113 lines
7.3 KiB
Plaintext
113 lines
7.3 KiB
Plaintext
(footprint "motor-driver" (version 20221018) (generator pcbnew)
|
|
(layer "F.Cu")
|
|
(property "Sheetfile" "Файл: hellen1-vr-discrete.kicad_sch")
|
|
(property "Sheetname" "")
|
|
(zone_connect 2)
|
|
(fp_text reference "REF**" (at 2.45 -9.8 unlocked) (layer "F.SilkS") hide
|
|
(effects (font (size 1 1) (thickness 0.15)))
|
|
(tstamp 88a83db3-3da2-451b-a804-145f455a30d3)
|
|
)
|
|
(fp_text value "M821" (at 9.4 -11.3 unlocked) (layer "F.Fab") hide
|
|
(effects (font (size 1 1) (thickness 0.15)))
|
|
(tstamp 6d9dadfd-2e24-498e-be2c-182fb8276bde)
|
|
)
|
|
(fp_rect (start 13.75 -9.95) (end 0.05 -0.05)
|
|
(stroke (width 0.1) (type default)) (fill none) (layer "B.SilkS") (tstamp d3057027-7da7-416e-9e8e-5afe72c6c570))
|
|
(fp_rect (start 0.05 -9.95) (end 13.75 -0.05)
|
|
(stroke (width 0.1) (type default)) (fill none) (layer "F.SilkS") (tstamp a0230190-813f-45e7-832d-e04f8baee4c5))
|
|
(pad "G" smd rect (at 0.1 -2.2 180) (size 0.2 4.4) (layers "F.Cu")
|
|
(zone_connect 2) (tstamp e25be2a8-2a13-4520-b0b6-2c099c9b8200))
|
|
(pad "G" smd rect (at 0.1 -2.2 180) (size 0.2 4.4) (layers "In1.Cu")
|
|
(zone_connect 2) (tstamp 09466103-b53c-4ffa-b862-ba993c7f5f6c))
|
|
(pad "G" smd rect (at 0.1 -2.2 180) (size 0.2 4.4) (layers "In2.Cu")
|
|
(zone_connect 2) (tstamp 8cacae5b-d74e-4d03-889b-d3e8bc82b4d4))
|
|
(pad "G" smd rect (at 0.1 -2.2 180) (size 0.2 4.4) (layers "B.Cu")
|
|
(zone_connect 2) (tstamp 68d006d7-f7d9-482d-8d54-3e0263300467))
|
|
(pad "G" smd rect (at 0.6 -0.1 270) (size 0.2 1.2) (layers "F.Cu")
|
|
(zone_connect 2) (tstamp 7c053999-1cea-4a61-9e0c-e113887613d8))
|
|
(pad "G" smd rect (at 0.6 -0.1 270) (size 0.2 1.2) (layers "In1.Cu")
|
|
(zone_connect 2) (tstamp 4f247d12-cfb7-4d28-a420-c885c707c490))
|
|
(pad "G" smd rect (at 0.6 -0.1 270) (size 0.2 1.2) (layers "In2.Cu")
|
|
(zone_connect 2) (tstamp 0d747399-61df-4c2d-9d82-ef6cd00d79c2))
|
|
(pad "G" smd rect (at 0.6 -0.1 270) (size 0.2 1.2) (layers "B.Cu")
|
|
(zone_connect 2) (tstamp 20197a8b-0a34-44e5-bdb9-7a94804e1336))
|
|
(pad "G" smd rect (at 5 -9.9 270) (size 0.2 6.8) (layers "F.Cu")
|
|
(zone_connect 2) (tstamp de0b88d8-d661-426b-8667-81a937c40de3))
|
|
(pad "G" smd rect (at 5 -9.9 270) (size 0.2 6.8) (layers "In1.Cu")
|
|
(zone_connect 2) (tstamp 87c5c4e3-e55e-4250-91bd-8fe570f7e028))
|
|
(pad "G" smd rect (at 5 -9.9 270) (size 0.2 6.8) (layers "In2.Cu")
|
|
(zone_connect 2) (tstamp 3da1f3aa-c293-4734-9165-fcd463e410c2))
|
|
(pad "G" smd rect (at 5 -9.9 270) (size 0.2 6.8) (layers "B.Cu")
|
|
(zone_connect 2) (tstamp 1e38273a-c435-4b30-81c5-59bf50872cc8))
|
|
(pad "G" smd rect (at 7.2 -0.1 270) (size 0.2 6.8) (layers "F.Cu")
|
|
(zone_connect 2) (tstamp c4ed3924-1a94-47f4-9c36-127a9bb2d69e))
|
|
(pad "G" smd rect (at 7.2 -0.1 270) (size 0.2 6.8) (layers "In1.Cu")
|
|
(zone_connect 2) (tstamp 0e07253f-be91-4076-977b-ad8e9ebcbef0))
|
|
(pad "G" smd rect (at 7.2 -0.1 270) (size 0.2 6.8) (layers "In2.Cu")
|
|
(zone_connect 2) (tstamp 71e6367d-fc14-4194-b1a8-cd799ac31868))
|
|
(pad "G" smd rect (at 7.2 -0.1 270) (size 0.2 6.8) (layers "B.Cu")
|
|
(zone_connect 2) (tstamp 947033c4-3ba0-4609-a570-61e30ed8a1bf))
|
|
(pad "G" smd rect (at 11.8 -9.9 270) (size 0.2 4) (layers "F.Cu")
|
|
(zone_connect 2) (tstamp 09388e43-37e7-49ac-a4b9-35b5e71ccc5d))
|
|
(pad "G" smd rect (at 11.8 -9.9 270) (size 0.2 4) (layers "In1.Cu")
|
|
(zone_connect 2) (tstamp c0be90e9-0b0e-4d86-9101-6ccdacb99501))
|
|
(pad "G" smd rect (at 11.8 -9.9 270) (size 0.2 4) (layers "In2.Cu")
|
|
(zone_connect 2) (tstamp 879616ce-4c51-4d31-a445-0049d9a59557))
|
|
(pad "G" smd rect (at 11.8 -9.9 270) (size 0.2 4) (layers "B.Cu")
|
|
(zone_connect 2) (tstamp 4461619b-ce78-4b84-b8f3-12d14c9d2f15))
|
|
(pad "G" smd rect (at 12.9 -0.1 270) (size 0.2 1.8) (layers "F.Cu")
|
|
(zone_connect 2) (tstamp b3e3110a-72f2-4821-a372-66f430dda880))
|
|
(pad "G" smd rect (at 12.9 -0.1 270) (size 0.2 1.8) (layers "In1.Cu")
|
|
(zone_connect 2) (tstamp d773eab2-8f97-4f3b-b1da-bfc3389ffdb6))
|
|
(pad "G" smd rect (at 12.9 -0.1 270) (size 0.2 1.8) (layers "In2.Cu")
|
|
(zone_connect 2) (tstamp 57572f50-2777-4d1c-870a-649ea1af6896))
|
|
(pad "G" smd rect (at 12.9 -0.1 270) (size 0.2 1.8) (layers "B.Cu")
|
|
(zone_connect 2) (tstamp da763114-612e-4130-a9d9-7c8b71bc3a95))
|
|
(pad "G" smd rect (at 13.7 -5 180) (size 0.2 10) (layers "F.Cu")
|
|
(zone_connect 2) (tstamp 1e0c41db-b773-49a7-8830-db30801c8ee1))
|
|
(pad "G" smd rect (at 13.7 -5 180) (size 0.2 10) (layers "In1.Cu")
|
|
(zone_connect 2) (tstamp a2de4a4a-8487-43ce-b2fe-fdefd61ad1b0))
|
|
(pad "G" smd rect (at 13.7 -5 180) (size 0.2 10) (layers "In2.Cu")
|
|
(zone_connect 2) (tstamp 6cc1164d-6e58-4674-b771-8d2504d0dcb8))
|
|
(pad "G" smd rect (at 13.7 -5 180) (size 0.2 10) (layers "B.Cu")
|
|
(zone_connect 2) (tstamp dcef3572-6dac-4d3e-ab10-4196b934c4fa))
|
|
(pad "N1" thru_hole circle (at 1.1 -9.7 90) (size 0.6 0.6) (drill 0.3) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 1aecafbc-3292-4aa4-9a3f-868f0003145d))
|
|
(pad "N2" thru_hole circle (at 9.1 -9.5 180) (size 1 1) (drill 0.7) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 4aec65fb-ca56-4f66-adf1-9ea081810da7))
|
|
(pad "S1" thru_hole circle (at 1.9 -0.5 180) (size 1 1) (drill 0.7) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 4ae9bd13-e9da-496a-94a6-95d26bc8cae4))
|
|
(pad "S2" thru_hole circle (at 3.1 -0.5 180) (size 1 1) (drill 0.7) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp e9dd454c-58a2-417f-87ae-6c2114cba837))
|
|
(pad "S3" thru_hole circle (at 11.3 -0.5 180) (size 1 1) (drill 0.7) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 513faede-79af-4f01-9ae5-c05ce36d7377))
|
|
(pad "W1" thru_hole circle (at 0.3 -9.7 90) (size 0.6 0.6) (drill 0.3) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp fd753195-9049-4b97-a0f2-e00840a701f8))
|
|
(pad "W2" thru_hole circle (at 0.3 -8.9 90) (size 0.6 0.6) (drill 0.3) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 003db23f-0df2-4e41-ae48-3633375ebead))
|
|
(pad "W3" thru_hole circle (at 0.3 -8.1 90) (size 0.6 0.6) (drill 0.3) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp d5a635b2-63fd-4a60-9a3a-dec7378143dc))
|
|
(pad "W4" thru_hole circle (at 0.3 -7.3 90) (size 0.6 0.6) (drill 0.3) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp facc568f-f626-41b9-ab3b-a609396cbcb9))
|
|
(pad "W5" thru_hole circle (at 0.3 -6.5 90) (size 0.6 0.6) (drill 0.3) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 9a5f817a-392d-4b3c-9b47-823cc41fed41))
|
|
(pad "W6" thru_hole circle (at 0.3 -5.7 90) (size 0.6 0.6) (drill 0.3) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 3238cdd6-683a-4d2d-a64c-f25950022175))
|
|
(pad "W7" thru_hole circle (at 0.3 -4.9 90) (size 0.6 0.6) (drill 0.3) (layers "*.Cu")
|
|
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 53a3cc8b-3ba0-42a9-bccc-5a2d884da259))
|
|
(zone (net 0) (net_name "") (layers "*.Cu") (tstamp 93c1c9e9-1d0c-4424-8d76-c56e20f8edb5) (hatch edge 0.508)
|
|
(connect_pads (clearance 0))
|
|
(min_thickness 0.254) (filled_areas_thickness no)
|
|
(keepout (tracks allowed) (vias allowed) (pads allowed) (copperpour not_allowed) (footprints allowed))
|
|
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
|
|
(polygon
|
|
(pts
|
|
(xy 13.7 -0.1)
|
|
(xy 0.1 -0.1)
|
|
(xy 0.1 -9.9)
|
|
(xy 13.7 -9.9)
|
|
)
|
|
)
|
|
)
|
|
)
|