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Minor silkscreen tweak on conditioner board

This commit is contained in:
Josh Stewart 2015-09-24 23:51:14 +10:00
parent d094e2ecb4
commit 7fe880fb3d
5 changed files with 2827 additions and 2538 deletions
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19
reference/hardware/VR Conditioner/gerbers/VR Conditioner v2_copperBottom.gbl
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@ -535,23 +535,30 @@ D02*
X283Y115D02*
X306Y115D01*
D02*
X270Y90D02*
X269Y101D01*
D02*
X295Y65D02*
X270Y90D01*
D02*
X270Y90D02*
X269Y101D01*
D02*
X306Y65D02*
X295Y65D01*
D02*
X295Y240D02*
X270Y215D01*
D02*
X270Y215D02*
X269Y128D01*
D02*
X295Y240D02*
X270Y215D01*
D02*
X306Y240D02*
X295Y240D01*
G54D18*
D02*
X870Y290D02*
X870Y316D01*
D02*
X870Y264D02*
X870Y290D01*
G36*
X66Y944D02*
X66Y920D01*

186
reference/hardware/VR Conditioner/gerbers/VR Conditioner v2_pnp.txt
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@ -4,7 +4,7 @@
*eMail=
*
*Project=VR Conditioner v2
*Date=23:35:30
*Date=23:49:25
*CreatedBy=Fritzing 0.9.2b.11.19.8d2d5970658f0bed09c661c9ea9a515b5f40f44c
*
*
@ -15,100 +15,100 @@
*No;Value;Package;X;Y;Rotation;Side;Name
1;1µF;0805 [SMD, multilayer];21.0588;-11.1711;0;Bottom;C3
2;10k;0805 [SMD];17.0038;-4.4311;-90;Bottom;R6
3;;;23.241;-18.1928;0;Bottom;Copper Fill35
4;;;10.668;-8.3884;0;Bottom;Copper Fill18
5;;;13.1939;-21.3311;0;Bottom;Via8
6;1k;0805 [SMD];3.91387;-21.9661;180;Bottom;R9
7;;;6.1849;-20.7582;0;Bottom;Copper Fill57
8;;;16.0528;-15.4242;0;Bottom;Copper Fill38
3;;;13.1939;-21.3311;0;Bottom;Via8
4;;;2.8194;-3.7148;0;Bottom;Copper Fill49
5;1k;0805 [SMD];3.91387;-21.9661;180;Bottom;R9
6;;;23.241;-18.1928;0;Bottom;Copper Fill35
7;;;13.8049;-8.4646;0;Bottom;Copper Fill53
8;;;8.4582;-11.7158;0;Bottom;Copper Fill43
9;;QSOP16;5.42149;-4.17341;0;Bottom;MAX9926
10;;;13.3604;-8.0455;0;Bottom;Copper Fill27
11;;;20.2946;-18.0658;0;Bottom;Copper Fill6
12;;;12.3952;-14.84;0;Bottom;Copper Fill37
13;;;3.66888;-6.72612;0;Bottom;Via3
14;;;7.0612;-20.4026;0;Bottom;Copper Fill4
15;;;3.556;-14.0272;0;Bottom;Copper Fill10
16;;;6.4516;-16.5926;0;Bottom;Copper Fill9
17;220;0805 [SMD];4.0589;-16.2511;180;Bottom;R13
18;;;6.20888;-6.72612;0;Bottom;Via2
19;;;12.5589;-10.5361;0;Bottom;Via6
20;;;8.6106;-18.1928;0;Bottom;Copper Fill5
21;1nF;0805 [SMD, multilayer];3.03388;-12.8311;90;Bottom;C5
22;;;6.1849;-15.5258;0;Bottom;Copper Fill55
23;;;7.47888;-17.5211;0;Bottom;Via5
24;1k;0805 [SMD];4.6939;-9.2661;180;Bottom;R11
25;;;22.0472;-14.7638;0;Bottom;Copper Fill41
26;;;21.7678;-9.9124;0;Bottom;Copper Fill16
27;;;8.382;-6.1151;0;Bottom;Copper Fill31
28;;;13.8289;-7.99612;0;Bottom;Via9
29;;;4.93888;-3.55112;0;Bottom;Via10
30;;;14.7828;-2.9782;0;Bottom;Copper Fill24
31;;;6.6802;-1.9622;0;Bottom;Copper Fill25
32;;;18.669;-11.157;0;Bottom;Copper Fill42
33;;;8.3566;-5.9754;0;Bottom;Copper Fill44
34;;;2.9718;-12.427;0;Bottom;Copper Fill39
35;;DIP (Dual Inline) [THT];13.1939;-11.8061;0;Bottom;IC1
36;;;12.4968;-21.3424;0;Bottom;Copper Fill32
37;;;6.985;-4.7054;0;Bottom;Copper Fill21
38;;;12.9032;-11.3602;0;Bottom;Copper Fill14
39;;;15.4686;-10.1156;0;Bottom;Copper Fill12
40;;;2.8194;-3.7148;0;Bottom;Copper Fill49
41;;;8.1026;-13.062;0;Bottom;Copper Fill15
42;;;6.4008;-20.0851;0;Bottom;Copper Fill58
43;;;18.6436;-17.5324;0;Bottom;Copper Fill36
44;;;10.9982;-2.394;0;Bottom;Copper Fill26
45;;;6.731;-3.8672;0;Bottom;Copper Fill50
46;0.01µF;0805 [SMD, multilayer];21.0588;-8.6311;0;Bottom;C2
47;;;3.302;-5.8738;0;Bottom;Copper Fill17
48;;;16.0274;-16.237;0;Bottom;Copper Fill7
49;10k;0805 [SMD];14.4639;-4.5761;90;Bottom;R4
50;;;3.8608;-22.1044;0;Bottom;Copper Fill33
51;;;18.6944;-15.475;0;Bottom;Copper Fill40
52;;so08;4.30388;-17.4449;0;Top;IC2
53;;;12.1412;-4.2736;0;Bottom;Copper Fill22
54;;;2.2606;-21.3424;0;Bottom;Copper Fill1
55;;;2.159;-11.4364;0;Bottom;Copper Fill13
56;;;18.161;-8.5408;0;Bottom;Copper Fill48
57;;;21.9624;-9.59003;90;Bottom;TXT3
58;10k;0805 [SMD];21.8389;-16.8861;0;Top;R15
59;;;1.12888;-23.2361;0;Bottom;Via4
60;;;22.7761;-7.12893;90;Bottom;TXT1
61;;;13.1445;-20.9614;0;Bottom;Copper Fill28
62;;;4.318;-2.775;0;Bottom;Copper Fill23
63;;;6.4008;-14.8527;0;Bottom;Copper Fill56
64;4.7k;THT;15.7339;-3.55111;180;Bottom;R12
65;0.1µF;0805 [SMD, multilayer];21.0588;-6.0911;0;Bottom;C1
66;;;13.5636;-21.3551;0;Bottom;Copper Fill54
67;;;6.84389;-2.91611;0;Bottom;Via12
68;;;13.1318;-20.3518;0;Bottom;Copper Fill3
69;;;22.5298;-21.5964;0;Bottom;Copper Fill2
70;1k;0805 [SMD];21.2039;-16.2511;180;Bottom;R5
71;;;2.159;-7.4232;0;Bottom;Copper Fill46
72;;;13.8049;-8.4646;0;Bottom;Copper Fill53
73;;;21.7678;-7.3724;0;Bottom;Copper Fill20
74;;;3.6449;-20.7582;0;Bottom;Copper Fill59
75;1k;0805 [SMD];6.20888;-12.8311;90;Bottom;R14
76;;;22.0345;-11.6904;0;Bottom;Copper Fill30
77;;;1.76389;-18.1561;0;Bottom;Via13
78;10k;0805 [SMD];15.4889;-23.2361;180;Bottom;R7
10;;;22.0345;-11.6904;0;Bottom;Copper Fill30
11;;;20.2438;-11.8428;0;Bottom;Copper Fill11
12;;;3.66888;-6.72612;0;Bottom;Via3
13;;;15.4686;-10.1156;0;Bottom;Copper Fill12
14;;;12.3952;-14.84;0;Bottom;Copper Fill37
15;220;0805 [SMD];4.0589;-16.2511;180;Bottom;R13
16;;;6.20888;-6.72612;0;Bottom;Via2
17;;;12.5589;-10.5361;0;Bottom;Via6
18;;;16.0274;-16.237;0;Bottom;Copper Fill7
19;1nF;0805 [SMD, multilayer];3.03388;-12.8311;90;Bottom;C5
20;;;15.4178;-3.3338;0;Bottom;Copper Fill51
21;;;8.6106;-18.1928;0;Bottom;Copper Fill5
22;;;7.47888;-17.5211;0;Bottom;Via5
23;1k;0805 [SMD];4.6939;-9.2661;180;Bottom;R11
24;;;3.8608;-22.1044;0;Bottom;Copper Fill33
25;;;10.3124;-9.1504;0;Bottom;Copper Fill45
26;;;8.1026;-13.062;0;Bottom;Copper Fill15
27;;;6.985;-4.7054;0;Bottom;Copper Fill21
28;;;13.1445;-20.9614;0;Bottom;Copper Fill28
29;;;3.556;-14.0272;0;Bottom;Copper Fill10
30;;;21.7678;-9.9124;0;Bottom;Copper Fill16
31;;;13.8289;-7.99612;0;Bottom;Via9
32;;;4.93888;-3.55112;0;Bottom;Via10
33;;;3.6449;-20.7582;0;Bottom;Copper Fill59
34;;;2.159;-11.4364;0;Bottom;Copper Fill13
35;;;6.4008;-20.0851;0;Bottom;Copper Fill58
36;;;2.9718;-12.427;0;Bottom;Copper Fill39
37;;;12.9032;-11.3602;0;Bottom;Copper Fill14
38;;;6.731;-3.8672;0;Bottom;Copper Fill50
39;;DIP (Dual Inline) [THT];13.1939;-11.8061;0;Bottom;IC1
40;;;18.161;-8.5408;0;Bottom;Copper Fill48
41;;;3.302;-5.8738;0;Bottom;Copper Fill17
42;;;3.683;-17.8626;0;Bottom;Copper Fill8
43;;;12.1412;-4.2736;0;Bottom;Copper Fill22
44;;;8.3566;-5.9754;0;Bottom;Copper Fill44
45;;;18.6436;-17.5324;0;Bottom;Copper Fill36
46;;;8.382;-6.1151;0;Bottom;Copper Fill31
47;0.01µF;0805 [SMD, multilayer];21.0588;-8.6311;0;Bottom;C2
48;;;18.669;-11.157;0;Bottom;Copper Fill42
49;;;6.1849;-15.5258;0;Bottom;Copper Fill55
50;;;2.2606;-21.3424;0;Bottom;Copper Fill1
51;;;10.8712;-6.5342;0;Bottom;Copper Fill47
52;;;13.5636;-21.3551;0;Bottom;Copper Fill54
53;;;20.193;-4.8324;0;Bottom;Copper Fill19
54;10k;0805 [SMD];14.4639;-4.5761;90;Bottom;R4
55;;;12.4968;-21.3424;0;Bottom;Copper Fill32
56;;so08;4.30388;-17.4449;0;Top;IC2
57;;;13.3604;-8.0455;0;Bottom;Copper Fill27
58;;;22.6808;-9.35912;90;Bottom;TXT3
59;;;7.0612;-20.4026;0;Bottom;Copper Fill4
60;10k;0805 [SMD];21.8389;-16.8861;0;Top;R15
61;;;1.12888;-23.2361;0;Bottom;Via4
62;;;13.5636;-21.3551;0;Bottom;Copper Fill29
63;;;22.0472;-14.7638;0;Bottom;Copper Fill41
64;;;23.4432;-6.87236;90;Bottom;TXT1
65;;;10.668;-8.3884;0;Bottom;Copper Fill18
66;;;6.1849;-20.7582;0;Bottom;Copper Fill57
67;4.7k;THT;15.7339;-3.55111;180;Bottom;R12
68;0.1µF;0805 [SMD, multilayer];21.0588;-6.0911;0;Bottom;C1
69;;;10.9982;-2.394;0;Bottom;Copper Fill26
70;;;2.159;-7.4232;0;Bottom;Copper Fill46
71;;;6.84389;-2.91611;0;Bottom;Via12
72;;;6.6802;-1.9622;0;Bottom;Copper Fill25
73;1k;0805 [SMD];21.2039;-16.2511;180;Bottom;R5
74;1k;0805 [SMD];6.20888;-12.8311;90;Bottom;R14
75;;;1.76389;-18.1561;0;Bottom;Via13
76;10k;0805 [SMD];15.4889;-23.2361;180;Bottom;R7
77;;;14.7828;-2.9782;0;Bottom;Copper Fill24
78;;;21.7678;-7.3724;0;Bottom;Copper Fill20
79;;;12.5589;-2.91612;0;Bottom;Via1
80;;;23.9889;-18.7911;0;Bottom;Via15
81;;;15.4178;-3.3338;0;Bottom;Copper Fill51
82;;;3.683;-17.8626;0;Bottom;Copper Fill8
83;;;20.2438;-11.8428;0;Bottom;Copper Fill11
84;;;8.4582;-11.7158;0;Bottom;Copper Fill43
85;;;13.5636;-21.3551;0;Bottom;Copper Fill29
86;;;20.193;-4.8324;0;Bottom;Copper Fill19
87;;;10.3124;-9.1504;0;Bottom;Copper Fill45
88;1k;0805 [SMD];3.91389;-19.4261;0;Bottom;R8
89;;;16.129;-10.5855;0;Bottom;Copper Fill52
90;220;0805 [SMD];4.93888;-10.2911;-90;Top;R1
91;220;0805 [SMD];4.5489;-1.6461;180;Top;R2
92;4.7k;THT;15.7339;-20.6961;180;Bottom;R10
93;1k;0805 [SMD];13.8289;-14.5911;-90;Bottom;R3
94;;;10.8712;-6.5342;0;Bottom;Copper Fill47
95;10k;0805 [SMD];20.8139;-13.9561;90;Top;R16
81;;;13.1318;-20.3518;0;Bottom;Copper Fill3
82;;;23.1394;-20.9868;0;Bottom;Copper Fill34
83;;;16.129;-10.5855;0;Bottom;Copper Fill52
84;1k;0805 [SMD];3.91389;-19.4261;0;Bottom;R8
85;220;0805 [SMD];4.93888;-10.2911;-90;Top;R1
86;;;22.5298;-21.5964;0;Bottom;Copper Fill2
87;220;0805 [SMD];4.5489;-1.6461;180;Top;R2
88;4.7k;THT;15.7339;-20.6961;180;Bottom;R10
89;;;20.2946;-18.0658;0;Bottom;Copper Fill6
90;;;18.6944;-15.475;0;Bottom;Copper Fill40
91;1k;0805 [SMD];13.8289;-14.5911;-90;Bottom;R3
92;;;6.4516;-16.5926;0;Bottom;Copper Fill9
93;10k;0805 [SMD];20.8139;-13.9561;90;Top;R16
94;;;6.4008;-14.8527;0;Bottom;Copper Fill56
95;;;16.0528;-15.4242;0;Bottom;Copper Fill38
96;;;16.3689;-18.7911;0;Bottom;Via14
97;;;21.1775;-10.1578;90;Bottom;TXT2
98;;;23.1394;-20.9868;0;Bottom;Copper Fill34
97;;;4.318;-2.775;0;Bottom;Copper Fill23
98;;;21.8702;-9.95251;90;Bottom;TXT2
99;1nF;0805 [SMD, multilayer];9.77387;-23.2361;180;Bottom;C4

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reference/hardware/VR Conditioner/gerbers/VR Conditioner v2_silkBottom.gbo
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reference/hardware/VR Conditioner/gerbers/VR Conditioner v2_silkTop.gto
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reference/hardware/VR Conditioner/gerbers/VR Conditioner-v0.2.zip
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