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This commit is contained in:
Nadezhda-n 2022-12-10 23:51:53 +03:00
parent a3c6754e23
commit 04f7f36145
1 changed files with 26 additions and 26 deletions
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52
modules/knock/0.2/knock.kicad_mod
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@ -1,53 +1,53 @@
(footprint "knock" (version 20211014) (generator pcbnew) (footprint "knock" (version 20211014) (generator pcbnew)
(layer "F.Cu") (layer "F.Cu")
(tedit 0) (tedit 0)
(fp_text reference "Designator4" (at -0.1998 -3.9382 unlocked) (layer "F.SilkS") (fp_text reference "Designator4" (at -0.0998 -4.0382 unlocked) (layer "F.SilkS")
(effects (font (size 0.6 0.6) (thickness 0.254)) (justify left bottom)) (effects (font (size 0.6 0.6) (thickness 0.254)) (justify left bottom))
(tstamp 57e1ebbb-bf71-4a6a-806c-5c416640b476) (tstamp 57e1ebbb-bf71-4a6a-806c-5c416640b476)
) )
(fp_text value "Comment" (at 0.82 0.86 unlocked) (layer "F.SilkS") hide (fp_text value "Comment" (at 0.92 0.76 unlocked) (layer "F.SilkS") hide
(effects (font (size 0.6 0.6) (thickness 0.254)) (justify left bottom)) (effects (font (size 0.6 0.6) (thickness 0.254)) (justify left bottom))
(tstamp bcc0c495-50f6-49ac-8a1d-d9d476c22024) (tstamp bcc0c495-50f6-49ac-8a1d-d9d476c22024)
) )
(fp_line (start 0 0) (end 9.1 0) (layer "B.SilkS") (width 0.2) (tstamp 10b70e57-76b6-4415-b6af-30b3c6b5e53e)) (fp_line (start 0.1 -0.1) (end 9.2 -0.1) (layer "B.SilkS") (width 0.2) (tstamp 10b70e57-76b6-4415-b6af-30b3c6b5e53e))
(fp_line (start 0 -3.100003) (end 9.1 -3.100003) (layer "B.SilkS") (width 0.2) (tstamp 233b9670-7877-4ac2-a2d1-7e133e2b2745)) (fp_line (start 0.1 -3.200003) (end 9.2 -3.200003) (layer "B.SilkS") (width 0.2) (tstamp 233b9670-7877-4ac2-a2d1-7e133e2b2745))
(fp_line (start 0 0) (end 0 -1.000002) (layer "B.SilkS") (width 0.2) (tstamp 71c6ed0d-b5d5-4ff9-a781-c23fd3b11dcb)) (fp_line (start 0.1 -0.1) (end 0.1 -1.100002) (layer "B.SilkS") (width 0.2) (tstamp 71c6ed0d-b5d5-4ff9-a781-c23fd3b11dcb))
(fp_line (start 0 0) (end 0 -1.000002) (layer "F.SilkS") (width 0.2) (tstamp 1a2ce619-0aa1-483e-bed0-469be2c15323)) (fp_line (start 0.1 -0.1) (end 0.1 -1.100002) (layer "F.SilkS") (width 0.2) (tstamp 1a2ce619-0aa1-483e-bed0-469be2c15323))
(fp_line (start 0 0) (end 9.1 0) (layer "F.SilkS") (width 0.2) (tstamp 1eb68874-c93a-49cb-af88-a1d860c899fc)) (fp_line (start 0.1 -0.1) (end 9.2 -0.1) (layer "F.SilkS") (width 0.2) (tstamp 1eb68874-c93a-49cb-af88-a1d860c899fc))
(fp_line (start 0 -3.100003) (end 9.1 -3.100003) (layer "F.SilkS") (width 0.2) (tstamp c988c67c-3319-4eca-b2ff-8f91a556790f)) (fp_line (start 0.1 -3.200003) (end 9.2 -3.200003) (layer "F.SilkS") (width 0.2) (tstamp c988c67c-3319-4eca-b2ff-8f91a556790f))
(pad "E1" thru_hole circle (at 8.9 -2.5 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) (pad "E1" thru_hole circle (at 9 -2.6 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp f27224ff-15fe-4455-b342-08f92639682d)) (solder_paste_margin -50) (tstamp f27224ff-15fe-4455-b342-08f92639682d))
(pad "E2" smd oval (at 4.55 0 270) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask") (pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 07da61f7-ec5e-4e06-9f8d-18bf698462d5)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 07da61f7-ec5e-4e06-9f8d-18bf698462d5))
(pad "E2" smd oval (at 0 -0.525 180) (size 0.2 1.225) (layers "In1.Cu") (pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 1a5fd7de-d643-4bce-b0e2-d9faf87c973a)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 1a5fd7de-d643-4bce-b0e2-d9faf87c973a))
(pad "E2" smd oval (at 4.55 -3.1 90) (size 0.2 9.3) (layers "In2.Cu") (pad "E2" smd oval (at 4.55 -3.1 90) (size 0.2 9.3) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 2470fcfb-973a-4fec-a7e9-690765a69cdd)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 2470fcfb-973a-4fec-a7e9-690765a69cdd))
(pad "E2" smd oval (at 0 -0.525 180) (size 0.2 1.225) (layers "F.Cu" "F.Paste" "F.Mask") (pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 41073975-5da9-485c-82ce-614d7a6f26a3)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 41073975-5da9-485c-82ce-614d7a6f26a3))
(pad "E2" smd oval (at 0 -0.525 180) (size 0.2 1.225) (layers "In2.Cu") (pad "E2" smd oval (at 0 -0.525 180) (size 0.2 1.225) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 62183a89-42dd-4da5-9394-7fc246c9f3a1)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp 62183a89-42dd-4da5-9394-7fc246c9f3a1))
(pad "E2" thru_hole circle (at 8.9 -1.55 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) (pad "E2" thru_hole circle (at 9 -1.65 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 852c95bd-1fd0-44d8-869f-06e5d704be25)) (solder_paste_margin -50) (tstamp 852c95bd-1fd0-44d8-869f-06e5d704be25))
(pad "E2" smd oval (at 4.55 0 270) (size 0.2 9.3) (layers "In2.Cu") (pad "E2" smd oval (at 4.55 0 270) (size 0.2 9.3) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp b10d22dc-57f4-4677-a90c-e733fd7cbe5e)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp b10d22dc-57f4-4677-a90c-e733fd7cbe5e))
(pad "E2" smd oval (at 0 -0.525 180) (size 0.2 1.225) (layers "B.Cu" "B.Paste" "B.Mask") (pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp b8b2432a-9cd1-4541-be5a-470c2e639315)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp b8b2432a-9cd1-4541-be5a-470c2e639315))
(pad "E2" smd oval (at 4.55 0 270) (size 0.2 9.3) (layers "In1.Cu") (pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp bccd09db-6a9f-4c5f-bf15-f656bee8dcc4)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp bccd09db-6a9f-4c5f-bf15-f656bee8dcc4))
(pad "E2" smd oval (at 4.55 -3.1 90) (size 0.2 9.3) (layers "In1.Cu") (pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp dad00cd9-cb9d-4016-a062-e9af56e70e34)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp dad00cd9-cb9d-4016-a062-e9af56e70e34))
(pad "E2" smd oval (at 4.55 -3.1 90) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask") (pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp eee72f69-d854-4b55-9b81-df798270a654)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp eee72f69-d854-4b55-9b81-df798270a654))
(pad "E2" smd oval (at 4.55 -3.1 90) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask") (pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp fa57e211-030c-403d-b255-046971181142)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp fa57e211-030c-403d-b255-046971181142))
(pad "E2" smd oval (at 4.55 0 270) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask") (pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp fe332e46-f490-486d-97d9-1a646b0a6a43)) (solder_mask_margin -1) (solder_paste_margin -50) (tstamp fe332e46-f490-486d-97d9-1a646b0a6a43))
(pad "E3" thru_hole circle (at 8.9 -0.600002 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) (pad "E3" thru_hole circle (at 9 -0.700002 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 0009356c-562a-4ac7-9a87-db0026153a20)) (solder_paste_margin -50) (tstamp 0009356c-562a-4ac7-9a87-db0026153a20))
(pad "W1" thru_hole circle (at 0.2 -1.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) (pad "W1" thru_hole circle (at 0.3 -1.7) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 9a2933df-b02d-4a67-aa9b-ad4baa7b3d86)) (solder_paste_margin -50) (tstamp 9a2933df-b02d-4a67-aa9b-ad4baa7b3d86))
(pad "W2" thru_hole circle (at 0.2 -2.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask) (pad "W2" thru_hole circle (at 0.3 -2.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp b835d54d-4930-4397-88b6-3fe867514a47)) (solder_paste_margin -50) (tstamp b835d54d-4930-4397-88b6-3fe867514a47))
(zone (net 0) (net_name "") (layers *.Cu) (tstamp ded0861b-4ac0-4f71-944b-0cd41db4b141) (hatch edge 0.508) (zone (net 0) (net_name "") (layers *.Cu) (tstamp ded0861b-4ac0-4f71-944b-0cd41db4b141) (hatch edge 0.508)
(connect_pads (clearance 0)) (connect_pads (clearance 0))
@ -56,10 +56,10 @@
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508)) (fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
(polygon (polygon
(pts (pts
(xy 9.1 0) (xy 9.2 -0.1)
(xy 0 0) (xy 0.1 -0.1)
(xy 0 -3.100003) (xy 0.1 -3.200003)
(xy 9.1 -3.100003) (xy 9.2 -3.200003)
) )
) )
) )