" smd rect (at 7.1625 -9.6 90) (size 0.25 14.275) (layers "In1.Cu")
    (zone_connect 2) (tstamp 1640e77c-c9ea-4b22-89f4-08ee685babd6))
  (pad "G" smd rect (at 7.1625 -9.6 90) (size 0.25 14.275) (layers "In2.Cu")
    (zone_connect 2) (tstamp 1640e77c-c9ea-4b22-89f4-08ee685babd6))
  (pad "G" smd rect (at 7.1625 -9.6 90) (size 0.25 14.275) (layers "B.Cu")
    (zone_connect 2) (tstamp 1640e77c-c9ea-4b22-89f4-08ee685babd6))
  (pad "G" smd rect (at 7.1625 -9.6 90) (size 0.25 14.275) (layers "F.Cu")
    (zone_connect 2) (tstamp 1640e77c-c9ea-4b22-89f4-08ee685babd6))
  (pad "G" smd rect (at 15 -2.6125) (size 0.25 5.175) (layers "B.Cu")
    (zone_connect 2) (tstamp 928ccc1b-2466-4da6-9d24-f081779370d5))
  (pad "G" smd rect (at 15 -2.6125) (size 0.25 5.175) (layers "In1.Cu")
    (zone_connect 2) (tstamp 928ccc1b-2466-4da6-9d24-f081779370d5))
  (pad "G" smd rect (at 15 -2.6125) (size 0.25 5.175) (layers "In2.Cu")
    (zone_connect 2) (tstamp 928ccc1b-2466-4da6-9d24-f081779370d5))
  (pad "G" smd rect (at 15 -2.6125) (size 0.25 5.175) (layers "F.Cu")
    (zone_connect 2) (tstamp 928ccc1b-2466-4da6-9d24-f081779370d5))
  (pad "G" smd rect (at 0.15 -0.5825) (size 0.25 1.115) (layers "In1.Cu")
    (zone_connect 2) (tstamp f0d2672a-b7eb-40be-8fb2-4c000cfb7630))
  (pad "G" smd rect (at 0.15 -6.6325) (size 0.25 6.185) (layers "In1.Cu")
    (zone_connect 2) (tstamp f0d2672a-b7eb-40be-8fb2-4c000cfb7630))
  (pad "G" smd rect (at 0.15 -0.5825) (size 0.25 1.115) (layers "In2.Cu")
    (zone_connect 2) (tstamp f0d2672a-b7eb-40be-8fb2-4c000cfb7630))
  (pad "G" smd rect (at 0.15 -0.5825) (size 0.25 1.115) (layers "B.Cu")
    (zone_connect 2) (tstamp f0d2672a-b7eb-40be-8fb2-4c000cfb7630))
  (pad "G" smd rect (at 0.15 -6.6325) (size 0.25 6.185) (layers "In2.Cu")
    (zone_connect 2) (tstamp f0d2672a-b7eb-40be-8fb2-4c000cfb7630))
  (pad "G" smd rect (at 0.15 -6.6325) (size 0.25 6.185) (layers "F.Cu")
    (zone_connect 2) (tstamp f0d2672a-b7eb-40be-8fb2-4c000cfb7630))
  (pad "G" smd rect (at 0.15 -0.5825) (size 0.25 1.115) (layers "F.Cu")
    (zone_connect 2) (tstamp f0d2672a-b7eb-40be-8fb2-4c000cfb7630))
  (pad "G" smd rect (at 0.15 -6.6325) (size 0.25 6.185) (layers "B.Cu")
    (zone_connect 2) (tstamp f74ebb23-03c7-41eb-b612-570549717c22))
  (pad "W1" thru_hole circle (at 0.375 -2.84 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -49.999999) (zone_connect 2) (tstamp 44ee88d9-be56-4075-81fb-237421c52eab))
  (pad "W2" thru_hole circle (at 0.375 -1.84 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -49.999999) (zone_connect 2) (tstamp ceffc181-ce7b-4d6a-943c-da8ce58a15b8))
  (zone (net 0) (net_name "") (layers *.Cu) (tstamp d6297a76-ec6a-469c-b67a-7ca60a71b084) (hatch edge 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (pads allowed) (copperpour not_allowed) (footprints allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 15 -0.2)
        (xy 0.1 -0.2)
        (xy 0.1 -9.6)
        (xy 15 -9.6)
      )
    )
  )
)