(module R0402 (layer F.Cu) (tedit 6034F260)
  (pad 1 smd roundrect (at -0.485 0 90) (size 0.59 0.64) (layers F.Cu F.Mask) (roundrect_rratio 0.25))
  (pad 2 smd roundrect (at 0.485 0 90) (size 0.59 0.64) (layers F.Cu F.Mask) (roundrect_rratio 0.25))
)