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Knock 0.2 direct connect

This commit is contained in:
Vladimir Vinogradov 2022-12-11 22:51:59 +03:00
parent 2ae98cba79
commit 833c8b3057
1 changed files with 18 additions and 17 deletions
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35
modules/knock/0.2/knock.kicad_mod
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@ -1,6 +1,7 @@
(footprint "knock" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 0)
(zone_connect 2)
(fp_text reference "Designator4" (at -0.0998 -4.0382 unlocked) (layer "F.SilkS")
(effects (font (size 0.6 0.6) (thickness 0.254)) (justify left bottom))
(tstamp 57e1ebbb-bf71-4a6a-806c-5c416640b476)
@ -16,39 +17,39 @@
(fp_line (start 0.1 -0.1) (end 9.2 -0.1) (layer "F.SilkS") (width 0.2) (tstamp 1eb68874-c93a-49cb-af88-a1d860c899fc))
(fp_line (start 0.1 -3.200003) (end 9.2 -3.200003) (layer "F.SilkS") (width 0.2) (tstamp c988c67c-3319-4eca-b2ff-8f91a556790f))
(pad "E1" thru_hole circle (at 9 -2.6 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp f27224ff-15fe-4455-b342-08f92639682d))
(solder_paste_margin -50) (zone_connect 2) (tstamp f27224ff-15fe-4455-b342-08f92639682d))
(pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 07da61f7-ec5e-4e06-9f8d-18bf698462d5))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 07da61f7-ec5e-4e06-9f8d-18bf698462d5))
(pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 1a5fd7de-d643-4bce-b0e2-d9faf87c973a))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 1a5fd7de-d643-4bce-b0e2-d9faf87c973a))
(pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 2470fcfb-973a-4fec-a7e9-690765a69cdd))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 2470fcfb-973a-4fec-a7e9-690765a69cdd))
(pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 41073975-5da9-485c-82ce-614d7a6f26a3))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 41073975-5da9-485c-82ce-614d7a6f26a3))
(pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp 62183a89-42dd-4da5-9394-7fc246c9f3a1))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp 62183a89-42dd-4da5-9394-7fc246c9f3a1))
(pad "E2" thru_hole circle (at 9 -1.65 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 852c95bd-1fd0-44d8-869f-06e5d704be25))
(solder_paste_margin -50) (zone_connect 2) (tstamp 852c95bd-1fd0-44d8-869f-06e5d704be25))
(pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "In2.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp b10d22dc-57f4-4677-a90c-e733fd7cbe5e))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp b10d22dc-57f4-4677-a90c-e733fd7cbe5e))
(pad "E2" smd oval (at 0.1 -0.625 180) (size 0.2 1.225) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp b8b2432a-9cd1-4541-be5a-470c2e639315))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp b8b2432a-9cd1-4541-be5a-470c2e639315))
(pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp bccd09db-6a9f-4c5f-bf15-f656bee8dcc4))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp bccd09db-6a9f-4c5f-bf15-f656bee8dcc4))
(pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "In1.Cu")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp dad00cd9-cb9d-4016-a062-e9af56e70e34))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp dad00cd9-cb9d-4016-a062-e9af56e70e34))
(pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp eee72f69-d854-4b55-9b81-df798270a654))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp eee72f69-d854-4b55-9b81-df798270a654))
(pad "E2" smd oval (at 4.65 -3.2 90) (size 0.2 9.3) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp fa57e211-030c-403d-b255-046971181142))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp fa57e211-030c-403d-b255-046971181142))
(pad "E2" smd oval (at 4.65 -0.1 270) (size 0.2 9.3) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin -1) (solder_paste_margin -50) (tstamp fe332e46-f490-486d-97d9-1a646b0a6a43))
(solder_mask_margin -1) (solder_paste_margin -50) (zone_connect 2) (tstamp fe332e46-f490-486d-97d9-1a646b0a6a43))
(pad "E3" thru_hole circle (at 9 -0.700002 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 0009356c-562a-4ac7-9a87-db0026153a20))
(solder_paste_margin -50) (zone_connect 2) (tstamp 0009356c-562a-4ac7-9a87-db0026153a20))
(pad "W1" thru_hole circle (at 0.3 -1.7) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp 9a2933df-b02d-4a67-aa9b-ad4baa7b3d86))
(solder_paste_margin -50) (zone_connect 2) (tstamp 9a2933df-b02d-4a67-aa9b-ad4baa7b3d86))
(pad "W2" thru_hole circle (at 0.3 -2.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_paste_margin -50) (tstamp b835d54d-4930-4397-88b6-3fe867514a47))
(solder_paste_margin -50) (zone_connect 2) (tstamp b835d54d-4930-4397-88b6-3fe867514a47))
(zone (net 0) (net_name "") (layers *.Cu) (tstamp ded0861b-4ac0-4f71-944b-0cd41db4b141) (hatch edge 0.508)
(connect_pads (clearance 0))
(min_thickness 0.254)