372 lines
32 KiB
Plaintext
372 lines
32 KiB
Plaintext
(footprint "module-mcu-0.2" locked (layer "F.Cu")
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(tedit 0) (tstamp 842806ea-3934-4cda-9414-33ddfe6dec7f)
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|
(at 125.2636 123.6786)
|
|
(fp_text reference "M" (at -37.0967 -47.2821 unlocked) (layer "F.SilkS") hide
|
|
(effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
|
|
(tstamp 4beb25a1-84f4-40f3-a1ee-6e09ca0b88a5)
|
|
)
|
|
(fp_text value "Module-mcu-0.2" (at -37.0967 2.2987 unlocked) (layer "F.SilkS") hide
|
|
(effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
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|
(tstamp 6f9ab393-263a-4e84-bd24-0e2feb402baf)
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)
|
|
(fp_line (start 44.675 -36.55) (end 46.200002 -36.55) (layer "B.SilkS") (width 0.2) (tstamp 0a62faad-f5c4-4cd0-960d-f7cdd30e607a))
|
|
(fp_line (start 46.200002 -36.55) (end 46.424202 -36.3258) (layer "B.SilkS") (width 0.2) (tstamp 153d227e-924f-4b72-87b3-ae1dfaf2c789))
|
|
(fp_line (start 0.669089 -0.100988) (end 46.081775 -0.100993) (layer "B.SilkS") (width 0.2) (tstamp 19a1f240-5975-4ebd-ba73-a7332e293dc2))
|
|
(fp_line (start 0.099997 -36.762362) (end 0.1 -0.670077) (layer "B.SilkS") (width 0.2) (tstamp 33d3d913-48d3-45ea-b44e-fe54d1a88f07))
|
|
(fp_line (start 0.1 -0.670077) (end 0.669089 -0.100988) (layer "B.SilkS") (width 0.2) (tstamp 606f2868-7aca-4cc4-9dd0-cb4cbfab9c20))
|
|
(fp_line (start 0.587634 -37.25) (end 43.975002 -37.25) (layer "B.SilkS") (width 0.2) (tstamp 6724762d-cbf1-40bb-a33a-aa3934ffbffd))
|
|
(fp_line (start 46.424202 -36.3258) (end 46.42421 -0.443428) (layer "B.SilkS") (width 0.2) (tstamp 9ba3f8ca-94ab-4b36-9bc5-bc3d9df04085))
|
|
(fp_line (start 0.099997 -36.762362) (end 0.587634 -37.25) (layer "B.SilkS") (width 0.2) (tstamp a134ad78-c345-466b-9111-7f591ce5ef50))
|
|
(fp_line (start 46.081775 -0.100993) (end 46.42421 -0.443428) (layer "B.SilkS") (width 0.2) (tstamp f5358dcb-86a8-4875-90c2-007ea3f51e94))
|
|
(fp_line (start 43.975002 -37.25) (end 44.675 -36.55) (layer "B.SilkS") (width 0.2) (tstamp fffd88b2-1628-4ecf-8719-87f338d756de))
|
|
(fp_line (start 0.610405 -37.257246) (end 43.967753 -37.257246) (layer "F.SilkS") (width 0.2) (tstamp 169c066c-3c34-4844-9d97-787cfedbf3fe))
|
|
(fp_line (start 0.672259 -0.100988) (end 46.083314 -0.100988) (layer "F.SilkS") (width 0.2) (tstamp 42aff6de-c06a-407a-8eb5-cf40005f89dc))
|
|
(fp_line (start 0.096388 -36.743229) (end 0.610405 -37.257246) (layer "F.SilkS") (width 0.2) (tstamp 4e35bdf6-6cab-4802-a4ba-09b025f3bc3b))
|
|
(fp_line (start 0.096388 -36.743229) (end 0.09639 -0.676857) (layer "F.SilkS") (width 0.2) (tstamp 7858f298-89ef-4805-a532-53ee117667eb))
|
|
(fp_line (start 44.674998 -36.55) (end 46.212496 -36.55) (layer "F.SilkS") (width 0.2) (tstamp 79454d8c-13a9-4fd3-b337-3056b83de2e5))
|
|
(fp_line (start 46.212496 -36.55) (end 46.425 -36.337497) (layer "F.SilkS") (width 0.2) (tstamp 949e7d7a-0710-4b1f-aca4-200aa8f8d244))
|
|
(fp_line (start 46.083314 -0.100988) (end 46.425002 -0.442676) (layer "F.SilkS") (width 0.2) (tstamp 9acaacde-9092-40ee-a016-ab9430ff74fa))
|
|
(fp_line (start 46.425 -36.337497) (end 46.425002 -0.442676) (layer "F.SilkS") (width 0.2) (tstamp a63e2cf7-8d6d-402b-a96f-d09cc37b36d2))
|
|
(fp_line (start 43.967753 -37.257246) (end 44.674998 -36.55) (layer "F.SilkS") (width 0.2) (tstamp aa45ce7d-cdda-4a94-bf06-70d9ca79b99e))
|
|
(fp_line (start 0.09639 -0.676857) (end 0.672259 -0.100988) (layer "F.SilkS") (width 0.2) (tstamp b8f174f3-c0b3-4773-b96a-2834a9ec66ad))
|
|
(pad "E1" smd roundrect (at 46.001998 -32.324998 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 64556ea3-4c42-4bcf-a6d1-69f30e4913db))
|
|
(pad "E2" smd roundrect (at 46.001998 -31.665 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 5d85f225-6c44-495c-abfa-857b69f64fd7))
|
|
(pad "E3" smd roundrect (at 46.001998 -31.004995 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp a9a966ed-c621-4342-8835-33ce454447ed))
|
|
(pad "E4" smd roundrect (at 46.001998 -30.345 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 0b57abe9-0864-4168-9485-f106861240aa))
|
|
(pad "E5" smd roundrect (at 46.001998 -29.684998 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 6cb5ec3a-f7b4-484e-a0ef-f79045c9cff1))
|
|
(pad "E6" smd roundrect (at 46.001998 -26.384997 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp ef77d3d9-4dcb-47bd-83df-abb9550581b1))
|
|
(pad "E7" smd roundrect (at 46.001998 -25.724996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp c86921e3-0fd9-452a-8176-9848ed1b8b5b))
|
|
(pad "E8" smd roundrect (at 46.001998 -25.064994 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 89cd4cbc-f171-4fe3-abfa-914c84bb1efe))
|
|
(pad "E9" smd roundrect (at 46.001998 -24.404996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp afeca8ff-1188-4c93-8d60-1979980d7f0e))
|
|
(pad "E10" smd roundrect (at 46.001998 -23.744994 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 962ea812-8e26-439c-a840-2dbde2fe9493))
|
|
(pad "E11" smd roundrect (at 46.001998 -23.084996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp fe49902f-39e1-47b2-96b0-3a34d11f21f4))
|
|
(pad "E12" smd roundrect (at 46.001998 -22.424995 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp b577b9dc-fee2-4e63-acd8-49fc7de1318a))
|
|
(pad "E13" smd roundrect (at 46.001998 -21.764996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 4b738308-e135-4165-9493-6e32e6dea6cd))
|
|
(pad "E14" smd roundrect (at 46.001998 -21.104995 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 11510baf-acf4-487d-b5d1-f1a47d51999b))
|
|
(pad "E15" smd roundrect (at 46.001998 -20.444996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 97b8ac84-e26b-4562-8583-179ab65531fb))
|
|
(pad "E16" smd roundrect (at 46.001998 -19.784995 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 97fde7da-86bb-4e82-a702-4a1151090c63))
|
|
(pad "E17" smd roundrect (at 46.001998 -19.124996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp af57c27c-126e-4206-9029-0a9167c29293))
|
|
(pad "E18" smd roundrect (at 46.001998 -18.464995 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp f6e3aaa0-8091-4c79-8ca9-b99aebe34d49))
|
|
(pad "E19" smd roundrect (at 46.001998 -17.804996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 2968c9f0-6aca-4024-97e3-40b5a2e0c627))
|
|
(pad "E20" smd roundrect (at 46.001998 -17.144995 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 4e648fc7-0cd7-43f9-8915-cb4862b375c7))
|
|
(pad "E21" smd roundrect (at 46.001998 -16.484996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 5e3740e2-4b91-4288-87fc-492eec4381a4))
|
|
(pad "E22" smd roundrect (at 46.001998 -15.824995 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 2651179f-49d3-4503-8e33-0ce66fc36cbd))
|
|
(pad "E23" smd roundrect (at 46.001998 -15.164996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp e46fc497-dcc4-47e9-a1c8-5576afb089b1))
|
|
(pad "E24" smd roundrect (at 46.001998 -14.504995 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 21d986c2-a4c3-4c79-9989-254b23933433))
|
|
(pad "E25" smd roundrect (at 46.001998 -13.844996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp e8e5c944-55bc-4ec2-8ea8-1e118bd8ff37))
|
|
(pad "E26" smd roundrect (at 46.001998 -13.184995 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 979b74c7-eb17-4e18-bd88-3f3aa8563579))
|
|
(pad "E27" smd roundrect (at 46.001998 -12.524997 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 198ddc08-3411-44b8-bbb7-0be3853281ef))
|
|
(pad "E28" smd roundrect (at 46.001998 -11.864995 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 5c0e91e4-e569-4efb-b2c7-9e9ccc7a3e3b))
|
|
(pad "E29" smd roundrect (at 46.001998 -11.204997 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp d00e90f3-a957-4c2d-8744-838c5b6b8261))
|
|
(pad "E30" smd roundrect (at 46.001998 -10.544995 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 0d259faf-876f-487e-99c1-daf697b698fa))
|
|
(pad "E31" smd roundrect (at 46.001998 -9.884997 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp f11ca0b9-c6e2-4abc-9842-0b4d56895dd9))
|
|
(pad "E32" smd roundrect (at 46.001998 -9.224996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 5524f5d3-6131-4d9b-a02b-75760c42aade))
|
|
(pad "E33" smd roundrect (at 46.001998 -8.564997 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 2a5e6b98-8adf-426f-a25e-4744b6bf3af0))
|
|
(pad "E34" smd roundrect (at 46.001998 -7.904996 270) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 04d0882e-86a2-48b6-a76d-40866402ae1e))
|
|
(pad "N1" smd roundrect (at 12.055 -36.452 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 8f62c18c-af35-4888-a8fd-ec8f8ad5c03b))
|
|
(pad "N2" smd roundrect (at 13.375002 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 9d26fb52-f00a-473b-8a40-1f4e16b36f05))
|
|
(pad "N3" smd roundrect (at 14.695005 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 4f6a9fc3-6008-43f0-9ee4-2628fdf42114))
|
|
(pad "N4" smd roundrect (at 15.455003 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 9b1f969b-cb04-49a3-b53a-e7320b5fb42c))
|
|
(pad "N5" smd roundrect (at 16.120006 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp cf665b23-d8eb-4bf9-aa3a-8a539c193408))
|
|
(pad "N6" smd roundrect (at 16.785008 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 99c2f445-7e81-4318-aa0e-fc6e1b3562ed))
|
|
(pad "N7" smd roundrect (at 17.449998 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp a34852a4-6c3c-4a4c-a148-6fecb1b29e0a))
|
|
(pad "N8" smd roundrect (at 18.224998 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 553b5443-f578-4140-b6a2-866e57e5bda5))
|
|
(pad "N9" smd roundrect (at 19.324996 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp db9f3b18-78cf-4e7f-839a-fc59820232e4))
|
|
(pad "N10" smd roundrect (at 20.424993 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp d7a9e724-4600-4d30-8751-c9d1dd98c681))
|
|
(pad "N11" smd roundrect (at 21.524991 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 43d10e70-852d-4e66-8a20-9e3aa0912469))
|
|
(pad "N12" smd roundrect (at 22.624989 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 9945d8bf-d067-41ff-9a46-00171d413a21))
|
|
(pad "N13" smd roundrect (at 23.724987 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp f0414f1e-409e-4f4f-a214-8863b9c71d6a))
|
|
(pad "N14" smd roundrect (at 24.824985 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 142307d4-0bbc-48d1-8aff-269c81ae7012))
|
|
(pad "N15" smd roundrect (at 25.924982 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp a58e8139-b36d-41d1-8dd3-0d165e073d0c))
|
|
(pad "N16" smd roundrect (at 27.02498 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp f01b06b4-2fa1-4580-b143-9263e883dd00))
|
|
(pad "N17" smd roundrect (at 28.124978 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 125811e8-1411-4382-94cb-abcff71f2453))
|
|
(pad "N18" smd roundrect (at 29.224976 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 079236f2-ee8a-4d45-8b1b-4f346ca25832))
|
|
(pad "N19" smd roundrect (at 30.324974 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 319dd87b-7eb6-4730-9d56-8e923c5ca022))
|
|
(pad "N20" smd roundrect (at 31.424971 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 526a83a6-f973-4244-850f-1a978a3d6b40))
|
|
(pad "N21" smd roundrect (at 32.524969 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 2e9fd4d1-1fb1-4818-8440-b1cd61bc5c31))
|
|
(pad "N22" smd roundrect (at 33.624967 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 6cd2b085-ccd6-4131-9723-341187bebe9f))
|
|
(pad "N23" smd roundrect (at 34.724965 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 582e9f0c-f9ed-40bc-9ce7-d7d872c128e0))
|
|
(pad "N24" smd roundrect (at 35.824963 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp a8a0bc21-8a38-4851-a7b5-bdf95611390a))
|
|
(pad "N25" smd roundrect (at 36.92496 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp f1394a07-cfa2-4591-85c9-15321a63e57a))
|
|
(pad "N26" smd roundrect (at 38.024958 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp c0e66a09-52fb-46f7-bdeb-2315cc7df343))
|
|
(pad "N27" smd roundrect (at 39.124956 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 19ea26c7-2da4-4395-b8bc-fe27192e2eaa))
|
|
(pad "N28" smd roundrect (at 40.224954 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 21d44758-22f4-4fc1-99eb-a47c91dcb024))
|
|
(pad "N29" smd roundrect (at 41.324952 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 35d1d324-06b7-4618-aa60-6490406faefb))
|
|
(pad "N30" smd roundrect (at 42.424949 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 0c428d47-fca5-4cc7-b290-78b530b34772))
|
|
(pad "N31" smd roundrect (at 43.524947 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp f5a24ca3-686b-4229-bc88-d94bfd045598))
|
|
(pad "N32" smd roundrect (at 44.624945 -36.452) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp e5aac916-12ff-4b34-a61f-18d287c63a9b))
|
|
(pad "S1" smd roundrect (at 37.625002 -0.523) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 3d6223ac-9961-4399-b400-58641499e720))
|
|
(pad "S2" smd roundrect (at 46.225003 -36.3 45) (locked) (size 0.2 0.55) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (tstamp 018aff13-7f00-4acb-8ad4-82ab3a960b96))
|
|
(pad "S2" smd roundrect (at 44.287504 -36.787501 45) (locked) (size 0.2 1.2) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (tstamp 11982cd7-c7da-447e-9a9b-4e2a289b5f96))
|
|
(pad "S2" smd roundrect (at 36.305 -0.45 180) (locked) (size 0.25 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 1cd39277-ff7c-4846-9990-5535f40c2f40))
|
|
(pad "S2" smd roundrect (at 0.390411 -36.934595 315) (locked) (size 0.2 0.8) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (tstamp 2cc5d3b5-7d60-4c4a-8404-eab2865bf133))
|
|
(pad "S2" smd roundrect (at 0.437502 -0.462496 225) (locked) (size 0.2 0.94) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (tstamp 322d60b9-58b7-4a82-9159-a81dfd589761))
|
|
(pad "S2" smd roundrect (at 0.175003 -18.722091 180) (locked) (size 0.2 36.19) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (tstamp 47f24cae-53e7-490f-93a6-aab9ce51f077))
|
|
(pad "S2" smd roundrect (at 46.212498 -0.3375 135) (locked) (size 0.2 0.58) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (tstamp 77a7a120-9e31-4dad-b457-e4e755a58bd3))
|
|
(pad "S2" smd roundrect (at 46.35 -18.325003 180) (locked) (size 0.2 35.9) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (tstamp 97655e6f-5994-407f-bb8e-e267dbbd7ccc))
|
|
(pad "S2" smd roundrect (at 45.375002 -36.425 270) (locked) (size 0.2 1.6) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (tstamp 9fa091ac-3dc6-41f2-891f-7015b3a0ef4b))
|
|
(pad "S2" smd roundrect (at 36.305 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp a09e589e-5e66-4de5-a7eb-621e96edfaf4))
|
|
(pad "S2" smd roundrect (at 22.265409 -37.15 270) (locked) (size 0.2 43.5) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (tstamp a52b59b2-0278-45fb-9f3e-1e8a2144a34f))
|
|
(pad "S2" smd roundrect (at 23.4 -0.199997 270) (locked) (size 0.2 45.6) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
|
|
(solder_mask_margin 0.1016) (solder_paste_margin -50) (tstamp bfd36119-eca9-4d3d-bd38-e63c70efbee3))
|
|
(pad "S3" smd roundrect (at 34.984997 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 9fb8d037-d2a3-4262-9681-b9a76e431518))
|
|
(pad "S4" smd roundrect (at 33.885 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 9a1ab958-af65-41bf-ab2d-de5de866a4e6))
|
|
(pad "S5" smd roundrect (at 32.785002 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 6328ce9b-9b96-49a8-8017-67884885e663))
|
|
(pad "S6" smd roundrect (at 31.685004 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp f58b407b-2a88-46a3-8611-3cf00192e634))
|
|
(pad "S7" smd roundrect (at 30.585006 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 9891bc3a-765d-4d68-8c72-2566894ea4c4))
|
|
(pad "S8" smd roundrect (at 29.485008 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp c28d5960-4c7a-4c91-8e52-51f195dcb6ee))
|
|
(pad "S9" smd roundrect (at 28.385011 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 4a084a51-c65a-4cff-ae1b-e91a5a19a176))
|
|
(pad "S10" smd roundrect (at 27.285013 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp ba51fa8f-9950-4620-83bd-dcc6320c55a6))
|
|
(pad "S11" smd roundrect (at 26.185015 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp e8384827-9111-4852-a217-5662d226adad))
|
|
(pad "S12" smd roundrect (at 25.085017 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 277b5a14-823b-4c24-a7f6-13a9cd30f10a))
|
|
(pad "S13" smd roundrect (at 23.985019 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp df793690-97ad-47a5-89f6-35a88e713e53))
|
|
(pad "S14" smd roundrect (at 22.885022 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 059d907b-849d-47d8-9943-3f6378818072))
|
|
(pad "S15" smd roundrect (at 21.785024 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 6522b85c-54ea-4367-9202-4d97762f67ec))
|
|
(pad "S16" smd roundrect (at 20.685026 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 922b39ae-70c2-4135-802c-44eef9c88ef5))
|
|
(pad "S17" smd roundrect (at 19.585028 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp c063afd3-2e44-487c-85ec-525eca49dcb0))
|
|
(pad "S18" smd roundrect (at 18.48503 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 4d8f2e88-4405-4bc9-be9d-27020b9a66df))
|
|
(pad "S19" smd roundrect (at 17.385033 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 93afecd2-23ed-48af-a0c2-6d69030f8381))
|
|
(pad "S20" smd roundrect (at 16.285035 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp cf89bd71-daa4-4082-9e16-e45ae0187933))
|
|
(pad "S21" smd roundrect (at 15.185037 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp db77cc9d-2a8a-4235-8f54-a1a2953e2556))
|
|
(pad "S22" smd roundrect (at 14.085039 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 0bfa9476-3a6b-46bd-98aa-f7dfea50bc43))
|
|
(pad "S23" smd roundrect (at 12.985041 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 5b53930d-a7f2-4b02-b675-d756c3023fa5))
|
|
(pad "S24" smd roundrect (at 11.885044 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp e7aa0cc1-e9b7-4307-aaf4-0c37bf7327ff))
|
|
(pad "S25" smd roundrect (at 10.785046 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 153b3da1-933b-411f-963e-0c9a77f6de13))
|
|
(pad "S26" smd roundrect (at 9.685048 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 972aff64-7db2-4900-b449-05e8a5fc583e))
|
|
(pad "S27" smd roundrect (at 8.58505 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp d01a4311-5bcd-446b-a9ad-e36b61936803))
|
|
(pad "S28" smd roundrect (at 7.485052 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp f243d326-11cc-4ce9-a4e8-8c11ad25a07e))
|
|
(pad "S29" smd roundrect (at 6.385055 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 80474b89-5360-487e-ab4f-5e784988b1c9))
|
|
(pad "S30" smd roundrect (at 5.285057 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp d441e730-2eda-4bf4-8a00-38199578f8e2))
|
|
(pad "S31" smd roundrect (at 4.185059 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 7f14720b-7c88-45e6-a06f-8717096d50d7))
|
|
(pad "S32" smd roundrect (at 3.085061 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 14d2c4d7-d5bb-47ef-8a69-265ba79d0478))
|
|
(pad "S33" smd roundrect (at 1.985063 -0.523 180) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 21e8570b-e81f-4c87-9061-2cbb20dde2e3))
|
|
(pad "W1" smd roundrect (at 0.475 -30.58 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp c8020031-8475-4725-8e47-f635ca3025cb))
|
|
(pad "W2" smd roundrect (at 0.475 -31.24 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 9944456a-5510-4df8-aa9a-1c7a00ff8f14))
|
|
(pad "W3" smd roundrect (at 0.475 -31.900002 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp f8553c4d-c2c2-42be-9734-be63c4ba8eb9))
|
|
(pad "W4" smd roundrect (at 0.475 -32.560003 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 38278afe-e645-4da6-a957-5eeb8002ec79))
|
|
(pad "W5" smd roundrect (at 0.475 -33.220005 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 6d5630fa-5ad3-4f14-b853-b7e2aa856ea7))
|
|
(pad "W6" smd roundrect (at 0.475 -33.880006 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 43502624-f9b7-4084-9123-c002d88892ee))
|
|
(pad "W7" smd roundrect (at 0.475 -34.540007 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 6dc2da99-56fe-4357-b5ee-9b8b78526eeb))
|
|
(pad "W8" smd roundrect (at 0.475 -35.200008 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 55581054-7ea8-4d79-ab04-e3b36639de0f))
|
|
(pad "W9" smd roundrect (at 0.475 -35.86001 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp 6491048b-71b0-4763-9b06-9f8cb6714336))
|
|
(pad "W10" smd roundrect (at 0.475 -36.520011 90) (locked) (size 0.25 0.5) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
|
|
(solder_paste_margin -50) (tstamp f45c7dbb-21ac-4f2c-8169-d997adade114))
|
|
(zone (net 0) (net_name "") (layers "F.Cu" "In1.Cu" "In2.Cu") (tstamp c2191bb6-badc-45f5-b187-deeb836409c0) (hatch edge 0.2)
|
|
(connect_pads (clearance 0))
|
|
(min_thickness 0.254) (filled_areas_thickness no)
|
|
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
|
|
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
|
|
(polygon
|
|
(pts
|
|
(xy 125.361159 122.966166)
|
|
(xy 125.361159 86.958681)
|
|
(xy 125.791265 86.528575)
|
|
(xy 169.188574 86.528575)
|
|
(xy 169.888576 87.228576)
|
|
(xy 171.338575 87.228576)
|
|
(xy 171.6136 87.5036)
|
|
(xy 171.613604 87.5036)
|
|
(xy 171.613604 123.304872)
|
|
(xy 171.349208 123.569268)
|
|
(xy 125.945585 123.569268)
|
|
)
|
|
)
|
|
)
|
|
(zone (net 0) (net_name "") (layer "B.Cu") (tstamp 78961e5a-e1c2-4b31-9920-4ad8f8868ab8) (hatch edge 0.2)
|
|
(connect_pads (clearance 0))
|
|
(min_thickness 0.254) (filled_areas_thickness no)
|
|
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
|
|
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
|
|
(polygon
|
|
(pts
|
|
(xy 125.361159 122.966166)
|
|
(xy 125.414537 86.905303)
|
|
(xy 125.799548 86.528575)
|
|
(xy 169.188582 86.528578)
|
|
(xy 169.888583 87.228579)
|
|
(xy 171.338583 87.228579)
|
|
(xy 171.613604 87.5036)
|
|
(xy 171.6136 123.304877)
|
|
(xy 171.338529 123.579946)
|
|
(xy 171.327851 123.569268)
|
|
(xy 125.945585 123.569268)
|
|
)
|
|
)
|
|
)
|
|
(zone (net 0) (net_name "") (layer "B.Cu") (tstamp ae20f0e4-8ba5-4f6a-a3da-744f55e56229) (hatch edge 0.2)
|
|
(connect_pads (clearance 0))
|
|
(min_thickness 0.254) (filled_areas_thickness no)
|
|
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
|
|
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
|
|
(polygon
|
|
(pts
|
|
(xy 135.3886 86.603602)
|
|
(xy 170.2636 86.603602)
|
|
(xy 170.2636 87.4036)
|
|
(xy 170.2386 87.4286)
|
|
(xy 135.3886 87.4286)
|
|
)
|
|
)
|
|
)
|
|
(zone (net 0) (net_name "") (layer "B.Cu") (tstamp b42fd71b-4703-4a38-9896-497c7724df57) (hatch edge 0.2)
|
|
(connect_pads (clearance 0))
|
|
(min_thickness 0.254) (filled_areas_thickness no)
|
|
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
|
|
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
|
|
(polygon
|
|
(pts
|
|
(xy 171.0386 90.8786)
|
|
(xy 171.5386 90.8786)
|
|
(xy 171.5386 94.3536)
|
|
(xy 171.0386 94.3536)
|
|
)
|
|
)
|
|
)
|
|
(zone (net 0) (net_name "") (layer "B.Cu") (tstamp d339a99b-df85-4883-b156-33a636b7e1d8) (hatch edge 0.2)
|
|
(connect_pads (clearance 0))
|
|
(min_thickness 0.254) (filled_areas_thickness no)
|
|
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
|
|
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
|
|
(polygon
|
|
(pts
|
|
(xy 126.94252 122.878802)
|
|
(xy 163.613401 122.878802)
|
|
(xy 163.613602 122.878602)
|
|
(xy 163.613602 123.4286)
|
|
(xy 126.929439 123.4286)
|
|
)
|
|
)
|
|
)
|
|
(zone (net 0) (net_name "") (layer "B.Cu") (tstamp fc6ddea1-a575-4706-9699-5c63a0cc0c3e) (hatch edge 0.2)
|
|
(connect_pads (clearance 0))
|
|
(min_thickness 0.254) (filled_areas_thickness no)
|
|
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
|
|
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
|
|
(polygon
|
|
(pts
|
|
(xy 170.9386 96.7536)
|
|
(xy 171.5386 96.7536)
|
|
(xy 171.5386 116.1036)
|
|
(xy 170.9136 116.1036)
|
|
)
|
|
)
|
|
)
|
|
) |