(module LGA12 (layer F.Cu) (tedit 65639F57)
  (pad 1 smd rect (at -0.7999983999999999 -0.7500112) (size 0.35 0.25) (layers F.Cu F.Mask))
  (pad 2 smd rect (at -0.7999983999999999 -0.2499868) (size 0.35 0.25) (layers F.Cu F.Mask))
  (pad 3 smd rect (at -0.7999983999999999 0.2499868) (size 0.35 0.25) (layers F.Cu F.Mask))
  (pad 4 smd rect (at -0.7999983999999999 0.7500112) (size 0.35 0.25) (layers F.Cu F.Mask))
  (pad 5 smd rect (at -0.2499868 0.7999983999999999 90.0) (size 0.35 0.25) (layers F.Cu F.Mask))
  (pad 6 smd rect (at 0.2499868 0.7999983999999999 90.0) (size 0.35 0.25) (layers F.Cu F.Mask))
  (pad 7 smd rect (at 0.7999983999999999 0.7500112) (size 0.35 0.25) (layers F.Cu F.Mask))
  (pad 8 smd rect (at 0.7999983999999999 0.2499868) (size 0.35 0.25) (layers F.Cu F.Mask))
  (pad 9 smd rect (at 0.7999983999999999 -0.2499868) (size 0.35 0.25) (layers F.Cu F.Mask))
  (pad 10 smd rect (at 0.7999983999999999 -0.7500112) (size 0.35 0.25) (layers F.Cu F.Mask))
  (pad 11 smd rect (at 0.2499868 -0.7999983999999999 90.0) (size 0.35 0.25) (layers F.Cu F.Mask))
  (pad 12 smd rect (at -0.2499868 -0.7999983999999999 90.0) (size 0.35 0.25) (layers F.Cu F.Mask))
)