diff --git a/hardware/TLE8110ED_breakout_board/known_issues.txt b/hardware/TLE8110ED_breakout_board/known_issues.txt
new file mode 100644
index 0000000000..87aac7970c
--- /dev/null
+++ b/hardware/TLE8110ED_breakout_board/known_issues.txt
@@ -0,0 +1,2 @@
+ 1)                   set solder mask to 0.003 inches, per OSHPark suggestion.
+ 2)                   make footprint pads longer so that we have some metal not covered by the chip