hellen-one/modules/stlink/0.1/stlink.kicad_mod

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(footprint "module-stlink-0.1" locked (layer "F.Cu")
(tedit 0) (tstamp f0fdd39c-25e5-4031-bc71-d04af5268c84)
(at 0 0)
(zone_connect 2)
(fp_text reference "M" (at 0.254 -11.3538 unlocked) (layer "F.SilkS") hide
(effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
(tstamp af6947b8-a55f-456a-93b0-fe49b8c519ac)
)
(fp_text value "Module-stlink-0.1" (at -10.3505 2.2733 unlocked) (layer "F.SilkS") hide
(effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
(tstamp 5a395859-3462-4922-8956-6d81ed401f0f)
)
(fp_line (start 0.099908 -9.049992) (end 1.549908 -10.499992) (layer "B.SilkS") (width 0.2) (tstamp 02a8d06f-ecac-4dd5-92da-65ffc0e8d6de))
(fp_line (start 1.625958 -0.098943) (end 17.973858 -0.098943) (layer "B.SilkS") (width 0.2) (tstamp 050e98f3-5320-41c8-acb5-b8da2fde170a))
(fp_line (start 17.973858 -0.098943) (end 18.107919 -0.233004) (layer "B.SilkS") (width 0.2) (tstamp 09f2074a-6d41-40db-9a9b-3b04c3b1eab1))
(fp_line (start 1.549908 -10.499992) (end 18.106916 -10.499994) (layer "B.SilkS") (width 0.2) (tstamp 2bce840f-5243-4ea2-a218-5ec0be9b8b45))
(fp_line (start 0.099908 -1.624993) (end 0.099908 -9.049992) (layer "B.SilkS") (width 0.2) (tstamp 6580544e-e8c2-4ac4-b9b7-c0b56b60d0de))
(fp_line (start 18.106916 -10.499994) (end 18.133322 -10.473588) (layer "B.SilkS") (width 0.2) (tstamp 68c1377f-615f-40bc-98fa-66783dc74cba))
(fp_line (start 18.107919 -0.233004) (end 18.133322 -10.473588) (layer "B.SilkS") (width 0.2) (tstamp 87c6b6f5-8e33-4614-bfa0-691f3f445d43))
(fp_line (start 0.099908 -1.624993) (end 1.625958 -0.098943) (layer "B.SilkS") (width 0.2) (tstamp c0af49fb-9cf8-45fa-97aa-73d0917ddfda))
(fp_line (start 17.973939 -0.098943) (end 18.108 -0.233004) (layer "F.SilkS") (width 0.2) (tstamp 3a8d871e-0c95-42da-94cc-73fe193c5ffe))
(fp_line (start 0.09999 -1.624993) (end 0.09999 -9.049992) (layer "F.SilkS") (width 0.2) (tstamp 419749b0-997d-4212-81e6-8d459be6355c))
(fp_line (start 1.549989 -10.499992) (end 18.106997 -10.499994) (layer "F.SilkS") (width 0.2) (tstamp 4ab28e9c-4181-4b06-87bf-64a38608a352))
(fp_line (start 18.106997 -10.499994) (end 18.133403 -10.473588) (layer "F.SilkS") (width 0.2) (tstamp 5ba94825-a431-4e47-8a45-696eaa04e9dc))
(fp_line (start 0.09999 -9.049992) (end 1.549989 -10.499992) (layer "F.SilkS") (width 0.2) (tstamp 728e0c34-3ab5-4142-bea2-f5a9c907515c))
(fp_line (start 0.09999 -1.624993) (end 1.626039 -0.098943) (layer "F.SilkS") (width 0.2) (tstamp 9f2c7760-b523-4c43-b0ce-f5bef4ea4401))
(fp_line (start 18.108 -0.233004) (end 18.133403 -10.473588) (layer "F.SilkS") (width 0.2) (tstamp c7611e29-eb7c-4e66-b99e-db70a60f7941))
(fp_line (start 1.626039 -0.098943) (end 17.973939 -0.098943) (layer "F.SilkS") (width 0.2) (tstamp e8521ee9-494d-42ef-b72b-cdd18f9073d0))
(pad "G" smd roundrect (at 0.947981 -0.952002 225) (locked) (size 0.2 2.240001) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -49.999999) (zone_connect 2) (tstamp 10a632df-f92a-41fb-b7d7-4c473f54944f))
(pad "G" smd roundrect (at 9.853978 -0.229011 270) (locked) (size 0.2 16.46) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -49.999999) (zone_connect 2) (tstamp 12e26749-6c2b-4e93-aa2a-3a38e3b17a04))
(pad "G" smd roundrect (at 0.224991 -5.322494 180) (locked) (size 0.2 7.49) (layers "B.Cu" "B.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -49.999999) (zone_connect 2) (tstamp 19effae0-29c1-4380-b8c2-f2261d5e0520))
(pad "G" smd roundrect (at 9.820554 -10.406637 270) (locked) (size 0.2 16.55) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -49.999999) (zone_connect 2) (tstamp 4dbd02d2-a394-44c3-a6dc-d65592d38a39))
(pad "G" smd roundrect (at 0.935424 -9.700943 135) (locked) (size 0.2 2.190001) (layers "B.Cu" "B.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -49.999999) (zone_connect 2) (tstamp 5584767e-f3e8-4243-a7f0-5a44f12b48d9))
(pad "G" smd roundrect (at 18.017475 -5.811825) (locked) (size 0.2 9.369999) (layers "B.Cu" "B.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -49.999999) (zone_connect 2) (tstamp 61d9170d-d219-4361-bdee-40ac8c91ff7c))
(pad "G" smd roundrect (at 0.224991 -5.322494 180) (locked) (size 0.2 7.49) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -49.999999) (zone_connect 2) (tstamp 7d180686-cd31-4183-9851-c09dc60f29d1))
(pad "G" smd roundrect (at 18.017475 -5.311828) (locked) (size 0.2 10.37) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -49.999999) (zone_connect 2) (tstamp 80927b0b-6ab4-4c10-b010-d1f635d03bf6))
(pad "G" smd roundrect (at 0.935424 -9.700943 135) (locked) (size 0.2 2.190001) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -49.999999) (zone_connect 2) (tstamp 859d950a-12a2-4247-926b-da802f8dc01e))
(pad "G" smd roundrect (at 9.820554 -10.406637 270) (locked) (size 0.2 16.55) (layers "B.Cu" "B.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -49.999999) (zone_connect 2) (tstamp a168ed53-7eac-4ae0-aa41-ab18e1d26264))
(pad "G" smd roundrect (at 0.447957 -1.452027 225) (locked) (size 0.2 0.800001) (layers "B.Cu" "B.Paste") (roundrect_rratio 0.5)
(solder_mask_margin 0.1016) (solder_paste_margin -49.999999) (zone_connect 2) (tstamp b421184b-6ef6-4ad3-b7fe-5003a1f8c469))
(pad "N1" smd roundrect (at 11.724991 -0.399994 180) (locked) (size 0.25 0.499999) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 5ffe2381-3586-4e92-95ef-c845013018e6))
(pad "N2" smd roundrect (at 10.624993 -0.399994 180) (locked) (size 0.25 0.499999) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 2df09599-40b2-488b-aa6e-bd75eee583e9))
(pad "N3" smd roundrect (at 9.524995 -0.399994 180) (locked) (size 0.25 0.499999) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp e08be011-7f21-4ca3-a189-15b93254b790))
(pad "N4" smd roundrect (at 8.424997 -0.399994 180) (locked) (size 0.25 0.499999) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 3b5e22a8-7ef4-446a-9212-2484ffda212b))
(pad "N5" smd roundrect (at 7.324999 -0.399994 180) (locked) (size 0.25 0.499999) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 8e6f209f-07a3-409d-877a-0bf500570c27))
(pad "N6" smd roundrect (at 6.225002 -0.399994 180) (locked) (size 0.25 0.499999) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.5)
(solder_paste_margin -49.999999) (zone_connect 2) (tstamp 33da308b-a387-41a8-8e5a-48353b3b170e))
(zone (net 0) (net_name "") (layers "F.Cu" "In1.Cu" "In2.Cu") (tstamp fe8e47a3-c22f-483a-b9c9-ad70102515af) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
(polygon
(pts
(xy 0.225001 -1.675)
(xy 0.225001 -8.975001)
(xy 1.649999 -10.4)
(xy 18 -10.4)
(xy 18.025001 -10.374998)
(xy 18.025001 -0.25)
(xy 1.699999 -0.25)
)
)
)
(zone (net 0) (net_name "") (layer "B.Cu") (tstamp d17a68f5-bdb0-404c-8f9b-43b90d3e5e3f) (hatch edge 0.2)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
(fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
(polygon
(pts
(xy 0.677794 -1.220988)
(xy 0.220838 -1.677944)
(xy 0.220838 -8.981277)
(xy 0.219212 -8.982903)
(xy 1.642019 -10.405709)
(xy 17.951051 -10.405709)
(xy 17.977068 -10.379692)
(xy 17.977068 -1.258877)
(xy 18.299991 -1.258877)
(xy 18.299991 0.074994)
(xy 1.574991 0.074994)
(xy 0.524993 -0.975004)
(xy 0.52499 -0.975004)
)
)
)
)