carrier probably done

board_carrier/board_carrier.kicad_pcb

@@ -2,10 +2,10 @@
 
   (general
     (thickness 1.6)
-    (drawings 46)
+    (drawings 47)
     (tracks 123)
     (zones 0)
-    (modules 13)
+    (modules 14)
     (nets 21)
   )
 
@@ -149,6 +149,26 @@
     (add_net "Net-(J3-Pad7)")
   )
 
+  (module rusefi:JLC_PCB_TAG (layer F.Cu) (tedit 5E6E29AB) (tstamp 5FC69575)
+    (at 50.6 56.4)
+    (fp_text reference JLCTAG** (at 0 0.5) (layer F.SilkS) hide
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_text value JLC_PCB_TAG (at 0 -0.5) (layer F.Fab)
+      (effects (font (size 1 1) (thickness 0.15)))
+    )
+    (fp_line (start 0 0) (end 19.05 0) (layer F.SilkS) (width 0.12))
+    (fp_line (start 19.05 0) (end 19.05 3.81) (layer F.SilkS) (width 0.12))
+    (fp_line (start 19.05 3.81) (end 0 3.81) (layer F.SilkS) (width 0.12))
+    (fp_line (start 0 3.81) (end 0 0) (layer F.SilkS) (width 0.12))
+    (fp_text user "JLC Order Number" (at 9.525 0.635) (layer F.SilkS)
+      (effects (font (size 0.762 0.762) (thickness 0.127)))
+    )
+    (fp_text user JLCJLCJLCJLC (at 9.525 2.54) (layer F.SilkS)
+      (effects (font (size 1.524 1.524) (thickness 0.2032)))
+    )
+  )
+
   (module Symbol:OSHW-Logo_11.4x12mm_SilkScreen (layer B.Cu) (tedit 0) (tstamp 5FC692B8)
     (at 60 83 180)
     (descr "Open Source Hardware Logo")
@@ -1024,6 +1044,9 @@
     )
   )
 
+  (gr_text v1.0 (at 44.4 66.2) (layer B.SilkS)
+    (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
+  )
   (gr_text 5v (at 45 71.2) (layer B.SilkS)
     (effects (font (size 1 1) (thickness 0.15)) (justify mirror))
   )
@@ -1255,7 +1278,7 @@
   (segment (start 71.5 77.42) (end 72.7 78.62) (width 2) (layer F.Cu) (net 18))
   (segment (start 71.5 77) (end 71.5 77.42) (width 2) (layer F.Cu) (net 18))
 
-  (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5FC53F20) (hatch edge 0.508)
+  (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5FC69622) (hatch edge 0.508)
     (connect_pads (clearance 0.2))
     (min_thickness 0.19)
     (fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.2))
@@ -1304,7 +1327,7 @@
       )
     )
   )
-  (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5FC53F1D) (hatch edge 0.508)
+  (zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5FC6961F) (hatch edge 0.508)
     (connect_pads (clearance 0.2))
     (min_thickness 0.254)
     (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
@@ -1548,7 +1571,7 @@
       )
     )
   )
-  (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5FC53F1A) (hatch edge 0.508)
+  (zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5FC6961C) (hatch edge 0.508)
     (connect_pads yes (clearance 0.2))
     (min_thickness 0.19)
     (fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.4))

board_carrier/export/carrier_bom.csv

@@ -0,0 +1,8 @@
+Comment,Designator,Footprint, LCSC
+1u,"C1,C2,C3",Capacitor_SMD:C_0603_1608Metric,C15849
+D_TVS,D1,Diode_SMD:D_SMC,C133648
+D_Schottky,D2,Diode_SMD:D_SMA,C8678
+220,R1,Resistor_SMD:R_0603_1608Metric,C22962
+470,R2,Resistor_SMD:R_0603_1608Metric,C23179
+TJA1051T-3,U1,Package_SO:SOIC-8_3.9x4.9mm_P1.27mm,C38695
+LM78M05_TO252,U2,Package_TO_SOT_SMD:TO-252-2,C58069

board_carrier/export/carrier_pos.csv

@@ -0,0 +1,10 @@
+Designator,Val,Package,Mid X,Mid Y,Rotation,Layer
+C1,1u,C_0603_1608Metric,60.9,-79.1,0,top
+C2,1u,C_0603_1608Metric,58.8,-88,0,top
+C3,1u,C_0603_1608Metric,55.2,-84.4,180,top
+D1,D_TVS,D_SMC,67.1,-73.8,90,top
+D2,D_Schottky,D_SMA,56.25,-69.75,180,top
+R1,220,R_0603_1608Metric,55.2,-86,180,top
+R2,470,R_0603_1608Metric,55.2,-82.8,180,top
+U1,TJA1051T-3,SOIC-8_3.9x4.9mm_P1.27mm,53,-79.25,270,top
+U2,LM78M05_TO252,TO-252-2,63,-83.5,0,top