(footprint "module-dinput4-0.1" locked (layer "F.Cu")
  (tedit 0) (tstamp 0bcc70e2-5556-4a16-8460-532c7e9f6c79)
  (at 142.5261 107.6286)
  (zone_connect 2)
  (fp_text reference "M" (at 0.127 -6.0198 unlocked) (layer "F.SilkS") hide
    (effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
    (tstamp 5d83030a-3b22-4487-a776-c606b8291803)
  )
  (fp_text value "Module-dinput4-0.1" (at -4.9911 2.4003 unlocked) (layer "F.SilkS") hide
    (effects (font (size 1.524 1.524) (thickness 0.254)) (justify left bottom))
    (tstamp 4c95f86c-4c69-4bd5-a4a7-11b8f0e6e712)
  )
  (fp_line (start 0.1 -0.125) (end 0.1 -5.025) (layer "B.SilkS") (width 0.2) (tstamp 9c0871e8-14c7-463a-9502-d9343cef7c57))
  (fp_line (start 0.1 -0.125) (end 11.85 -0.125) (layer "B.SilkS") (width 0.2) (tstamp c71f5523-a61c-4b91-bd20-be3ced2e260e))
  (fp_line (start 11.85 -0.125) (end 11.85 -5.025) (layer "B.SilkS") (width 0.2) (tstamp f2288ed6-4387-4d28-a18a-fbbfc1eb7ef3))
  (fp_line (start 0.1 -5.125) (end 11.85 -5.125) (layer "B.SilkS") (width 0.2) (tstamp f4ebdd72-86f2-46c9-b096-9726ded071f7))
  (fp_line (start 0.1 -0.125) (end 11.85 -0.125) (layer "F.SilkS") (width 0.2) (tstamp 32af2eb3-a09e-4c90-b3ac-75e128d5863f))
  (fp_line (start 0.1 -0.125) (end 0.1 -5.025) (layer "F.SilkS") (width 0.2) (tstamp 8f1365dc-d9c8-4c2b-bd82-58bc3bde1839))
  (fp_line (start 0.1 -5.125) (end 11.85 -5.125) (layer "F.SilkS") (width 0.2) (tstamp b59f551a-8f56-4793-a180-28b476543338))
  (fp_line (start 11.85 -0.125) (end 11.85 -5.025) (layer "F.SilkS") (width 0.2) (tstamp ceecbb30-6bd4-4033-9009-4b34afb355c2))
  (pad "G" smd oval (at 11.750002 -2.650007 180) (locked) (size 0.2 5.1) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 32c90a39-aa31-41eb-93ea-0ec39ce1a912))
  (pad "G" smd oval (at 6.259767 -5.125 90) (locked) (size 0.2 11.1) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 33db1ab4-fe5f-4789-9a04-2994ae92e1d0))
  (pad "G" smd oval (at 6.250003 -0.199997 90) (locked) (size 0.2 11.1) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp f68d08a4-0ccc-4189-9a57-9a72679c77b1))
  (pad "J1" smd oval (at 10.975012 -3.374977 270) (locked) (size 0.2 0.95) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp f0bcf5fa-a89e-4be0-9d49-7970224687b0))
  (pad "J2" smd oval (at 10.975012 -2.499975 270) (locked) (size 0.2 0.95) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 6caa1cb6-ec05-4b2c-81f6-29f59e0bb569))
  (pad "J3" smd oval (at 10.975012 -1.699976 270) (locked) (size 0.2 0.95) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp d5549b89-b04e-4323-9549-454b7304d085))
  (pad "J4" smd oval (at 10.975012 -0.824974 270) (locked) (size 0.2 0.95) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 0cf8cf7d-8c1e-45ec-8c61-26dad89a00ad))
  (pad "V1" thru_hole circle (at 1.374996 -2.768016 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -50) (zone_connect 2) (tstamp 0afb9639-ebde-4cfd-a264-6f55fa81fdc7))
  (pad "V2" thru_hole circle (at 8.650013 -3.374977 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -50) (zone_connect 2) (tstamp 477e9375-a24e-4698-b641-1f683a79d719))
  (pad "V3" thru_hole circle (at 8.650013 -2.524976 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -50) (zone_connect 2) (tstamp c4fcaa27-4f39-4bbe-a636-5de812c8ff9c))
  (pad "V4" thru_hole circle (at 8.650013 -1.674975 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -50) (zone_connect 2) (tstamp bce4abda-95f3-487c-92f6-5c203c570123))
  (pad "V5" thru_hole circle (at 8.650013 -0.824974 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -50) (zone_connect 2) (tstamp e7153ba7-7243-4779-9e39-0d902be5f6f5))
  (pad "V6" thru_hole circle (at 10.099139 -3.98638 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -50) (zone_connect 2) (tstamp 0eab89ca-67f3-44d0-9678-25ce97a60913))
  (pad "V6" smd oval (at 10.2 -2.325012 180) (locked) (size 0.2 3.5) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 9b8dfeff-29d3-47ea-ac0f-52052694a6de))
  (pad "W1" thru_hole circle (at 0.249974 -0.825005 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -50) (zone_connect 2) (tstamp b1c83111-db3e-4502-9a35-63f89c758db2))
  (pad "W1" smd oval (at 0.249974 -0.875007 270) (locked) (size 0.25 0.5) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp cd71e3a3-0a64-43d3-b77f-c55f14cee943))
  (pad "W2" smd oval (at 0.249974 -2.17501 270) (locked) (size 0.25 0.5) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 36677260-c048-4642-9fdf-77c07c42042b))
  (pad "W2" thru_hole circle (at 0.249974 -2.225012 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -50) (zone_connect 2) (tstamp d4a6fd7c-dff6-4294-bcb3-753fc406d808))
  (pad "W3" thru_hole circle (at 0.249974 -3.300004 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -50) (zone_connect 2) (tstamp 4c664586-9f34-4c56-a49e-063822f95b33))
  (pad "W3" smd oval (at 0.249974 -3.350006 270) (locked) (size 0.25 0.5) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 66bdec26-0a18-430d-9f97-33e00bd8767b))
  (pad "W4" smd oval (at 0.249974 -4.650008 270) (locked) (size 0.25 0.5) (layers "F.Cu" "F.Paste")
    (solder_mask_margin 0.1016) (solder_paste_margin -50) (zone_connect 2) (tstamp 14152c9b-c725-4916-b3d0-81439b28204c))
  (pad "W4" thru_hole circle (at 0.249974 -4.700011 180) (locked) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
    (solder_paste_margin -50) (zone_connect 2) (tstamp 820c2e40-dc18-42c2-87f9-a46fca2b7229))
  (zone (net 0) (net_name "") (layer "F.Cu") (tstamp 1a368ec0-0745-4fcd-8e39-ccb502d019df) (hatch edge 0.2)
    (connect_pads (clearance 0))
    (min_thickness 0.254) (filled_areas_thickness no)
    (keepout (tracks allowed) (vias allowed) (pads allowed ) (copperpour not_allowed) (footprints allowed))
    (fill (thermal_gap 0.2) (thermal_bridge_width 0.2))
    (polygon
      (pts
        (xy 142.525564 107.6036)
        (xy 142.525564 106.507586)
        (xy 142.525564 102.373279)
        (xy 143.2761 102.373279)
        (xy 143.2761 102.5036)
        (xy 154.2761 102.5036)
        (xy 154.2761 107.4536)
        (xy 143.2761 107.4536)
        (xy 143.2761 107.6036)
      )
    )
  )
)