diff --git a/hardware/TLE8110ED_breakout_board/known_issues.txt b/hardware/TLE8110ED_breakout_board/known_issues.txt
index 87aac7970c..3514d12109 100644
--- a/hardware/TLE8110ED_breakout_board/known_issues.txt
+++ b/hardware/TLE8110ED_breakout_board/known_issues.txt
@@ -1,2 +1,5 @@
- 1)                   set solder mask to 0.003 inches, per OSHPark suggestion.
- 2)                   make footprint pads longer so that we have some metal not covered by the chip
+ 1)                  set solder mask to 0.003 inches, per OSHPark suggestion.
+ 2)                  make footprint pads longer so that we have some metal not covered by the chip 
+ 3)                  since RST is not needed, connect with Pull-up resistor to VCC
+ 4)                  since EN is not needed, connect with Pull-up resistor to VCC
+ 5)                  it is highly recommended to connect the exposed pad to GND pins on the PCB.