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todo

This commit is contained in:
rusEfi 2019-02-03 23:45:12 -05:00
parent 97a1f10c39
commit bbd00a6609
1 changed files with 5 additions and 2 deletions
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7
hardware/TLE8110ED_breakout_board/known_issues.txt
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1) set solder mask to 0.003 inches, per OSHPark suggestion. 1) set solder mask to 0.003 inches, per OSHPark suggestion.
2) make footprint pads longer so that we have some metal not covered by the chip 2) make footprint pads longer so that we have some metal not covered by the chip
3) since RST is not needed, connect with Pull-up resistor to VCC
4) since EN is not needed, connect with Pull-up resistor to VCC
5) it is highly recommended to connect the exposed pad to GND pins on the PCB.