(module TSOT-23-6 (layer F.Cu) (tedit 60130018)
  (pad 1 smd roundrect (at -1.2999974 -0.9500108 270.0) (size 0.55 1.1) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
  (pad 2 smd roundrect (at -1.2999974 -0.0 270.0) (size 0.55 1.1) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
  (pad 3 smd roundrect (at -1.2999974 0.9499854 270.0) (size 0.55 1.1) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
  (pad 4 smd roundrect (at 1.2999974 0.9499854 270.0) (size 0.55 1.1) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
  (pad 5 smd roundrect (at 1.2999974 -0.0 270.0) (size 0.55 1.1) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
  (pad 6 smd roundrect (at 1.2999974 -0.9499854 270.0) (size 0.55 1.1) (layers F.Cu F.Mask) (roundrect_rratio 0.2))
)