This commit is contained in:
rusefi 2019-02-02 18:47:28 -05:00
parent 259dd91a8a
commit d4cc466f07
1 changed files with 2 additions and 0 deletions

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1) set solder mask to 0.003 inches, per OSHPark suggestion.
2) make footprint pads longer so that we have some metal not covered by the chip