4 lines
324 B
Plaintext
4 lines
324 B
Plaintext
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1) RESOLVED IN R0.2 DPAK2 is apparently different than D2PAK, now it uses TO-263AB
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2) RESOLVED IN R0.2 Make vias under large GND pad larger to allow more heat form iron during soldering
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3) RESOLVED IN R0.2 move Via's to PCB edge to allow install on proto area of Frankenso
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4) RESOLVED IN R0.2 add 4-40 mounting screw hole(s)
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