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updated connect copper zones

This commit is contained in:
Nadezhda-n 2022-12-09 11:14:32 +03:00
parent a2cb0a2237
commit 117410ab48
1 changed files with 52 additions and 51 deletions
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103
modules/power_12and5V/0.1/power_12and5V.kicad_mod
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@ -1,6 +1,7 @@
(footprint "power_12and5V" (version 20211014) (generator pcbnew) (footprint "power_12and5V" (version 20211014) (generator pcbnew)
(layer "F.Cu") (layer "F.Cu")
(tedit 0) (tedit 0)
(zone_connect 2)
(fp_text reference "M410" (at -0.181801 -21.2886 unlocked) (layer "F.SilkS") hide (fp_text reference "M410" (at -0.181801 -21.2886 unlocked) (layer "F.SilkS") hide
(effects (font (size 0.6 0.6) (thickness 0.254)) (justify left bottom)) (effects (font (size 0.6 0.6) (thickness 0.254)) (justify left bottom))
(tstamp 49e5c13e-b30d-4152-98a5-d2ac911a19bb) (tstamp 49e5c13e-b30d-4152-98a5-d2ac911a19bb)
@ -30,107 +31,107 @@
(fp_line (start -0.000003 0) (end -0.000003 -0.3) (layer "F.SilkS") (width 0.2) (tstamp f08119ec-46bd-4b73-8280-c8b88904c31d)) (fp_line (start -0.000003 0) (end -0.000003 -0.3) (layer "F.SilkS") (width 0.2) (tstamp f08119ec-46bd-4b73-8280-c8b88904c31d))
(fp_line (start -0.000003 -14) (end -0.000003 -17.200003) (layer "F.SilkS") (width 0.2) (tstamp f8df2637-6f6c-4c58-a8d9-225b2be6f596)) (fp_line (start -0.000003 -14) (end -0.000003 -17.200003) (layer "F.SilkS") (width 0.2) (tstamp f8df2637-6f6c-4c58-a8d9-225b2be6f596))
(pad "E1" thru_hole circle (at 16.149993 -19.5) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask) (pad "E1" thru_hole circle (at 16.149993 -19.5) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp ea22b46d-7cae-4de8-943d-d0035a6c7905)) (solder_paste_margin -50) (zone_connect 2) (tstamp ea22b46d-7cae-4de8-943d-d0035a6c7905))
(pad "E2" thru_hole circle (at 16.149993 -13.100003) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask) (pad "E2" thru_hole circle (at 16.149993 -13.100003) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 492eecfd-e80d-4b2e-86d4-80103990cb2e)) (solder_paste_margin -50) (zone_connect 2) (tstamp 492eecfd-e80d-4b2e-86d4-80103990cb2e))
(pad "E3" thru_hole circle (at 16.149993 -11.2) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask) (pad "E3" thru_hole circle (at 16.149993 -11.2) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 9e9b2dc2-4a2e-4e84-b551-c5c3b1c08c57)) (solder_paste_margin -50) (zone_connect 2) (tstamp 9e9b2dc2-4a2e-4e84-b551-c5c3b1c08c57))
(pad "E4" thru_hole circle (at 16.149993 -6.9) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask) (pad "E4" thru_hole circle (at 16.149993 -6.9) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp cbdbb4e3-4698-4e21-8f15-c335fc33375a)) (solder_paste_margin -50) (zone_connect 2) (tstamp cbdbb4e3-4698-4e21-8f15-c335fc33375a))
(pad "E5" thru_hole circle (at 16.599992 -4.500003 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) (pad "E5" thru_hole circle (at 16.599992 -4.500003 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 0e36d9e2-6dcc-4f6f-a6d5-0a959c5bfcf8)) (solder_paste_margin -50) (zone_connect 2) (tstamp 0e36d9e2-6dcc-4f6f-a6d5-0a959c5bfcf8))
(pad "E6" thru_hole circle (at 16.599992 -3.500002) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) (pad "E6" thru_hole circle (at 16.599992 -3.500002) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 4f85fcde-a94b-41c3-95b4-f645f733ad82)) (solder_paste_margin -50) (zone_connect 2) (tstamp 4f85fcde-a94b-41c3-95b4-f645f733ad82))
(pad "S1" smd oval (at 8.399995 0) (size 17 0.2) (layers "B.Cu" "B.Paste" "B.Mask") (pad "S1" smd oval (at 8.399995 0) (size 17 0.2) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 004969cf-2de4-454b-b777-c445a6aab159)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 004969cf-2de4-454b-b777-c445a6aab159))
(pad "S1" smd oval (at 8.399995 0) (size 17 0.2) (layers "In2.Cu") (pad "S1" smd oval (at 8.399995 0) (size 17 0.2) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 04c951fa-1254-4e87-8397-4d5b012db45a)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 04c951fa-1254-4e87-8397-4d5b012db45a))
(pad "S1" smd oval (at 16.799994 -2.200002 270) (size 1.5 0.2) (layers "B.Cu" "B.Paste" "B.Mask") (pad "S1" smd oval (at 16.799994 -2.200002 270) (size 1.5 0.2) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 0bb8fcae-7b5c-4073-8c9c-4750722f77b4)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 0bb8fcae-7b5c-4073-8c9c-4750722f77b4))
(pad "S1" smd oval (at 16.799994 -9 270) (size 2.6 0.2) (layers "In2.Cu") (pad "S1" smd oval (at 16.799994 -9 270) (size 2.6 0.2) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 174c79be-eb82-405a-b78e-55081fd48707)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 174c79be-eb82-405a-b78e-55081fd48707))
(pad "S1" smd oval (at 16.799994 -20.55 90) (size 0.3 0.2) (layers "B.Cu" "B.Paste" "B.Mask") (pad "S1" smd oval (at 16.799994 -20.55 90) (size 0.3 0.2) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 181e1273-443d-43f1-8c94-19901f5614e6)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 181e1273-443d-43f1-8c94-19901f5614e6))
(pad "S1" smd oval (at -0.000003 -0.05 90) (size 0.3 0.2) (layers "B.Cu" "B.Paste" "B.Mask") (pad "S1" smd oval (at -0.000003 -0.05 90) (size 0.3 0.2) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 18f8717b-fed1-40ed-b5a5-0454190887f0)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 18f8717b-fed1-40ed-b5a5-0454190887f0))
(pad "S1" smd oval (at -0.000003 -7.150002 90) (size 10.2 0.2) (layers "In2.Cu") (pad "S1" smd oval (at -0.000003 -7.150002 90) (size 10.2 0.2) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 1b54c84a-85e2-4a0e-82c6-662ca02ee7d3)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 1b54c84a-85e2-4a0e-82c6-662ca02ee7d3))
(pad "S1" smd oval (at 8.399995 0) (size 17 0.2) (layers "In1.Cu") (pad "S1" smd oval (at 8.399995 0) (size 17 0.2) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 273cb166-6c6f-4df1-bbd6-b52c28d74fbd)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 273cb166-6c6f-4df1-bbd6-b52c28d74fbd))
(pad "S1" smd oval (at 16.799994 -5.500003 270) (size 1 0.2) (layers "In1.Cu") (pad "S1" smd oval (at 16.799994 -5.500003 270) (size 1 0.2) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 2b28a406-579d-4dc4-be01-1c521ea2ac2d)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 2b28a406-579d-4dc4-be01-1c521ea2ac2d))
(pad "S1" smd oval (at 16.799994 -16.350002 90) (size 4.8 0.2) (layers "In2.Cu") (pad "S1" smd oval (at 16.799994 -16.350002 90) (size 4.8 0.2) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 2cbf1227-1d60-42ae-a539-8d62167f96a5)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 2cbf1227-1d60-42ae-a539-8d62167f96a5))
(pad "S1" smd oval (at 8.399995 0) (size 17 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (pad "S1" smd oval (at 8.399995 0) (size 17 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 412224d4-71d1-44c1-a05d-2211efc58d9d)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 412224d4-71d1-44c1-a05d-2211efc58d9d))
(pad "S1" smd oval (at 9.199996 -20.6) (size 15.4 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (pad "S1" smd oval (at 9.199996 -20.6) (size 15.4 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 421defbd-c3ac-443a-a42e-a0cefadf1e09)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 421defbd-c3ac-443a-a42e-a0cefadf1e09))
(pad "S1" smd oval (at -0.000003 -7.150002 90) (size 10.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (pad "S1" smd oval (at -0.000003 -7.150002 90) (size 10.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 4ab82581-608d-4443-800a-d4eddde8a327)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 4ab82581-608d-4443-800a-d4eddde8a327))
(pad "S1" smd oval (at 16.799994 -5.500003 270) (size 1 0.2) (layers "In2.Cu") (pad "S1" smd oval (at 16.799994 -5.500003 270) (size 1 0.2) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 5254e4bd-beaa-4f02-871a-e62b964dd288)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 5254e4bd-beaa-4f02-871a-e62b964dd288))
(pad "S1" smd oval (at -0.000003 -15.65 270) (size 3.3 0.2) (layers "B.Cu" "B.Paste" "B.Mask") (pad "S1" smd oval (at -0.000003 -15.65 270) (size 3.3 0.2) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 54f3d212-4a49-40b2-937b-ce8f6960af7d)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 54f3d212-4a49-40b2-937b-ce8f6960af7d))
(pad "S1" smd oval (at 16.799994 -20.55 90) (size 0.3 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (pad "S1" smd oval (at 16.799994 -20.55 90) (size 0.3 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 61872770-4961-42b7-befd-6370e70808dc)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 61872770-4961-42b7-befd-6370e70808dc))
(pad "S1" smd oval (at 16.799994 -20.55 90) (size 0.3 0.2) (layers "In1.Cu") (pad "S1" smd oval (at 16.799994 -20.55 90) (size 0.3 0.2) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 6ef47bcd-289d-410b-bc7a-636311e0d8c7)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 6ef47bcd-289d-410b-bc7a-636311e0d8c7))
(pad "S1" smd oval (at 9.199996 -20.6) (size 15.4 0.2) (layers "B.Cu" "B.Paste" "B.Mask") (pad "S1" smd oval (at 9.199996 -20.6) (size 15.4 0.2) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 6ef9662d-3725-4065-9ec5-28f70cd8d90c)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 6ef9662d-3725-4065-9ec5-28f70cd8d90c))
(pad "S1" smd oval (at 16.799994 -9 270) (size 2.6 0.2) (layers "B.Cu" "B.Paste" "B.Mask") (pad "S1" smd oval (at 16.799994 -9 270) (size 2.6 0.2) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 6f7efcb7-7970-43da-b4c3-65252dbe8c2a)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 6f7efcb7-7970-43da-b4c3-65252dbe8c2a))
(pad "S1" smd oval (at 16.799994 -16.350002 90) (size 4.8 0.2) (layers "In1.Cu") (pad "S1" smd oval (at 16.799994 -16.350002 90) (size 4.8 0.2) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 7ce107c2-5bf4-4a9f-abda-07741a62e222)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 7ce107c2-5bf4-4a9f-abda-07741a62e222))
(pad "S1" smd oval (at -0.000003 -15.65 270) (size 3.3 0.2) (layers "In2.Cu") (pad "S1" smd oval (at -0.000003 -15.65 270) (size 3.3 0.2) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 81a8ed71-503b-4257-826f-dbabdead6a9b)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 81a8ed71-503b-4257-826f-dbabdead6a9b))
(pad "S1" smd oval (at 16.799994 -16.350002 90) (size 4.8 0.2) (layers "B.Cu" "B.Paste" "B.Mask") (pad "S1" smd oval (at 16.799994 -16.350002 90) (size 4.8 0.2) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 82b7f2e4-41ec-4726-8c3a-b0590032ae2b)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 82b7f2e4-41ec-4726-8c3a-b0590032ae2b))
(pad "S1" smd oval (at 16.799994 -5.500003 270) (size 1 0.2) (layers "B.Cu" "B.Paste" "B.Mask") (pad "S1" smd oval (at 16.799994 -5.500003 270) (size 1 0.2) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 849b5a00-2ce5-4652-87a7-49b022f5451b)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 849b5a00-2ce5-4652-87a7-49b022f5451b))
(pad "S1" smd oval (at -0.000003 -7.150002 90) (size 10.2 0.2) (layers "B.Cu" "B.Paste" "B.Mask") (pad "S1" smd oval (at -0.000003 -7.150002 90) (size 10.2 0.2) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 89719cb1-8a1b-4253-9a5e-c0a246bf89fc)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 89719cb1-8a1b-4253-9a5e-c0a246bf89fc))
(pad "S1" smd oval (at 9.199996 -20.6) (size 15.4 0.2) (layers "In1.Cu") (pad "S1" smd oval (at 9.199996 -20.6) (size 15.4 0.2) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 8bf29898-1084-4a87-92b2-4d7fde128eeb)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 8bf29898-1084-4a87-92b2-4d7fde128eeb))
(pad "S1" smd oval (at -0.000003 -0.05 90) (size 0.3 0.2) (layers "In1.Cu") (pad "S1" smd oval (at -0.000003 -0.05 90) (size 0.3 0.2) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 8f923172-3777-42e9-a9b3-1331f5825f08)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 8f923172-3777-42e9-a9b3-1331f5825f08))
(pad "S1" smd oval (at 16.799994 -9 270) (size 2.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (pad "S1" smd oval (at 16.799994 -9 270) (size 2.6 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 95c8abe8-6802-4b66-9b2a-b380f83052be)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 95c8abe8-6802-4b66-9b2a-b380f83052be))
(pad "S1" smd oval (at 16.799994 -2.200002 270) (size 1.5 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (pad "S1" smd oval (at 16.799994 -2.200002 270) (size 1.5 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp a0bcfb8c-bd15-4d4e-ac67-383524783d9d)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp a0bcfb8c-bd15-4d4e-ac67-383524783d9d))
(pad "S1" thru_hole circle (at 16.149993 -0.65 90) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask) (pad "S1" thru_hole circle (at 16.149993 -0.65 90) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp ac881c95-8d02-447e-afec-d6007b88ba31)) (solder_paste_margin -50) (zone_connect 2) (tstamp ac881c95-8d02-447e-afec-d6007b88ba31))
(pad "S1" smd oval (at 16.799994 -9 270) (size 2.6 0.2) (layers "In1.Cu") (pad "S1" smd oval (at 16.799994 -9 270) (size 2.6 0.2) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp bc778124-94dc-418e-b249-5d4d729008a2)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp bc778124-94dc-418e-b249-5d4d729008a2))
(pad "S1" smd oval (at 16.799994 -2.200002 270) (size 1.5 0.2) (layers "In1.Cu") (pad "S1" smd oval (at 16.799994 -2.200002 270) (size 1.5 0.2) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp bf3bbb2c-45a7-467a-b065-c2e7a94f717b)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp bf3bbb2c-45a7-467a-b065-c2e7a94f717b))
(pad "S1" smd oval (at 16.799994 -20.55 90) (size 0.3 0.2) (layers "In2.Cu") (pad "S1" smd oval (at 16.799994 -20.55 90) (size 0.3 0.2) (layers "In2.Cu")
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(pad "S1" smd oval (at 16.799994 -2.200002 270) (size 1.5 0.2) (layers "In2.Cu") (pad "S1" smd oval (at 16.799994 -2.200002 270) (size 1.5 0.2) (layers "In2.Cu")
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(pad "S1" smd oval (at 16.799994 -16.350002 90) (size 4.8 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (pad "S1" smd oval (at 16.799994 -16.350002 90) (size 4.8 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp eda6a354-2984-4181-868d-9500f4b40674)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp eda6a354-2984-4181-868d-9500f4b40674))
(pad "S1" smd oval (at -0.000003 -0.05 90) (size 0.3 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (pad "S1" smd oval (at -0.000003 -0.05 90) (size 0.3 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp fc003df0-427b-4662-890f-733d67825c62)) (solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp fc003df0-427b-4662-890f-733d67825c62))
(pad "V1" thru_hole circle (at 0.649996 -19.950002) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask) (pad "V1" thru_hole circle (at 0.649996 -19.950002) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 67fc7782-da04-4b5d-8fae-7f6a05566959)) (solder_paste_margin -50) (zone_connect 2) (tstamp 67fc7782-da04-4b5d-8fae-7f6a05566959))
(pad "V2" thru_hole circle (at 0.649996 -18.100003) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask) (pad "V2" thru_hole circle (at 0.649996 -18.100003) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 20241e78-e3ce-46a7-8a54-531eddfc8562)) (solder_paste_margin -50) (zone_connect 2) (tstamp 20241e78-e3ce-46a7-8a54-531eddfc8562))
(pad "V3" thru_hole circle (at 0.649996 -13.15) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask) (pad "V3" thru_hole circle (at 0.649996 -13.15) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 101a2475-d947-4ccf-9386-7768c9ba064f)) (solder_paste_margin -50) (zone_connect 2) (tstamp 101a2475-d947-4ccf-9386-7768c9ba064f))
(pad "V4" thru_hole circle (at 0.649996 -1.100002) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask) (pad "V4" thru_hole circle (at 0.649996 -1.100002) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 680ee0bd-9d17-4ebc-96e6-e66b778ab690)) (solder_paste_margin -50) (zone_connect 2) (tstamp 680ee0bd-9d17-4ebc-96e6-e66b778ab690))
(zone (net 0) (net_name "") (layers *.Cu) (tstamp 46ef2713-c532-4f14-a7a2-ae0599cd4c72) (hatch edge 0.508) (zone (net 0) (net_name "") (layers *.Cu) (tstamp 46ef2713-c532-4f14-a7a2-ae0599cd4c72) (hatch edge 0.508)
(connect_pads (clearance 0)) (connect_pads (clearance 0))
(min_thickness 0.254) (min_thickness 0.254)