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CR merge

This commit is contained in:
rusefi 2018-02-20 00:09:35 +03:00
parent 48b1396639
commit 0ee0ff2cda
12 changed files with 12255 additions and 3473 deletions
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29
hardware/Common_Rail_MC33816/Common_Rail_MC33816.csv Normal file
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Reference, Quantity, Value, Footprint, Datasheet, MFG,MFG#, VEND1,VEND1#, VEND2,VEND2#
C10 C11 C13 C8 ,4,0.1uF,Capacitors_SMD:C_0805,,AVX,08055C104MAT2A,DIGI,478-3351-1-ND,,
C12 ,1,4.7uF,Capacitors_SMD:C_0805,,Taiyo Yuden,TMK212AB7475KG-T,DIGI,587-2990-1-ND,,
C14 C15 ,2,1000uF,Capacitors_ThroughHole:CP_Radial_D22.0mm_P10.00mm_SnapIn,,Cornell,SLPX102M100A3P3,DIGI,338-1553-ND,,
C21 C22 ,2,390uF,Capacitors_ThroughHole:CP_Radial_D16.0mm_P7.50mm,,Nichicon,UHE2A391MHD,DIGI,493-1680-ND,,
C16 C17 C25 C27 ,4,0.22uF,Capacitors_SMD:C_0805,,KEMET,C0805C224M1RACTU,DIGI,399-9205-1-ND,,
C26 ,1,470pF,Pin_Headers:Pin_Header_Straight_2x08_Pitch2.54mm,,TDK,CGA4C2C0G2A471J060AA,DIGI,445-6953-1-ND,,
C35 C36 C37 C38 C55 C56 C57 C58 C63 C71 ,10,1000pF,Capacitors_SMD:C_0805,,avx,08051C102KAT2A,DIGI,478-1352-1-ND,,
C39 C40 C41 C42 C64 ,5,0.33uF,Capacitors_SMD:C_0805,,Yageo,CC0805KKX7R8BB334,DIGI,311-3385-1-ND,,
C43 C44 C45 C46 C47 C48 C49 C50 C65 C67 ,10,4700pF,Capacitors_SMD:C_0805,,TDK,C2012C0G2A472J125AA,DIGI,445-2324-1-ND,,
C23 C24 C28 C59 C60 C73 ,6,330pF,Capacitors_SMD:C_0805,,Kemet,C0805C331J1GACTU,DIGI,399-1131-1-ND,,
C9 ,1,1uF,Capacitors_SMD:C_0805,,Yageo,CC0805KKX7R8BB105,DIGI,311-1456-1-ND,,
D10 D10_2 D11 D11_2 ,4,SBR10200CTL,TO_SOT_Packages_SMD:TO-252-2Lead,,Diodes,SBR10200CTL-13,DIGI,SBR10200CTL-13DICT-ND,,
D12 D13 D14 D15 D16 D17 ,6,STPS2H100UY,Diodes_SMD:D_SMB,,ST,STPS2H100UY,DIGI,497-11093-1-ND,,
D9 ,1,FFD10UP20S,TO_SOT_Packages_SMD:TO-252-2Lead,,ONSEMI,FFD10UP20S,DIGI,FFD10UP20SCT-ND,,
J10 J11 J12 J8 J9 ,5,INJ_Term,Terminal_Blocks:TerminalBlock_bornier-2_P5.08mm,,onshore,OSTTG025100B,DIGI,ED2703-ND,,
J14 ,1,CONN_01X03,Pin_Headers:Pin_Header_Straight_1x04_Pitch2.54mm,
J3 J4 ,2,CONN_02X08,Pin_Headers:Pin_Header_Straight_2x08_Pitch2.54mm,,sullins,SBH11-PBPC-D08-ST-BK,DIGI,S9171-ND,,
J5 J6 J7 ,3,CONN_01X03,Pin_Headers:Pin_Header_Straight_1x03_Pitch2.54mm,
L1 ,1,6uH,rusEFI_LIB:744710610-Inductor,,Würth Elektronik,744710610,DIGI,732-3255-ND,,
L2 ,1,10uH,rusEFI_LIB:IHLP6767GZER100M01,,Vishay,IHLP6767GZER100M01,DIGI,541-1259-1-ND,,
Q10 Q11 Q12 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Q9 ,11,BUK9230-100B,TO_SOT_Packages_SMD:TO-252-2Lead,,Nexperia,BUK9230-100B,DIGI,1727-4708-1-ND,,
R12 ,1,0R010,Resistors_SMD:R_1206_HandSoldering,,Ohmite,MCS1632R010FER,DIGI,MCS1632R010FERCT-ND,,
R11 R13 R14 R15 R16 R17 R18 R19 R20 R23 R24 ,11,10R,Resistors_SMD:R_0805,,Stackpole,RMCF0805JG10R0,DIGI,RMCF0805JG10R0CT-ND,,
R21 R22 R26 ,3,0R015,Resistors_SMD:R_1206_HandSoldering,,Panasonic,ERJ-8CWFR015V,DIGI,P0.015BVCT-ND,,
R10 R9 ,2,5.1R,Resistors_SMD:R_0805,,Stackpole,RMCF0805JT5R10,DIGI,RMCF0805JT5R10CT-ND,,
TP101 TP102 TP103 TP104 TP105 TP106 TP23 TP24 ,8,CONN_01X01,Connect:PINTST,
U4 ,1,MC33816,Housings_QFP:HTQFP-64-1EP_10x10mm_Pitch0.5mm_ThermalPad,,FreeScale,MC33816AE,Mouser,841-MC33816AE,,
Y1 ,1,???,,
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hardware/Common_Rail_MC33816/Common_Rail_MC33816.kicad_pcb
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hardware/Common_Rail_MC33816/Common_Rail_MC33816.net Normal file
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hardware/Common_Rail_MC33816/Common_Rail_MC33816.pro
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update=2/4/2018 5:45:40 PM
update=2/19/2018 8:57:57 AM
version=1
last_client=kicad
[cvpcb]
@ -31,37 +31,36 @@ ModuleOutlineThickness=0.254
version=1
LibDir=../rusefi_lib
[eeschema/libraries]
LibName1=Common_Rail_MC33816-rescue
LibName2=power
LibName3=device
LibName4=transistors
LibName5=conn
LibName6=linear
LibName7=regul
LibName8=74xx
LibName9=cmos4000
LibName10=adc-dac
LibName11=memory
LibName12=xilinx
LibName13=microcontrollers
LibName14=dsp
LibName15=microchip
LibName16=analog_switches
LibName17=motorola
LibName18=texas
LibName19=intel
LibName20=audio
LibName21=interface
LibName22=digital-audio
LibName23=philips
LibName24=display
LibName25=cypress
LibName26=siliconi
LibName27=opto
LibName28=atmel
LibName29=contrib
LibName30=valves
LibName31=mc33816
LibName1=power
LibName2=device
LibName3=transistors
LibName4=conn
LibName5=linear
LibName6=regul
LibName7=74xx
LibName8=cmos4000
LibName9=adc-dac
LibName10=memory
LibName11=xilinx
LibName12=microcontrollers
LibName13=dsp
LibName14=microchip
LibName15=analog_switches
LibName16=motorola
LibName17=texas
LibName18=intel
LibName19=audio
LibName20=interface
LibName21=digital-audio
LibName22=philips
LibName23=display
LibName24=cypress
LibName25=siliconi
LibName26=opto
LibName27=atmel
LibName28=contrib
LibName29=valves
LibName30=mc33816
[schematic_editor]
version=1
PageLayoutDescrFile=../rusefi_lib/Border.kicad_wks

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hardware/Common_Rail_MC33816/Common_Rail_MC33816.sch
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hardware/Common_Rail_MC33816/Common_Rail_MC33816.xml Normal file
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hardware/Common_Rail_MC33816/Common_Rail_MC33816_layout.pdf
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hardware/Common_Rail_MC33816/Common_Rail_MC33816_schematic.pdf
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hardware/rusefi_lib/rusefi_lib.pretty/HTQFP-64-1EP_10x10mm_Pitch0.5mm_ThermalPad_for_MC33816.kicad_mod Normal file
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(module HTQFP-64-1EP_10x10mm_Pitch0.5mm_ThermalPad_for_MC33816 (layer F.Cu) (tedit 5A8AACF9)
(descr "64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad")
(tags "HTQFP-64 Pitch 0.5_for_MC33816_Slug")
(attr smd)
(fp_text reference U? (at 0 -7.45) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MC33816 (at 0 7.45) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -4 -5) (end 5 -5) (layer F.Fab) (width 0.1))
(fp_line (start 5 -5) (end 5 5) (layer F.Fab) (width 0.1))
(fp_line (start 5 5) (end -5 5) (layer F.Fab) (width 0.1))
(fp_line (start -5 5) (end -5 -4) (layer F.Fab) (width 0.1))
(fp_line (start -5 -4) (end -4 -5) (layer F.Fab) (width 0.1))
(fp_line (start -6.7 -6.7) (end -6.7 6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 6.7 -6.7) (end 6.7 6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -6.7 -6.7) (end 6.7 -6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -6.7 6.7) (end 6.7 6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.175 -5.175) (end -5.175 -4.225) (layer F.SilkS) (width 0.12))
(fp_line (start 5.175 -5.175) (end 5.175 -4.125) (layer F.SilkS) (width 0.12))
(fp_line (start 5.175 5.175) (end 5.175 4.125) (layer F.SilkS) (width 0.12))
(fp_line (start -5.175 5.175) (end -5.175 4.125) (layer F.SilkS) (width 0.12))
(fp_line (start -5.175 -5.175) (end -4.125 -5.175) (layer F.SilkS) (width 0.12))
(fp_line (start -5.175 5.175) (end -4.125 5.175) (layer F.SilkS) (width 0.12))
(fp_line (start 5.175 5.175) (end 4.125 5.175) (layer F.SilkS) (width 0.12))
(fp_line (start 5.175 -5.175) (end 4.125 -5.175) (layer F.SilkS) (width 0.12))
(fp_line (start -5.175 -4.225) (end -6.45 -4.225) (layer F.SilkS) (width 0.12))
(pad 1 smd rect (at -5.7 -3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -5.7 -3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -5.7 -2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -5.7 -2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -5.7 -1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -5.7 -1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -5.7 -0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -5.7 -0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -5.7 0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -5.7 0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 12 smd rect (at -5.7 1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -5.7 2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at -5.7 2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -5.7 3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -5.7 3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at -3.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 32 smd rect (at 3.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 41 smd rect (at 5.7 -0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 42 smd rect (at 5.7 -0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 44 smd rect (at 5.7 -1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 45 smd rect (at 5.7 -2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 47 smd rect (at 5.7 -3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 48 smd rect (at 5.7 -3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 49 smd rect (at 3.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 50 smd rect (at 3.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
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(pad 64 smd rect (at -3.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 65 smd rect (at 0 0 180) (size 5.7 5.7) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin -1.8) (solder_paste_margin -1.8))
(pad 65 thru_hole circle (at 2.5 -2.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at 1.5 -2.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at 0.5 -2.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -0.5 -2.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -1.5 -2.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -2.5 -2.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -2.5 -1.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -2.5 -0.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -1.5 -0.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -1.5 -1.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
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(pad 65 thru_hole circle (at 0.5 -1.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at 1.5 -1.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at 1.5 -0.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
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(pad 65 thru_hole circle (at 2.5 -0.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -2.5 0.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -2.5 1.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -2.5 2.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -1.5 2.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -1.5 1.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -1.5 0.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -0.5 0.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -0.5 1.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at -0.5 2.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at 0.5 2.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at 0.5 1.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at 0.5 0.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at 1.5 0.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at 1.5 1.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 thru_hole circle (at 1.5 2.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
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(pad 65 thru_hole circle (at 2.5 0.5 90) (size 0.3 0.3) (drill 0.2) (layers *.Cu F.Adhes))
(pad 65 smd rect (at 0 0 180) (size 5.7 5.7) (layers B.Cu)
(solder_mask_margin -4) (solder_paste_margin -4))
(model ${KISYS3DMOD}/Housings_QFP.3dshapes/TQFP-64_10x10mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

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hardware/rusefi_lib/rusefi_lib.pretty/IHLP6767GZER100M01.kicad_mod Normal file
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(module IHLP6767GZER100M01 (layer F.Cu) (tedit 5A839B6F)
(descr IHLP6767GZER100M01)
(tags IHLP6767GZER100M01)
(attr smd)
(fp_text reference REF** (at 0.09906 -3.85064) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value IHLP6767GZER100M01 (at 0 4.20116) (layer F.Fab) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 9 7) (end 9 -8) (layer F.SilkS) (width 0.127))
(fp_line (start -9 -8) (end -9 8) (layer F.SilkS) (width 0.127))
(fp_line (start 8.575 8.575) (end -8.575 8.575) (layer F.SilkS) (width 0.15))
(fp_line (start 8.575 -8.575) (end -8.575 -8.575) (layer F.SilkS) (width 0.15))
(pad 2 smd rect (at 8.1225 0) (size 3.825 12.32) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -8.1225 0) (size 3.825 12.32) (layers F.Cu F.Paste F.Mask))
)