84 lines
6.9 KiB
Plaintext
84 lines
6.9 KiB
Plaintext
(footprint "module-dinput4-0.1" locked (layer "F.Cu")
|
|
(tedit 0) (tstamp 0bcc70e2-5556-4a16-8460-532c7e9f6c79)
|
|
(at 142.5261 107.6286)
|
|
(zone_connect 2)
|
|
(fp_text reference "M" (at 0.127 -6.0198 unlocked) (layer "F.SilkS") hide
|
|
(effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
|
|
(tstamp 5d83030a-3b22-4487-a776-c606b8291803)
|
|
)
|
|
(fp_text value "Module-dinput4-0.1" (at -4.9911 2.4003 unlocked) (layer "F.SilkS") hide
|
|
(effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
|
|
(tstamp 4c95f86c-4c69-4bd5-a4a7-11b8f0e6e712)
|
|
)
|
|
(fp_line (start 0.1 -0.125) (end 0.1 -5.025) (layer "B.SilkS") (width 0.2) (tstamp 9c0871e8-14c7-463a-9502-d9343cef7c57))
|
|
(fp_line (start 0.1 -0.125) (end 11.85 -0.125) (layer "B.SilkS") (width 0.2) (tstamp c71f5523-a61c-4b91-bd20-be3ced2e260e))
|
|
(fp_line (start 11.85 -0.125) (end 11.85 -5.025) (layer "B.SilkS") (width 0.2) (tstamp f2288ed6-4387-4d28-a18a-fbbfc1eb7ef3))
|
|
(fp_line (start 0.1 -5.125) (end 11.85 -5.125) (layer "B.SilkS") (width 0.2) (tstamp f4ebdd72-86f2-46c9-b096-9726ded071f7))
|
|
(fp_line (start 0.1 -0.125) (end 11.85 -0.125) (layer "F.SilkS") (width 0.2) (tstamp 32af2eb3-a09e-4c90-b3ac-75e128d5863f))
|
|
(fp_line (start 0.1 -0.125) (end 0.1 -5.025) (layer "F.SilkS") (width 0.2) (tstamp 8f1365dc-d9c8-4c2b-bd82-58bc3bde1839))
|
|
(fp_line (start 0.1 -5.125) (end 11.85 -5.125) (layer "F.SilkS") (width 0.2) (tstamp b59f551a-8f56-4793-a180-28b476543338))
|
|
(fp_line (start 11.85 -0.125) (end 11.85 -5.025) (layer "F.SilkS") (width 0.2) (tstamp ceecbb30-6bd4-4033-9009-4b34afb355c2))
|
|
(pad "G" smd oval (at 11.750002 -2.650007 180) (locked) (size 0.2 5.1) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 32c90a39-aa31-41eb-93ea-0ec39ce1a912))
|
|
(pad "G" smd oval (at 6.259767 -5.125 90) (locked) (size 0.2 11.1) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 33db1ab4-fe5f-4789-9a04-2994ae92e1d0))
|
|
(pad "G" smd oval (at 6.250003 -0.199997 90) (locked) (size 0.2 11.1) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp f68d08a4-0ccc-4189-9a57-9a72679c77b1))
|
|
(pad "J1" smd oval (at 10.975012 -3.374977 270) (locked) (size 0.2 0.95) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp f0bcf5fa-a89e-4be0-9d49-7970224687b0))
|
|
(pad "J2" smd oval (at 10.975012 -2.499975 270) (locked) (size 0.2 0.95) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 6caa1cb6-ec05-4b2c-81f6-29f59e0bb569))
|
|
(pad "J3" smd oval (at 10.975012 -1.699976 270) (locked) (size 0.2 0.95) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp d5549b89-b04e-4323-9549-454b7304d085))
|
|
(pad "J4" smd oval (at 10.975012 -0.824974 270) (locked) (size 0.2 0.95) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 0cf8cf7d-8c1e-45ec-8c61-26dad89a00ad))
|
|
(pad "V1" thru_hole circle (at 1.374996 -2.768016 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
|
|
(solder_paste_margin -50) (zone_connect 2) (tstamp 0afb9639-ebde-4cfd-a264-6f55fa81fdc7))
|
|
(pad "V2" thru_hole circle (at 8.650013 -3.374977 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
|
|
(solder_paste_margin -50) (zone_connect 2) (tstamp 477e9375-a24e-4698-b641-1f683a79d719))
|
|
(pad "V3" thru_hole circle (at 8.650013 -2.524976 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
|
|
(solder_paste_margin -50) (zone_connect 2) (tstamp c4fcaa27-4f39-4bbe-a636-5de812c8ff9c))
|
|
(pad "V4" thru_hole circle (at 8.650013 -1.674975 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
|
|
(solder_paste_margin -50) (zone_connect 2) (tstamp bce4abda-95f3-487c-92f6-5c203c570123))
|
|
(pad "V5" thru_hole circle (at 8.650013 -0.824974 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
|
|
(solder_paste_margin -50) (zone_connect 2) (tstamp e7153ba7-7243-4779-9e39-0d902be5f6f5))
|
|
(pad "V6" thru_hole circle (at 10.099139 -3.98638 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
|
|
(solder_paste_margin -50) (zone_connect 2) (tstamp 0eab89ca-67f3-44d0-9678-25ce97a60913))
|
|
(pad "V6" smd oval (at 10.2 -2.325012 180) (locked) (size 0.2 3.5) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 9b8dfeff-29d3-47ea-ac0f-52052694a6de))
|
|
(pad "W1" thru_hole circle (at 0.249974 -0.825005 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
|
|
(solder_paste_margin -50) (zone_connect 2) (tstamp b1c83111-db3e-4502-9a35-63f89c758db2))
|
|
(pad "W1" smd oval (at 0.249974 -0.875007 270) (locked) (size 0.25 0.5) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp cd71e3a3-0a64-43d3-b77f-c55f14cee943))
|
|
(pad "W2" smd oval (at 0.249974 -2.17501 270) (locked) (size 0.25 0.5) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 36677260-c048-4642-9fdf-77c07c42042b))
|
|
(pad "W2" thru_hole circle (at 0.249974 -2.225012 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
|
|
(solder_paste_margin -50) (zone_connect 2) (tstamp d4a6fd7c-dff6-4294-bcb3-753fc406d808))
|
|
(pad "W3" thru_hole circle (at 0.249974 -3.300004 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
|
|
(solder_paste_margin -50) (zone_connect 2) (tstamp 4c664586-9f34-4c56-a49e-063822f95b33))
|
|
(pad "W3" smd oval (at 0.249974 -3.350006 270) (locked) (size 0.25 0.5) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 66bdec26-0a18-430d-9f97-33e00bd8767b))
|
|
(pad "W4" smd oval (at 0.249974 -4.650008 270) (locked) (size 0.25 0.5) (layers "F.Cu" "F.Paste")
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 14152c9b-c725-4916-b3d0-81439b28204c))
|
|
(pad "W4" thru_hole circle (at 0.249974 -4.700011 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
|
|
(solder_paste_margin -50) (zone_connect 2) (tstamp 820c2e40-dc18-42c2-87f9-a46fca2b7229))
|
|
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 1a368ec0-0745-4fcd-8e39-ccb502d019df) (hatch edge 0.2)
|
|
(connect_pads (clearance 0))
|
|
(min_thickness 0.254) (filled_areas_thickness no)
|
|
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
|
|
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
|
|
(polygon
|
|
(pts
|
|
(xy 142.525564 107.6036)
|
|
(xy 142.525564 106.507586)
|
|
(xy 142.525564 102.373279)
|
|
(xy 143.2761 102.373279)
|
|
(xy 143.2761 102.5036)
|
|
(xy 154.2761 102.5036)
|
|
(xy 154.2761 107.4536)
|
|
(xy 143.2761 107.4536)
|
|
(xy 143.2761 107.6036)
|
|
)
|
|
)
|
|
)
|
|
) |