59 lines
4.0 KiB
Plaintext
59 lines
4.0 KiB
Plaintext
(footprint "wbo" (version 20210126) (generator pcbnew) (layer "F.Cu")
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(tedit 6045E785)
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(fp_text reference "REF**" (at 2.38 -15.86 unlocked) (layer "F.SilkS") hide
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 48f58e10-1c09-4291-a593-42f281f8f30c)
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)
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(fp_text value "M600" (at 9.02 -16 unlocked) (layer "F.Fab") hide
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 1d98e2ab-2008-4c75-aaeb-1e3bbd36b242)
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)
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(fp_rect (start 39.25 -15) (end 0.1 -0.1) (layer "B.SilkS") (width 0.12) (fill none) (tstamp b75d0cd4-fce1-4394-9136-0ee7d14e4df6))
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(fp_rect (start 39.25 -15) (end 0.1 -0.1) (layer "F.SilkS") (width 0.12) (fill none) (tstamp da820b47-b789-4f6f-885a-0afea33ab2cd))
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(pad "E1" smd roundrect (at 38.8 -2.55 90) (locked) (size 0.25 0.5) (layers "F.Cu") (roundrect_rratio 0.5) (tstamp dafe31e1-5a4d-4adb-a037-30d5a63be7a7))
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(pad "E2" smd roundrect (at 38.8 -3.3 90) (locked) (size 0.25 0.5) (layers "F.Cu") (roundrect_rratio 0.5) (tstamp e7b459e9-17aa-4930-82f8-19fa878b1c8a))
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(pad "E3" smd roundrect (at 38.8 -4.05 90) (locked) (size 0.25 0.5) (layers "F.Cu") (roundrect_rratio 0.5) (tstamp 340972a2-c23a-42eb-8f4e-0da8af22cd67))
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(pad "E4" smd roundrect (at 38.8 -4.8 90) (locked) (size 0.25 0.5) (layers "F.Cu") (roundrect_rratio 0.5) (tstamp 01e19645-438f-49fd-9019-4e4dd5551f24))
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(pad "E5" smd circle (at 37.55 -6.8) (locked) (size 3 3) (layers "F.Cu") (tstamp 0d3ee5c0-ef04-4da3-8b0b-a5f936f16f65))
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(pad "E6" smd circle (at 37.55 -10.3) (locked) (size 3 3) (layers "F.Cu") (tstamp 5bf2d812-fb5c-4229-8dc8-7340207e12a2))
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(pad "G" smd rect (at 39.175 -13.725) (size 0.25 2.65) (layers "F.Cu")
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(zone_connect 2) (tstamp 09206f6a-388f-4def-acf0-2fa0aabe8a04))
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(pad "G" smd rect (at 39.175 -1.1) (size 0.25 2.1) (layers "F.Cu")
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(zone_connect 2) (tstamp 28a00187-8497-4877-95fc-3e418b63a73e))
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(pad "G" smd rect (at 0.175 -13.35) (size 0.25 3.4) (layers "F.Cu")
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(zone_connect 2) (tstamp 2ab164b3-69b1-4f36-adba-b63dcc30fa37))
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(pad "G" smd rect (at 0.175 -2.85) (size 0.25 5.6) (layers "F.Cu")
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(zone_connect 2) (tstamp 38cb9cc6-a05c-418a-b814-9f2754926960))
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(pad "G" smd rect (at 19.675 -14.925 90) (size 0.25 39.25) (layers "F.Cu")
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(zone_connect 2) (tstamp 4163fb05-d620-42c2-ba61-913d7cea34a6))
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(pad "G" smd rect (at 39.175 -7.55) (size 0.25 15) (layers "B.Cu")
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(zone_connect 2) (tstamp 565e1c62-0e0b-4f03-832b-80656dd6f1ac))
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(pad "G" smd rect (at 19.675 -0.175 90) (size 0.25 39.25) (layers "F.Cu")
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(zone_connect 2) (tstamp 63ba7e9f-07dc-4126-ad59-85929033fb4f))
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(pad "G" smd rect (at 0.175 -8.975) (size 0.25 3.95) (layers "F.Cu")
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(zone_connect 2) (tstamp 930e6f36-e08d-4742-811e-02f998d7a892))
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(pad "G" smd rect (at 19.675 -14.925 90) (size 0.25 39.25) (layers "B.Cu")
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(zone_connect 2) (tstamp 9610b1bd-f09c-4ecf-af56-6ee3d4025d85))
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(pad "G" smd rect (at 0.175 -7.55) (size 0.25 15) (layers "B.Cu")
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(zone_connect 2) (tstamp bce47bbb-74da-4a5b-97bb-d980b2ca9ace))
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(pad "G" smd rect (at 19.675 -0.175 90) (size 0.25 39.25) (layers "B.Cu")
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(zone_connect 2) (tstamp eeb2a5ac-443d-42a7-bf9f-51708b8b1c61))
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(pad "W1" smd roundrect (at 0.55 -11.3 90) (locked) (size 0.25 0.5) (layers "F.Cu") (roundrect_rratio 0.5) (tstamp 468a0838-fcfa-4cb7-8cbf-2e2a0ac90fca))
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(pad "W2" smd roundrect (at 0.55 -6.55 90) (locked) (size 0.25 0.5) (layers "F.Cu") (roundrect_rratio 0.5) (tstamp 3b25afee-6de9-4f2a-904b-5d304c63de9b))
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(pad "W3" smd roundrect (at 0.55 -6.05 90) (locked) (size 0.25 0.5) (layers "F.Cu") (roundrect_rratio 0.5) (tstamp fa792192-5aca-4ae9-9f34-634f03cbbca5))
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(zone (net 0) (net_name "") (layers *.Cu) (tstamp 9720650a-dac8-4568-97f5-17a87ea1440f) (hatch edge 0.508)
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(connect_pads (clearance 0))
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(min_thickness 0.254)
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(keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
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(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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(polygon
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(pts
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(xy 39.175 -0.175)
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(xy 0.175 -0.2)
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(xy 0.175 -14.925)
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(xy 39.175 -14.925)
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)
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)
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)
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)
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