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wideband
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carrier probably done

This commit is contained in:
Matthew Kennedy 2020-12-01 01:33:56 -08:00
parent db663ea18a
commit 62c97d966f
4 changed files with 46 additions and 5 deletions
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33
board_carrier/board_carrier.kicad_pcb
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@ -2,10 +2,10 @@
(general (general
(thickness 1.6) (thickness 1.6)
(drawings 46) (drawings 47)
(tracks 123) (tracks 123)
(zones 0) (zones 0)
(modules 13) (modules 14)
(nets 21) (nets 21)
) )
@ -149,6 +149,26 @@
(add_net "Net-(J3-Pad7)") (add_net "Net-(J3-Pad7)")
) )
(module rusefi:JLC_PCB_TAG (layer F.Cu) (tedit 5E6E29AB) (tstamp 5FC69575)
(at 50.6 56.4)
(fp_text reference JLCTAG** (at 0 0.5) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value JLC_PCB_TAG (at 0 -0.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 0 0) (end 19.05 0) (layer F.SilkS) (width 0.12))
(fp_line (start 19.05 0) (end 19.05 3.81) (layer F.SilkS) (width 0.12))
(fp_line (start 19.05 3.81) (end 0 3.81) (layer F.SilkS) (width 0.12))
(fp_line (start 0 3.81) (end 0 0) (layer F.SilkS) (width 0.12))
(fp_text user "JLC Order Number" (at 9.525 0.635) (layer F.SilkS)
(effects (font (size 0.762 0.762) (thickness 0.127)))
)
(fp_text user JLCJLCJLCJLC (at 9.525 2.54) (layer F.SilkS)
(effects (font (size 1.524 1.524) (thickness 0.2032)))
)
)
(module Symbol:OSHW-Logo_11.4x12mm_SilkScreen (layer B.Cu) (tedit 0) (tstamp 5FC692B8) (module Symbol:OSHW-Logo_11.4x12mm_SilkScreen (layer B.Cu) (tedit 0) (tstamp 5FC692B8)
(at 60 83 180) (at 60 83 180)
(descr "Open Source Hardware Logo") (descr "Open Source Hardware Logo")
@ -1024,6 +1044,9 @@
) )
) )
(gr_text v1.0 (at 44.4 66.2) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(gr_text 5v (at 45 71.2) (layer B.SilkS) (gr_text 5v (at 45 71.2) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror)) (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
) )
@ -1255,7 +1278,7 @@
(segment (start 71.5 77.42) (end 72.7 78.62) (width 2) (layer F.Cu) (net 18)) (segment (start 71.5 77.42) (end 72.7 78.62) (width 2) (layer F.Cu) (net 18))
(segment (start 71.5 77) (end 71.5 77.42) (width 2) (layer F.Cu) (net 18)) (segment (start 71.5 77) (end 71.5 77.42) (width 2) (layer F.Cu) (net 18))
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5FC53F20) (hatch edge 0.508) (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5FC69622) (hatch edge 0.508)
(connect_pads (clearance 0.2)) (connect_pads (clearance 0.2))
(min_thickness 0.19) (min_thickness 0.19)
(fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.2)) (fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.2))
@ -1304,7 +1327,7 @@
) )
) )
) )
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5FC53F1D) (hatch edge 0.508) (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5FC6961F) (hatch edge 0.508)
(connect_pads (clearance 0.2)) (connect_pads (clearance 0.2))
(min_thickness 0.254) (min_thickness 0.254)
(fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@ -1548,7 +1571,7 @@
) )
) )
) )
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5FC53F1A) (hatch edge 0.508) (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5FC6961C) (hatch edge 0.508)
(connect_pads yes (clearance 0.2)) (connect_pads yes (clearance 0.2))
(min_thickness 0.19) (min_thickness 0.19)
(fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.4)) (fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.4))

8
board_carrier/export/carrier_bom.csv Normal file
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@ -0,0 +1,8 @@
Comment,Designator,Footprint, LCSC
1u,"C1,C2,C3",Capacitor_SMD:C_0603_1608Metric,C15849
D_TVS,D1,Diode_SMD:D_SMC,C133648
D_Schottky,D2,Diode_SMD:D_SMA,C8678
220,R1,Resistor_SMD:R_0603_1608Metric,C22962
470,R2,Resistor_SMD:R_0603_1608Metric,C23179
TJA1051T-3,U1,Package_SO:SOIC-8_3.9x4.9mm_P1.27mm,C38695
LM78M05_TO252,U2,Package_TO_SOT_SMD:TO-252-2,C58069
1 Comment Designator Footprint LCSC
2 1u C1,C2,C3 Capacitor_SMD:C_0603_1608Metric C15849
3 D_TVS D1 Diode_SMD:D_SMC C133648
4 D_Schottky D2 Diode_SMD:D_SMA C8678
5 220 R1 Resistor_SMD:R_0603_1608Metric C22962
6 470 R2 Resistor_SMD:R_0603_1608Metric C23179
7 TJA1051T-3 U1 Package_SO:SOIC-8_3.9x4.9mm_P1.27mm C38695
8 LM78M05_TO252 U2 Package_TO_SOT_SMD:TO-252-2 C58069

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board_carrier/export/carrier_gerber.zip Normal file
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10
board_carrier/export/carrier_pos.csv Normal file
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@ -0,0 +1,10 @@
Designator,Val,Package,Mid X,Mid Y,Rotation,Layer
C1,1u,C_0603_1608Metric,60.9,-79.1,0,top
C2,1u,C_0603_1608Metric,58.8,-88,0,top
C3,1u,C_0603_1608Metric,55.2,-84.4,180,top
D1,D_TVS,D_SMC,67.1,-73.8,90,top
D2,D_Schottky,D_SMA,56.25,-69.75,180,top
R1,220,R_0603_1608Metric,55.2,-86,180,top
R2,470,R_0603_1608Metric,55.2,-82.8,180,top
U1,TJA1051T-3,SOIC-8_3.9x4.9mm_P1.27mm,53,-79.25,270,top
U2,LM78M05_TO252,TO-252-2,63,-83.5,0,top
1 Designator Val Package Mid X Mid Y Rotation Layer
2 C1 1u C_0603_1608Metric 60.9 -79.1 0 top
3 C2 1u C_0603_1608Metric 58.8 -88 0 top
4 C3 1u C_0603_1608Metric 55.2 -84.4 180 top
5 D1 D_TVS D_SMC 67.1 -73.8 90 top
6 D2 D_Schottky D_SMA 56.25 -69.75 180 top
7 R1 220 R_0603_1608Metric 55.2 -86 180 top
8 R2 470 R_0603_1608Metric 55.2 -82.8 180 top
9 U1 TJA1051T-3 SOIC-8_3.9x4.9mm_P1.27mm 53 -79.25 270 top
10 U2 LM78M05_TO252 TO-252-2 63 -83.5 0 top