add pdfs and missing image (#94)

Home.md

@@ -1,6 +1,6 @@
 ### Click on the image below for the latest builds and downloads!
 
-[![](https://rusefi.com/wiki/images/e/e1/Latest_bundle_border.png)](https://github.com/rusefi/rusefi/wiki/Download)
+[![](Images/Latest_bundle_border.png)](https://github.com/rusefi/rusefi/wiki/Download)
 
 Hello and welcome!
 

Overview.md

@@ -1,6 +1,6 @@
 ### Click on the image below for the latest builds and downloads!
 
-[![](https://rusefi.com/wiki/images/e/e1/Latest_bundle_border.png)](https://github.com/rusefi/rusefi_documentation/wiki/Download)
+[![](Images/Latest_bundle_border.png)](https://github.com/rusefi/rusefi_documentation/wiki/Download)
 
 Hello and welcome!
 

PCB-Design-Rules.md

@@ -10,12 +10,12 @@ Some latest modular boards now live at separate repositories like https://github
 * We are targeting at DIY so BGA package is not an option.
 * 1oz copper suggested
 * Trace/via temperature rise should be 10C or less. That's based on UL 105C max while MFG's often allow up to 150C, and UL's 130C max solder joints. We are allowing for 95C board temps to dump to a +85C ambient. It is common a PCB has a rated temperature up to 125C, you need to check the substrate's datasheet. Look for peel strength, and Glass Transition (Tg) temperatures. When in doubt, typically 105C is a safe max temperature.  
-* Thermal relief's as noted here https://web.pa.msu.edu/hep/atlas/l1calo/hub/hardware/components/power/synqor_thermal_relief_study.pdf Archive copy found here https://rusefi.com/wiki/images/7/71/Synqor_thermal_relief_study.pdf
+* Thermal relief's as noted here https://web.pa.msu.edu/hep/atlas/l1calo/hub/hardware/components/power/synqor_thermal_relief_study.pdf Archive [here](pdfs/Synqor_thermal_relief_study.pdf)
 * Suggested to use 12/12 traces and setback's such that low cost MFG houses can produce quality product. This can not always be followed, especially when you have a chip with 7 mil spacing, but if you try to follow this 12/12 rule, you'll get a higher yield from your PCB's. Even an 8/8 house can have issues as 8/8 is X/Y, a 45 degree angled traces would have a tolerance of √(8² + 8²)= 11.3, which rounds up to 12 mil. Most PCB layout programs will keep your angled setbacks at 8 mill instead of 12 mil. So you should set your setbacks to 12 to prevent MFG issues. 
 * Test points are suggest as a way to diagnose various potential issues. 
 * Any signal of about 1kHz or higher, will have GND currents that try to follow the adjacent trace. Use this practice to follow current loops and to prevent signals from coupling.
-* GND plane should not have physical barriers, signals and chips should be routed accordingly such that they do not cross naturally. GND plane barriers are almost never needed unless you get into RF circuits with strip line requirements. Which is not very likely with an automotive PCB. See this Maxim tutorial http://www.maximintegrated.com/en/app-notes/index.mvp/id/5450 archived copy here http://rusefi.com/wiki/images/a/aa/Successful_PCB_Grounding_with_Mixed-Signal_Chips_-_Follow_the_Path_of_Least_Impedance_-_Tutorial_-_Maxim.pdf
+* GND plane should not have physical barriers, signals and chips should be routed accordingly such that they do not cross naturally. GND plane barriers are almost never needed unless you get into RF circuits with strip line requirements. Which is not very likely with an automotive PCB. See this Maxim tutorial http://www.maximintegrated.com/en/app-notes/index.mvp/id/5450 archived copy [here](pdfs/Successful_PCB_Grounding_with_Mixed-Signal_Chips_-_Follow_the_Path_of_Least_Impedance_-_Tutorial_-_Maxim.pdf)
 * Name caps with pF and uF, avoid nF. Also include leading 0's. Example, 0.1uf instead of 100nF or .1uF. Also 2.2uF instead of 2u2F. Also 2.2k instead of 2k2. Naming conventions are important as scripts need this kind of consistency.
 * Ideally components available at both http://digikey.com/ and http://www.mouser.com/ should be used
-* Via sizing for via's to contain a wire, if solid should 10% larger than the diameter. As well stranded wire takes a larger diameter than solid. Use the below chart to approximate the stranded diameter, then add at least 10%. For example 20AWG wire, per that chart has a max diameter of 0.037in, 10% is 0.0037, and via plating is about 0.001, which means we need a min via drill diameter of 0.037in + 0.0037 + 0.001 + 0.001 = 0.0427 in diameter.  http://rusefi.com/wiki/images/c/cb/Stranded_Wire_Chart.pdf
-* High speed stuff like USB should follow Intel's recommendations found in hs_usb_pdg_r1_0.pdf https://rusefi.com/wiki/images/6/63/Hs_usb_pdg_r1_0_zjnjtx.pdf also this guide for the power signals https://rusefi.com/wiki/images/1/1a/Power_delivery_motherboards.pdf
+* Via sizing for via's to contain a wire, if solid should 10% larger than the diameter. As well stranded wire takes a larger diameter than solid. Use the below chart to approximate the stranded diameter, then add at least 10%. For example 20AWG wire, per that chart has a max diameter of 0.037in, 10% is 0.0037, and via plating is about 0.001, which means we need a min via drill diameter of 0.037in + 0.0037 + 0.001 + 0.001 = 0.0427 in diameter.  [Stranded Wire Chart](pdfs/Stranded_Wire_Chart.pdf)
+* High speed stuff like USB should follow Intel's recommendations found in [hs_usb_pdg_r1_0.pdf](pdfs/Hs_usb_pdg_r1_0_zjnjtx.pdf) also [this guide](pdfs/Power_delivery_motherboards.pdf) for the power signals.

STM32F4Discovery-Repair.md

@@ -75,7 +75,7 @@ Replace the LED or ignore it. This is only an indicator that you have 3V.
 
 [BOM archive](http://www.st.com/st-web-ui/static/active/en/resource/technical/document/bill_of_materials/stm32f4discovery_bom.zip)
 
-https://rusefi.com/wiki/index.php?title=File:Stm32f4discovery_schematics.pdf
+[Schematic](Stm32f4discovery_schematics.pdf)
 
 ## Normal measurements
 Here are several measurements to function as a point of reference. These were taken with a known good board.

Trigger-Hardware.md

@@ -43,13 +43,11 @@ If the above didn't detail specifically what you need, here are some note that m
 #### VR lower level details, formulas, app notes, etc
 VR's have many critical characteristics that need may be of concern. The variations in design will result in different minimum RPM's, maximum RPM's, noise immunity and other such items that result in properly detecting the shaft angle. There are critical dimensions and critical materials used in parts of a VR that need to be taken into consideration. There are some equations and examples noted on this application note http://sensing.honeywell.com/vrs-app-note-005934-2-en-final-26jun12.pdf These equations help you determine the min RPM, load resistor and voltages produced at higher RPM's. This is also a useful app note about hall sensor. https://sensing.honeywell.com/hallbook.pdf 
 
-This application note is copied here for archival purposes. 
+This application note is copied [here](pdfs/VRS_App_Note_005934-2-EN_Final_26Jun12.pdf) for archival purposes. 
 
-http://rusefi.com/wiki/images/2/24/VRS_App_Note_005934-2-EN_Final_26Jun12.pdf
+[Hall Book](pdfs/Hallbook.pdf)
 
-https://rusefi.com/wiki/images/0/0e/Hallbook.pdf
-
-There is a condensed version of this app note found here http://sensing.honeywell.com/index.php?ci_id=51555 and archived here http://rusefi.com/wiki/images/b/b3/VRS_output_voltage_calculations.pdf
+There is a condensed version of this app note found here http://sensing.honeywell.com/index.php?ci_id=51555 and archived [here](pdfs/VRS_output_voltage_calculations.pdf)
 
 As an example, see the below spreadsheet that includes the information from the above application note. This is a starting point and you can copy this spread sheet then enter specifics relative to your application.