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andreika-git 2023-03-20 19:21:47 +02:00
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commit 6a819db4f1
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Subproject commit 7ef8c3fdd5ef4b19f242791c7893ac71e4c8c7fb
Subproject commit 007a690fcdbf2b4b90cc32a3359d88fb7714d6b7

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(kicad_pcb (version 20211014) (generator pcbnew)
(general
(thickness 4.69)
(thickness 1.6)
)
(paper "User" 431.8 379.4)
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(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In1.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 2" (type "prepreg") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In2.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 3" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "dielectric 1" (type "core") (thickness 0.2) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In1.Cu" (type "copper") (thickness 0.0175))
(layer "dielectric 2" (type "prepreg") (thickness 1.075) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In2.Cu" (type "copper") (thickness 0.0175))
(layer "dielectric 3" (type "core") (thickness 0.2) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste"))
@ -655,7 +655,7 @@
(net 81 "/OUT_VVT2_B2") (pinfunction "120") (pintype "passive") (tstamp e8f5cd43-5a34-4df5-beb6-491bf05ae5f8))
(pad "121" thru_hole circle locked (at 123.95 58.86 180) (size 2.6 2.6) (drill 2.2) (layers *.Cu *.Mask "F.SilkS")
(net 14 "Net-(F2-Pad1)") (pinfunction "121") (pintype "passive") (tstamp 992bd24f-bbca-4fd7-8011-94a23e396848))
(model "footprints/TE_368255-2.wrl"
(model "footprints/TE_368255-2.wrl" hide
(offset (xyz -4.5 -56 -5))
(scale (xyz 10 10 10))
(rotate (xyz -90 0 0))