noisymime
/
speeduino-personal
mirror of https://github.com/noisymime/speeduino-personal.git
1
0
Fork 0
Code Issues Packages Projects Releases Wiki Activity

Minor updates to the routing on VR v3 board (Now v3.1) as well as updating its BOM

This commit is contained in:
Josh Stewart 2019-03-02 13:57:56 +11:00
parent e8c31d5ce7
commit 2fe2172d60
19 changed files with 5567 additions and 60111 deletions
Show Stats Download Patch File Download Diff File Expand all files Collapse all files

BIN
reference/hardware/VR Conditioner/BOM/Bom-template-VR_ITEAD-v3.xls
View File

Binary file not shown.

0
reference/hardware/VR Conditioner/VR Conditioner_pcb.png → reference/hardware/VR Conditioner/VR Conditioner v2_pcb.png
View File

Side by Side Swipe Overlay

Before

Width:  |  Height:  |  Size: 47 KiB

After

Width:  |  Height:  |  Size: 47 KiB

0
reference/hardware/VR Conditioner/VR Conditioner_schem.png → reference/hardware/VR Conditioner/VR Conditioner v2_schem.png
View File

Side by Side Swipe Overlay

Before

Width:  |  Height:  |  Size: 205 KiB

After

Width:  |  Height:  |  Size: 205 KiB

BIN
reference/hardware/VR Conditioner/VR Conditioner v3.1.fzz Normal file
View File

Binary file not shown.

BIN
reference/hardware/VR Conditioner/VR Conditioner v3.1_schem.png Normal file
View File

Binary file not shown.
Side by Side

After

Width:  |  Height:  |  Size: 152 KiB

BIN
reference/hardware/VR Conditioner/VR Conditioner v3.fzz
View File

Binary file not shown.

0
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3_contour.gm1 → reference/hardware/VR Conditioner/gerbers/VR Conditioner v3.1_contour.gm1
View File

0
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3_copperBottom.gbl → reference/hardware/VR Conditioner/gerbers/VR Conditioner v3.1_copperBottom.gbl
View File

31
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3_copperTop.gtl → reference/hardware/VR Conditioner/gerbers/VR Conditioner v3.1_copperTop.gtl
View File

@ -8,8 +8,8 @@ G04 CONTOUR ON CENTER OF CONTOUR VECTOR*
%MOIN*%
%OFA0B0*%
%SFA1.0B1.0*%
%ADD10C,0.039370*%
%ADD11C,0.075000*%
%ADD10C,0.075000*%
%ADD11C,0.039370*%
%ADD12C,0.079370*%
%ADD13C,0.078000*%
%ADD14R,0.079370X0.079370*%
@ -23,9 +23,11 @@ G04 CONTOUR ON CENTER OF CONTOUR VECTOR*
G90*
G70*
G54D10*
X708Y897D03*
G54D11*
X580Y301D03*
X767Y664D03*
G54D11*
G54D10*
X592Y814D03*
X992Y814D03*
G54D12*
@ -37,19 +39,17 @@ X417Y514D03*
X717Y514D03*
X417Y414D03*
X717Y414D03*
G54D11*
G54D10*
X992Y914D03*
X592Y914D03*
G54D10*
G54D11*
X767Y314D03*
G54D13*
X892Y151D03*
X792Y151D03*
G54D10*
G54D11*
X542Y189D03*
X355Y326D03*
G54D11*
X708Y897D03*
G54D14*
X417Y714D03*
G54D15*
@ -387,17 +387,16 @@ X743Y989D01*
D02*
X267Y988D02*
X266Y988D01*
G54D18*
D02*
X686Y514D02*
X579Y514D01*
D02*
X579Y514D02*
X580Y320D01*
G54D19*
D02*
X618Y314D02*
X618Y302D01*
G54D18*
D02*
X579Y514D02*
X580Y320D01*
D02*
X686Y514D02*
X579Y514D01*
G36*
X184Y976D02*
X184Y974D01*

6
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3_drill.txt → reference/hardware/VR Conditioner/gerbers/VR Conditioner v3.1_drill.txt
View File

@ -8,13 +8,12 @@ T102C0.038000
T103C0.035000
%
T100
X005421Y001885
X007671Y006635
X007671Y003135
X003546Y003260
X005796Y003010
X005421Y001885
T101
X004171Y005135
X007171Y006135
X007171Y004135
X004171Y006135
@ -22,13 +21,14 @@ X004171Y004135
X007171Y007135
X007171Y005135
X004171Y007135
X004171Y005135
T102
X008921Y001510
X007921Y001510
T103
X009921Y008135
X005921Y008135
X009921Y009135
X005921Y009135
X009921Y008135
T00
M30

0
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3_maskBottom.gbs → reference/hardware/VR Conditioner/gerbers/VR Conditioner v3.1_maskBottom.gbs
View File

0
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3_maskTop.gts → reference/hardware/VR Conditioner/gerbers/VR Conditioner v3.1_maskTop.gts
View File

0
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3_pasteMaskTop.gtp → reference/hardware/VR Conditioner/gerbers/VR Conditioner v3.1_pasteMaskTop.gtp
View File

80
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3.1_pnp.txt Normal file
View File

@ -0,0 +1,80 @@
*Pick And Place List
*Company=
*Author=
*eMail=
*
*Project=VR Conditioner v3
*Date=13:46:42
*CreatedBy=Fritzing 0.9.3b.04.19.5c895d327c44a3114e5fcc9d8260daf0cbb52806
*
*
*Coordinates in mm, always center of component
*Origin 0/0=Lower left corner of PCB
*Rotation in degree (0-360, math. pos.)
*
*No;Value;Package;X;Y;Rotation;Side;Name
1;;;7.2644;-19.3733;0;Bottom;Copper Fill16
2;;;18.5928;-4.28574;0;Bottom;Copper Fill28
3;0.01µF;0805 [SMD, multilayer];22.0984;-15.5844;0;Top;C2
4;;;15.9623;-12.8549;0;Bottom;TXT6
5;;;19.7866;-18.2811;0;Bottom;Copper Fill18
6;;;20.2946;-7.13054;0;Bottom;Copper Fill27
7;;;19.4858;-7.96443;0;Bottom;Via14
8;;;12.9286;-17.3413;0;Bottom;Copper Fill4
9;;;16.9926;-11.4485;0;Bottom;Copper Fill8
10;;;4.572;-23.9707;0;Bottom;Copper Fill14
11;1µF;0805 [SMD, multilayer];22.0984;-18.1244;0;Top;C3
12;4.7k;THT;20.1209;-20.6644;0;Bottom;R12
13;;;8.5344;-8.33704;0;Bottom;Copper Fill10
14;;;23.0391;-15.6173;-90;Bottom;TXT3
15;;;14.7234;-7.64693;0;Bottom;Via16
16;;;24.4094;-6.57174;0;Bottom;Copper Fill26
17;10k;0805 [SMD];20.5109;-25.4269;0;Top;R7
18;0.1µF;0805 [SMD, multilayer];22.0984;-13.0444;0;Top;C1
19;;;7.47785;-6.63903;0;Bottom;TXT4
20;;;10.287;-19.0685;0;Bottom;Copper Fill17
21;;;8.9789;-7.89254;0;Bottom;Copper Fill9
22;;;12.7;-19.3733;0;Bottom;Copper Fill2
23;;;11.6586;-14.4711;0;Bottom;Copper Fill23
24;;;17.5514;-4.83184;0;Bottom;Copper Fill36
25;;;21.082;-12.2613;0;Bottom;Copper Fill5
26;10k;0805 [SMD];9.08086;-23.2044;0;Top;R9
27;;;14.6685;-7.28294;0;Bottom;Copper Fill12
28;;;11.4554;-6.76224;0;Bottom;Copper Fill32
29;;;17.1704;-14.2933;0;Bottom;Copper Fill7
30;;;17.9832;-16.4015;0;Bottom;Copper Fill3
31;1nF;0805 [SMD, multilayer];7.03084;-14.3144;180;Top;C5
32;;;8.5344;-8.33704;0;Bottom;Copper Fill30
33;;;9.9568;-13.6837;0;Bottom;Copper Fill24
34;;;9.00835;-8.28193;0;Bottom;Via19
35;;;13.7709;-4.78943;0;Bottom;Via15
36;;;16.1823;-10.5259;0;Bottom;TXT6
37;;QSOP16;14.5583;-5.41172;180;Top;MAX9926
38;;;9.398;-8.33704;0;Bottom;Copper Fill11
39;1k;0805 [SMD];23.6133;-9.79693;90;Top;R4
40;;;11.4554;-5.49224;0;Bottom;Copper Fill35
41;;;9.6012;-13.7091;0;Bottom;Copper Fill15
42;;;19.4858;-16.8544;0;Bottom;Via17
43;;;22.1742;-8.04494;0;Bottom;Copper Fill25
44;;;21.336;-16.8587;0;Bottom;Copper Fill20
45;4.7k;THT;20.1209;-23.2044;180;Bottom;R10
46;;;17.1704;-16.8333;0;Bottom;Copper Fill6
47;;;17.2085;-3.37134;0;Bottom;Copper Fill34
48;;;17.5514;-6.76224;0;Bottom;Copper Fill33
49;;;6.00746;-7.5823;0;Bottom;TXT5
50;;;15.9512;-14.2933;0;Bottom;Copper Fill29
51;;;24.2316;-15.3601;0;Bottom;Copper Fill19
52;;;14.574;-25.1077;0;Bottom;TXT1
53;1nF;0805 [SMD, multilayer];6.15085;-24.2294;-90;Top;C4
54;;;8.2804;-14.3187;0;Bottom;Copper Fill22
55;;DIP (Dual Inline) [THT];14.4059;-14.3144;0;Bottom;IC1
56;1k;0805 [SMD];21.0733;-9.79693;90;Top;R6
57;;;15.5948;-17.8602;0;Bottom;TXT6
58;10k;0805 [SMD];7.17586;-16.8544;0;Top;R13
59;;;13.9954;-14.4965;0;Bottom;Copper Fill1
60;;THT;21.3909;-3.83692;90;Bottom;J1
61;;;15.4313;-15.285;0;Bottom;TXT6
62;;;19.8374;-16.9222;0;Bottom;Copper Fill13
63;;;9.398;-8.33704;0;Bottom;Copper Fill31
64;10k;0805 [SMD];7.17586;-11.7744;0;Top;R11
65;;;20.701;-13.7599;0;Bottom;Copper Fill21

4170
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3.1_silkBottom.gbo Normal file
View File

File diff suppressed because it is too large Load Diff

1300
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3_silkTop.gto → reference/hardware/VR Conditioner/gerbers/VR Conditioner v3.1_silkTop.gto
View File

File diff suppressed because it is too large Load Diff

77
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3_pnp.txt
View File

@ -1,77 +0,0 @@
*Pick And Place List
*Company=
*Author=
*eMail=
*
*Project=VR Conditioner v3
*Date=22:29:16
*CreatedBy=Fritzing 0.9.3b.04.19.5c895d327c44a3114e5fcc9d8260daf0cbb52806
*
*
*Coordinates in mm, always center of component
*Origin 0/0=Lower left corner of PCB
*Rotation in degree (0-360, math. pos.)
*
*No;Value;Package;X;Y;Rotation;Side;Name
1;;;17.1704;-14.2933;0;Bottom;Copper Fill7
2;;;9.398;-8.33704;0;Bottom;Copper Fill11
3;;;21.082;-12.2613;0;Bottom;Copper Fill5
4;;;20.701;-13.7599;0;Bottom;Copper Fill21
5;;;24.4094;-6.57174;0;Bottom;Copper Fill26
6;1k;0805 [SMD];23.6133;-9.79693;90;Top;R4
7;;;17.1704;-16.8333;0;Bottom;Copper Fill6
8;;;8.2804;-14.3187;0;Bottom;Copper Fill22
9;10k;0805 [SMD];9.08086;-23.2044;0;Top;R9
10;4.7k;THT;20.1209;-20.6644;0;Bottom;R12
11;;;7.47785;-6.63903;0;Bottom;TXT4
12;0.1µF;0805 [SMD, multilayer];22.0984;-13.0444;0;Top;C1
13;;;8.5344;-8.33704;0;Bottom;Copper Fill30
14;;;8.5344;-8.33704;0;Bottom;Copper Fill10
15;;;13.9954;-14.4965;0;Bottom;Copper Fill1
16;;;13.7709;-4.78943;0;Bottom;Via15
17;;;14.7234;-7.64693;0;Bottom;Via16
18;;;16.9926;-11.4485;0;Bottom;Copper Fill8
19;;;10.287;-19.0685;0;Bottom;Copper Fill17
20;1nF;0805 [SMD, multilayer];7.03084;-14.3144;180;Top;C5
21;;QSOP16;14.5583;-5.41172;180;Top;MAX9926
22;10k;0805 [SMD];7.17586;-11.7744;0;Top;R11
23;4.7k;THT;20.1209;-23.2044;180;Bottom;R10
24;;;20.2946;-7.13054;0;Bottom;Copper Fill27
25;;;7.2644;-19.3733;0;Bottom;Copper Fill16
26;;;17.2085;-3.37134;0;Bottom;Copper Fill34
27;10k;0805 [SMD];7.17586;-16.8544;0;Top;R13
28;;;22.1568;-12.723;-90;Bottom;IMG1
29;;;9.9568;-13.6837;0;Bottom;Copper Fill24
30;10k;0805 [SMD];20.5109;-25.4269;0;Top;R7
31;1k;0805 [SMD];21.0733;-9.79693;90;Top;R6
32;;;12.9286;-17.3413;0;Bottom;Copper Fill4
33;;;25.6195;-12.6698;-90;Bottom;TXT3
34;;;18.5928;-4.28574;0;Bottom;Copper Fill28
35;1µF;0805 [SMD, multilayer];22.0984;-18.1244;0;Top;C3
36;;;4.572;-23.9707;0;Bottom;Copper Fill14
37;;;8.9789;-7.89254;0;Bottom;Copper Fill9
38;;;6.00745;-7.5823;0;Bottom;TXT5
39;;;17.5514;-6.76224;0;Bottom;Copper Fill33
40;;DIP (Dual Inline) [THT];14.4059;-14.3144;0;Bottom;IC1
41;;;14.2736;-25.0931;0;Bottom;TXT1
42;;;14.6685;-7.28294;0;Bottom;Copper Fill12
43;;;11.6586;-14.4711;0;Bottom;Copper Fill23
44;;;11.4554;-6.76224;0;Bottom;Copper Fill32
45;;;9.00836;-8.28192;0;Bottom;Via19
46;;;19.4858;-7.96443;0;Bottom;Via14
47;;;15.9512;-14.2933;0;Bottom;Copper Fill29
48;;;22.1742;-8.04494;0;Bottom;Copper Fill25
49;;;19.7866;-18.2811;0;Bottom;Copper Fill18
50;;;24.2316;-15.3601;0;Bottom;Copper Fill19
51;;;11.4554;-5.49224;0;Bottom;Copper Fill35
52;;;12.7;-19.3733;0;Bottom;Copper Fill2
53;;;9.398;-8.33704;0;Bottom;Copper Fill31
54;;;19.4858;-16.8544;0;Bottom;Via17
55;0.01µF;0805 [SMD, multilayer];22.0984;-15.5844;0;Top;C2
56;;;9.6012;-13.7091;0;Bottom;Copper Fill15
57;;;17.9832;-16.4015;0;Bottom;Copper Fill3
58;1nF;0805 [SMD, multilayer];6.15085;-24.2294;-90;Top;C4
59;;;17.5514;-4.83184;0;Bottom;Copper Fill36
60;;;21.336;-16.8587;0;Bottom;Copper Fill20
61;;THT;21.3909;-3.83692;90;Bottom;J1
62;;;19.8374;-16.9222;0;Bottom;Copper Fill13

60014
reference/hardware/VR Conditioner/gerbers/VR Conditioner v3_silkBottom.gbo
View File

File diff suppressed because it is too large Load Diff

BIN
reference/hardware/VR Conditioner/gerbers/VR Conditioner-v0.3.1.zip Normal file
View File

Binary file not shown.