66 lines
4.5 KiB
Plaintext
66 lines
4.5 KiB
Plaintext
(footprint "wbo" (version 20210126) (generator pcbnew) (layer "F.Cu")
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(tedit 60491D5E)
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(fp_text reference "REF**" (at 2.38 -15.86 unlocked) (layer "F.SilkS") hide
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 3bbb3196-d395-42e9-93c4-2cfa30650db5)
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)
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(fp_text value "M600" (at 9.02 -16 unlocked) (layer "F.Fab") hide
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp c336454c-aae3-4dad-89cd-9cf802b33056)
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)
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(fp_rect (start 39.25 -15) (end 0.1 -0.1) (layer "B.SilkS") (width 0.2) (fill none) (tstamp c71593d3-44a3-4dc7-aaf0-1a37b8b2fab0))
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(fp_rect (start 39.25 -15) (end 0.1 -0.1) (layer "F.SilkS") (width 0.2) (fill none) (tstamp b1d3ac64-b6a3-45b5-9e8e-ad509bc8209b))
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(pad "E1" thru_hole circle (at 38.8 -1.65 90) (locked) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp df94ea85-a94d-42ee-a7fc-b4779b801d8b))
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(pad "E2" thru_hole circle (at 38.8 -2.65 90) (locked) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp 55aa9eae-78d4-4780-8fa2-419fe07c9687))
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(pad "E3" thru_hole circle (at 38.8 -3.65 90) (locked) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp 06e2a557-0245-47c5-af81-6e844a55bae3))
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(pad "E4" thru_hole circle (at 38.8 -4.65 90) (locked) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp ac127143-0952-4746-8103-da8f3fe50e92))
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(pad "E5" smd circle (at 37.55 -6.8) (locked) (size 3 3) (layers "F.Cu") (tstamp 13405baf-e4f1-4546-a51a-9e772a859ab7))
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(pad "E6" smd circle (at 37.55 -10.3) (locked) (size 3 3) (layers "F.Cu") (tstamp d12823b6-7330-459e-96d5-f92299928c9a))
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(pad "G" smd rect (at 39.175 -10.175) (size 0.25 9.75) (layers "B.Cu")
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(zone_connect 2) (tstamp 02dc75bd-aabb-4706-bac4-b4cab27df768))
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(pad "G" smd rect (at 0.175 -2.575) (size 0.25 5.05) (layers "B.Cu")
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(zone_connect 2) (tstamp 06c509e1-5174-421e-ab08-df94ce0d19e8))
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(pad "G" smd rect (at 0.175 -8.525) (size 0.25 2.25) (layers "B.Cu")
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(zone_connect 2) (tstamp 2ad180d1-7c43-4b56-8fbd-9e4f306e1594))
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(pad "G" smd rect (at 39.175 -13.575) (size 0.25 2.95) (layers "F.Cu")
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(zone_connect 2) (tstamp 34d9d2f7-268a-4994-8d5b-7a7defb4e42a))
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(pad "G" smd rect (at 0.175 -2.575) (size 0.25 5.05) (layers "F.Cu")
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(zone_connect 2) (tstamp 427551ff-0943-4349-abe6-0de7da87ad35))
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(pad "G" smd rect (at 0.175 -13.5) (size 0.25 3.1) (layers "F.Cu")
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(zone_connect 2) (tstamp 532d131f-0458-4b5a-8c7b-711b7a6ca528))
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(pad "G" smd rect (at 19.675 -14.925 90) (size 0.25 39.25) (layers "F.Cu")
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(zone_connect 2) (tstamp 5e7b3313-556c-4686-9d59-5b9869c06437))
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(pad "G" smd rect (at 19.675 -0.175 90) (size 0.25 39.25) (layers "B.Cu")
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(zone_connect 2) (tstamp 6208088b-1ef9-4785-8859-37c2d5fb4d09))
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(pad "G" smd rect (at 39.175 -0.525) (size 0.25 0.95) (layers "B.Cu")
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(zone_connect 2) (tstamp 66c04782-a447-4d7f-8b67-7941e4ce2d2a))
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(pad "G" smd rect (at 0.175 -13.5) (size 0.25 3.1) (layers "B.Cu")
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(zone_connect 2) (tstamp 6bc071eb-b3e5-40b4-aaef-351dc6e36453))
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(pad "G" smd rect (at 19.675 -14.925 90) (size 0.25 39.25) (layers "B.Cu")
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(zone_connect 2) (tstamp 7546cae8-0430-4c13-b9a1-c5c2e867e80c))
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(pad "G" smd rect (at 0.175 -8.525) (size 0.25 2.25) (layers "F.Cu")
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(zone_connect 2) (tstamp beee0d02-ba47-4a0c-a558-f6c6f9fa9e4f))
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(pad "G" smd rect (at 19.675 -0.175 90) (size 0.25 39.25) (layers "F.Cu")
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(zone_connect 2) (tstamp c86ff3cd-0649-48ad-9dd2-082e6511b4f0))
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(pad "G" smd rect (at 39.175 -0.525) (size 0.25 0.95) (layers "F.Cu")
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(zone_connect 2) (tstamp da1993a8-3ffb-4c80-bf92-1d10d0c3398e))
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(pad "W1" thru_hole circle (at 0.55 -11.3 90) (locked) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp b2d41e19-8050-4331-adf8-84107e5a7599))
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(pad "W2" thru_hole circle (at 0.55 -10.3 90) (locked) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp a50d5a68-d0c1-48fb-983c-95cbe23e1236))
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(pad "W3" thru_hole circle (at 0.55 -6.75 90) (locked) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp b096beef-fa9d-41b7-a576-961ce3f5cde5))
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(pad "W4" thru_hole circle (at 0.55 -5.75 90) (locked) (size 0.7 0.7) (drill 0.3) (layers *.Cu) (tstamp ca51a353-6225-4047-8a22-0cf23634991e))
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(zone (net 0) (net_name "") (layers *.Cu) (tstamp 87fa9153-b479-4d9c-b0d5-b99127cabe93) (hatch edge 0.508)
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(connect_pads (clearance 0))
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(min_thickness 0.254)
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(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
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(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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(polygon
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(pts
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(xy 39.175 -0.175)
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(xy 0.175 -0.2)
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(xy 0.175 -14.925)
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(xy 39.175 -14.925)
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)
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)
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)
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)
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