diff --git a/hardware/TLE8110ED_breakout_board/known_issues.txt b/hardware/TLE8110ED_breakout_board/known_issues.txt
index 3514d12109..10b03836bd 100644
--- a/hardware/TLE8110ED_breakout_board/known_issues.txt
+++ b/hardware/TLE8110ED_breakout_board/known_issues.txt
@@ -2,4 +2,4 @@
  2)                  make footprint pads longer so that we have some metal not covered by the chip 
  3)                  since RST is not needed, connect with Pull-up resistor to VCC
  4)                  since EN is not needed, connect with Pull-up resistor to VCC
- 5)                  it is highly recommended to connect the exposed pad to GND pins on the PCB.
+ 5)                  it is highly recommended to connect the exposed pad to GND pins on the PCB.
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