Minor updates to the routing on VR v3 board (Now v3.1) as well as updating its BOM
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@ -8,8 +8,8 @@ G04 CONTOUR ON CENTER OF CONTOUR VECTOR*
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%MOIN*%
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%OFA0B0*%
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%SFA1.0B1.0*%
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%ADD10C,0.039370*%
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%ADD11C,0.075000*%
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%ADD10C,0.075000*%
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%ADD11C,0.039370*%
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%ADD12C,0.079370*%
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%ADD13C,0.078000*%
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%ADD14R,0.079370X0.079370*%
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@ -23,9 +23,11 @@ G04 CONTOUR ON CENTER OF CONTOUR VECTOR*
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G90*
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G70*
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G54D10*
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X708Y897D03*
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G54D11*
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X580Y301D03*
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X767Y664D03*
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G54D11*
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G54D10*
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X592Y814D03*
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X992Y814D03*
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G54D12*
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@ -37,19 +39,17 @@ X417Y514D03*
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X717Y514D03*
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X417Y414D03*
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X717Y414D03*
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G54D11*
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G54D10*
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X992Y914D03*
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X592Y914D03*
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G54D10*
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G54D11*
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X767Y314D03*
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G54D13*
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X892Y151D03*
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X792Y151D03*
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G54D10*
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G54D11*
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X542Y189D03*
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X355Y326D03*
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G54D11*
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X708Y897D03*
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G54D14*
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X417Y714D03*
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G54D15*
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@ -387,17 +387,16 @@ X743Y989D01*
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D02*
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X267Y988D02*
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X266Y988D01*
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G54D18*
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D02*
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X686Y514D02*
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X579Y514D01*
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D02*
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X579Y514D02*
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X580Y320D01*
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G54D19*
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D02*
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X618Y314D02*
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X618Y302D01*
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G54D18*
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D02*
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X579Y514D02*
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X580Y320D01*
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D02*
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X686Y514D02*
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X579Y514D01*
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G36*
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X184Y976D02*
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X184Y974D01*
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@ -8,13 +8,12 @@ T102C0.038000
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T103C0.035000
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%
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T100
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X005421Y001885
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X007671Y006635
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X007671Y003135
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X003546Y003260
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X005796Y003010
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X005421Y001885
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T101
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X004171Y005135
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X007171Y006135
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X007171Y004135
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X004171Y006135
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@ -22,13 +21,14 @@ X004171Y004135
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X007171Y007135
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X007171Y005135
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X004171Y007135
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X004171Y005135
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T102
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X008921Y001510
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X007921Y001510
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T103
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X009921Y008135
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X005921Y008135
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X009921Y009135
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X005921Y009135
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X009921Y008135
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T00
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M30
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@ -0,0 +1,80 @@
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*Pick And Place List
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*Company=
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*Author=
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*eMail=
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*
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*Project=VR Conditioner v3
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*Date=13:46:42
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*CreatedBy=Fritzing 0.9.3b.04.19.5c895d327c44a3114e5fcc9d8260daf0cbb52806
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*
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*
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*Coordinates in mm, always center of component
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*Origin 0/0=Lower left corner of PCB
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*Rotation in degree (0-360, math. pos.)
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*
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*No;Value;Package;X;Y;Rotation;Side;Name
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1;;;7.2644;-19.3733;0;Bottom;Copper Fill16
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2;;;18.5928;-4.28574;0;Bottom;Copper Fill28
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3;0.01µF;0805 [SMD, multilayer];22.0984;-15.5844;0;Top;C2
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4;;;15.9623;-12.8549;0;Bottom;TXT6
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5;;;19.7866;-18.2811;0;Bottom;Copper Fill18
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6;;;20.2946;-7.13054;0;Bottom;Copper Fill27
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7;;;19.4858;-7.96443;0;Bottom;Via14
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8;;;12.9286;-17.3413;0;Bottom;Copper Fill4
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9;;;16.9926;-11.4485;0;Bottom;Copper Fill8
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10;;;4.572;-23.9707;0;Bottom;Copper Fill14
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11;1µF;0805 [SMD, multilayer];22.0984;-18.1244;0;Top;C3
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12;4.7k;THT;20.1209;-20.6644;0;Bottom;R12
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13;;;8.5344;-8.33704;0;Bottom;Copper Fill10
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14;;;23.0391;-15.6173;-90;Bottom;TXT3
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15;;;14.7234;-7.64693;0;Bottom;Via16
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16;;;24.4094;-6.57174;0;Bottom;Copper Fill26
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17;10k;0805 [SMD];20.5109;-25.4269;0;Top;R7
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18;0.1µF;0805 [SMD, multilayer];22.0984;-13.0444;0;Top;C1
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19;;;7.47785;-6.63903;0;Bottom;TXT4
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20;;;10.287;-19.0685;0;Bottom;Copper Fill17
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21;;;8.9789;-7.89254;0;Bottom;Copper Fill9
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22;;;12.7;-19.3733;0;Bottom;Copper Fill2
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23;;;11.6586;-14.4711;0;Bottom;Copper Fill23
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24;;;17.5514;-4.83184;0;Bottom;Copper Fill36
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25;;;21.082;-12.2613;0;Bottom;Copper Fill5
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26;10k;0805 [SMD];9.08086;-23.2044;0;Top;R9
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27;;;14.6685;-7.28294;0;Bottom;Copper Fill12
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28;;;11.4554;-6.76224;0;Bottom;Copper Fill32
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29;;;17.1704;-14.2933;0;Bottom;Copper Fill7
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30;;;17.9832;-16.4015;0;Bottom;Copper Fill3
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31;1nF;0805 [SMD, multilayer];7.03084;-14.3144;180;Top;C5
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32;;;8.5344;-8.33704;0;Bottom;Copper Fill30
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33;;;9.9568;-13.6837;0;Bottom;Copper Fill24
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34;;;9.00835;-8.28193;0;Bottom;Via19
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35;;;13.7709;-4.78943;0;Bottom;Via15
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36;;;16.1823;-10.5259;0;Bottom;TXT6
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37;;QSOP16;14.5583;-5.41172;180;Top;MAX9926
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38;;;9.398;-8.33704;0;Bottom;Copper Fill11
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39;1k;0805 [SMD];23.6133;-9.79693;90;Top;R4
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40;;;11.4554;-5.49224;0;Bottom;Copper Fill35
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41;;;9.6012;-13.7091;0;Bottom;Copper Fill15
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42;;;19.4858;-16.8544;0;Bottom;Via17
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43;;;22.1742;-8.04494;0;Bottom;Copper Fill25
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44;;;21.336;-16.8587;0;Bottom;Copper Fill20
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45;4.7k;THT;20.1209;-23.2044;180;Bottom;R10
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46;;;17.1704;-16.8333;0;Bottom;Copper Fill6
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47;;;17.2085;-3.37134;0;Bottom;Copper Fill34
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48;;;17.5514;-6.76224;0;Bottom;Copper Fill33
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49;;;6.00746;-7.5823;0;Bottom;TXT5
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50;;;15.9512;-14.2933;0;Bottom;Copper Fill29
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51;;;24.2316;-15.3601;0;Bottom;Copper Fill19
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52;;;14.574;-25.1077;0;Bottom;TXT1
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53;1nF;0805 [SMD, multilayer];6.15085;-24.2294;-90;Top;C4
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54;;;8.2804;-14.3187;0;Bottom;Copper Fill22
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55;;DIP (Dual Inline) [THT];14.4059;-14.3144;0;Bottom;IC1
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56;1k;0805 [SMD];21.0733;-9.79693;90;Top;R6
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57;;;15.5948;-17.8602;0;Bottom;TXT6
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58;10k;0805 [SMD];7.17586;-16.8544;0;Top;R13
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59;;;13.9954;-14.4965;0;Bottom;Copper Fill1
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60;;THT;21.3909;-3.83692;90;Bottom;J1
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61;;;15.4313;-15.285;0;Bottom;TXT6
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62;;;19.8374;-16.9222;0;Bottom;Copper Fill13
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63;;;9.398;-8.33704;0;Bottom;Copper Fill31
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64;10k;0805 [SMD];7.17586;-11.7744;0;Top;R11
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65;;;20.701;-13.7599;0;Bottom;Copper Fill21
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@ -1,77 +0,0 @@
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*Pick And Place List
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*Company=
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*Author=
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*eMail=
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*
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*Project=VR Conditioner v3
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*Date=22:29:16
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*CreatedBy=Fritzing 0.9.3b.04.19.5c895d327c44a3114e5fcc9d8260daf0cbb52806
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*
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*
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*Coordinates in mm, always center of component
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*Origin 0/0=Lower left corner of PCB
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*Rotation in degree (0-360, math. pos.)
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*
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*No;Value;Package;X;Y;Rotation;Side;Name
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1;;;17.1704;-14.2933;0;Bottom;Copper Fill7
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2;;;9.398;-8.33704;0;Bottom;Copper Fill11
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3;;;21.082;-12.2613;0;Bottom;Copper Fill5
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4;;;20.701;-13.7599;0;Bottom;Copper Fill21
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5;;;24.4094;-6.57174;0;Bottom;Copper Fill26
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6;1k;0805 [SMD];23.6133;-9.79693;90;Top;R4
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7;;;17.1704;-16.8333;0;Bottom;Copper Fill6
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8;;;8.2804;-14.3187;0;Bottom;Copper Fill22
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9;10k;0805 [SMD];9.08086;-23.2044;0;Top;R9
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10;4.7k;THT;20.1209;-20.6644;0;Bottom;R12
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11;;;7.47785;-6.63903;0;Bottom;TXT4
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12;0.1µF;0805 [SMD, multilayer];22.0984;-13.0444;0;Top;C1
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13;;;8.5344;-8.33704;0;Bottom;Copper Fill30
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14;;;8.5344;-8.33704;0;Bottom;Copper Fill10
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15;;;13.9954;-14.4965;0;Bottom;Copper Fill1
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16;;;13.7709;-4.78943;0;Bottom;Via15
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17;;;14.7234;-7.64693;0;Bottom;Via16
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18;;;16.9926;-11.4485;0;Bottom;Copper Fill8
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19;;;10.287;-19.0685;0;Bottom;Copper Fill17
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20;1nF;0805 [SMD, multilayer];7.03084;-14.3144;180;Top;C5
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21;;QSOP16;14.5583;-5.41172;180;Top;MAX9926
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22;10k;0805 [SMD];7.17586;-11.7744;0;Top;R11
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23;4.7k;THT;20.1209;-23.2044;180;Bottom;R10
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24;;;20.2946;-7.13054;0;Bottom;Copper Fill27
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25;;;7.2644;-19.3733;0;Bottom;Copper Fill16
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26;;;17.2085;-3.37134;0;Bottom;Copper Fill34
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27;10k;0805 [SMD];7.17586;-16.8544;0;Top;R13
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28;;;22.1568;-12.723;-90;Bottom;IMG1
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29;;;9.9568;-13.6837;0;Bottom;Copper Fill24
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30;10k;0805 [SMD];20.5109;-25.4269;0;Top;R7
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31;1k;0805 [SMD];21.0733;-9.79693;90;Top;R6
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32;;;12.9286;-17.3413;0;Bottom;Copper Fill4
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33;;;25.6195;-12.6698;-90;Bottom;TXT3
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34;;;18.5928;-4.28574;0;Bottom;Copper Fill28
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35;1µF;0805 [SMD, multilayer];22.0984;-18.1244;0;Top;C3
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36;;;4.572;-23.9707;0;Bottom;Copper Fill14
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37;;;8.9789;-7.89254;0;Bottom;Copper Fill9
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38;;;6.00745;-7.5823;0;Bottom;TXT5
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39;;;17.5514;-6.76224;0;Bottom;Copper Fill33
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40;;DIP (Dual Inline) [THT];14.4059;-14.3144;0;Bottom;IC1
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41;;;14.2736;-25.0931;0;Bottom;TXT1
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42;;;14.6685;-7.28294;0;Bottom;Copper Fill12
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43;;;11.6586;-14.4711;0;Bottom;Copper Fill23
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44;;;11.4554;-6.76224;0;Bottom;Copper Fill32
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45;;;9.00836;-8.28192;0;Bottom;Via19
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46;;;19.4858;-7.96443;0;Bottom;Via14
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47;;;15.9512;-14.2933;0;Bottom;Copper Fill29
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48;;;22.1742;-8.04494;0;Bottom;Copper Fill25
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49;;;19.7866;-18.2811;0;Bottom;Copper Fill18
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50;;;24.2316;-15.3601;0;Bottom;Copper Fill19
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51;;;11.4554;-5.49224;0;Bottom;Copper Fill35
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52;;;12.7;-19.3733;0;Bottom;Copper Fill2
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53;;;9.398;-8.33704;0;Bottom;Copper Fill31
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54;;;19.4858;-16.8544;0;Bottom;Via17
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55;0.01µF;0805 [SMD, multilayer];22.0984;-15.5844;0;Top;C2
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56;;;9.6012;-13.7091;0;Bottom;Copper Fill15
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57;;;17.9832;-16.4015;0;Bottom;Copper Fill3
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58;1nF;0805 [SMD, multilayer];6.15085;-24.2294;-90;Top;C4
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59;;;17.5514;-4.83184;0;Bottom;Copper Fill36
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60;;;21.336;-16.8587;0;Bottom;Copper Fill20
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61;;THT;21.3909;-3.83692;90;Bottom;J1
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62;;;19.8374;-16.9222;0;Bottom;Copper Fill13
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