From bbd00a660928d788e2831f475d1adb763f09d095 Mon Sep 17 00:00:00 2001 From: rusEfi Date: Sun, 3 Feb 2019 23:45:12 -0500 Subject: [PATCH] todo --- hardware/TLE8110ED_breakout_board/known_issues.txt | 7 +++++-- 1 file changed, 5 insertions(+), 2 deletions(-) diff --git a/hardware/TLE8110ED_breakout_board/known_issues.txt b/hardware/TLE8110ED_breakout_board/known_issues.txt index 87aac7970c..3514d12109 100644 --- a/hardware/TLE8110ED_breakout_board/known_issues.txt +++ b/hardware/TLE8110ED_breakout_board/known_issues.txt @@ -1,2 +1,5 @@ - 1) set solder mask to 0.003 inches, per OSHPark suggestion. - 2) make footprint pads longer so that we have some metal not covered by the chip + 1) set solder mask to 0.003 inches, per OSHPark suggestion. + 2) make footprint pads longer so that we have some metal not covered by the chip + 3) since RST is not needed, connect with Pull-up resistor to VCC + 4) since EN is not needed, connect with Pull-up resistor to VCC + 5) it is highly recommended to connect the exposed pad to GND pins on the PCB.